• Journal of the Korean Society for Heat Treatment
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• v.18 no.4
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• pp.229-234
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• 2005

Effect of incident ion beam energy on microstructure and adhesion behavior of TiN thin films were studied. Without ion beam assist, TiN film showed (111) growth mode which was thought to have the lowest deformation energy. As the ion beam assist energy increased, TiN film growth mode was changed from (111) to (200) mode. On the Si(100) substrate the critical incident energy for growth mode change was 100 eV/atom, however the critical assist energy was 121 eV/atom on the STD61 substrate. Grain size of TiN films increased with the assist ion beam energy. Finally, adhesion strength of TiN films bombarded above the critical ion assist energy showed 4~5 times higher values than that with lower bombard ion energy.

• Journal of Adhesion and Interface
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• v.4 no.2
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• pp.1-9
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• 2003

Epoxy-amine liquid prepolymers are extensively applied onto metallic substrates and cured to obtain painted materials or bonded joint structures. Overall performances of such systems depend on the created interphase between the organic layer and the substrate. When epoxy-amine liquid mixtures are applied onto more or less hydrated metallic oxide layer, concomitant amine chemical sorption and hydroxide dissolution appear lending to the chelate formation. As soon as the chelate concentration is higher than the solubility product, these species crystallize as sharp needles. Moreover, intrinsic and thermal residual stresses are developed within painted or bonded systems. When residual stresses are higher than the organic layer/substrate adhesion, buckling, blistering, debonding may occur leading to a catastrophic drop of system performances. Practical adhesion can be evaluated with either ultimate parameters (Fmax or Dmax) or the critical strain energy release rate, using the three point flexure test (ISO 14679-1997). We observe that, for the same system, the ultimate load decreases while residual stresses increase when the liquid/solid time increases. Ultimate loads and residual stresses depend on the metallic surface treatment. For these systems, the critical strain energy release rate which takes into account the residual stress profile and the Young's modulus gradient remains quite constant whatever the metallic surface treatment was. These variations will be discussed and correlate to the formation mechanisms of the interphase.

• Polymer(Korea)
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• v.36 no.2
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• pp.119-123
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• 2012

Adhesion strength of polyurethane adhesive for laminated metal plate was investigated. Also, the effect of laminating conditions on the adhesion strength was understood by measuring peel strength as a function of adhesion temperature and time. The amount of isocyanate appearing due to the unblocking of oxime in polyurethane adhesive affected the strength of adhesion with hydroxyl on the metal plate or aluminum foil and it was controlled by adhesion temperature and time. However, the excess of temperature and time in laminating process caused the lowering of adhesion strength because of the decrease of solvent content as well as thermal degradation of the adhesive.

• Journal of the Korea Institute of Military Science and Technology
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• v.7 no.2 s.17
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• pp.100-108
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• 2004

Nitramine-polymer composites suffer from a problem known as dewetting. Dewetting adversely affects the performance and the sensitivity characteristics of an explosive composition. Voids, which are generated between explosive particles and binder on dewetting, act as initiation sites. For a PBXs as well as propellants, where good adhesion and mechanical properties are of great importance, dewetting therefore must be prevented by strong adhesion between the filler and the binder. The surface energy of materials is measured by Wilhelmy plate and wicking method. The interfacial energy between the filler and the binder is calculated from the disperse phase and the polar phase of surface energy. Time dependent compressive properties of composite explosives have been determined by stress-strain curves obtained at different strain rates and temperatures. The interfacial state of the PBX was observed through SEM. It was found from the result that the interface between the explosive and the binder becomes better adhesion with decreasing interfacial tension and increasing work of adhesion. The result clearly shows that the castable PBX has good adhesion more than the pressable PBX.

• Korean Journal of Materials Research
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• v.15 no.11
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• pp.745-750
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• 2005

Polycarbonates are widely used as housing materials of electronic handsets. Since the polycarbonate is electrically insulating, there should be a conducting layer on the polycarbonate for EMI shielding. In this study, we sputter deposited Cu films on the polycarbonate substrates for EMI shielding. Plasma treatments of polycarbonates were used to increase the adhesion strength of the Cu film/polycarbonate interface. The surface energy of the polycarbonate was greatly increased from $30mJ/m^2 \;to\; 65mJ/m^2$ by a 200 W $O_2$ plasma treatment for 10s. It is thought that this is because of the ion bombardment. The adhesion strength of the sputter deposited Cu film to the polycarbonate was quantitatively measured by a 4 point bending tester. A moderate plasma surface treatment of the polycarbonate increased the Cu film/polycarbonate adhesion strength by $30\%$. The EMI shielding efficiency of the sputter deposited $10{\mu}m$ Cu lam on the polycarbonate showed 90dB in the range of 100MHz to 1000MHz.

• Journal of the Microelectronics and Packaging Society
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• v.26 no.4
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• pp.101-105
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• 2019

The adhesion reliability of the epoxy molding compound (EMC) and the printed circuit board (PCB) interface is critical to the quality and lifetime of the chip package since the EMC protects PCB from the external environment during the manufacturing, storage, and shipping processes. It is necessary to measure adhesion energy accurately to ensure product reliability by optimizing the manufacturing process during the development phase. This research deals with the measurement of EMC/PCB interfacial adhesion energy of chip package that has warpage induced by the coefficient of thermal expansion (CTE) mismatch. The double cantilever beam (DCB) test was conducted to measure adhesion energy, and the spring back force of specimens with warpage was compensated to calculate adhesion energy since the DCB test requires flat substrates. The result was verified by comparing the adhesion energy of flat chip packages come from the same manufacturing process.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.4
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• pp.244-248
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• 2018

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and $O_2gas$. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

• Korean Journal of Materials Research
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• v.14 no.3
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• pp.203-210
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• 2004

Effects of various pretreatments on the adhesion of copper-coated polymer films were investigated. Copper-coated polymer films were prepared by an electron cyclotron resonance-metal organic chemical vapor deposition (ECR-MOCVD) coupled with a DC bias system at room temperature. PET(polyethylene terephthalate) film was employed as a substrate material and it was pretreated by industrially feasible methods such as chromic acid, sand-blasting, oxygen plasma and ion-implantation treatment. Surface characterization of the copper-coated polymer film was carried out by AFM(Atomic Force Microscopy) and FESEM(Field Emission Scanning Electron Microscopy). Surface energy was calculated by based on the value of the contact angle measured. The adhesion of copper/PET films was determined by a pull-off test according to ASTM D-5179. It was found that suitable pretreatment of the PET substrate was required for obtaining good adhesion property between copper films and the substrate. In this study the highest adhesion was observed in sand-blasting, and then followed by those of acid and oxygen plasma treatment. However, the effect of surface energy was insignificant in our experimental range. This is probably due to compensating the difference in surface energy from various pretreatments by exposing substrate to ECR plasma for 5 min or longer at the early stage of the copper deposition. Therefore, it can be concluded that surface roughness of the polymer substrate plays an important role to determine the adhesion of copper-coated polymer for the deposition of copper by ECR-MOCVD.

• Journal of the Microelectronics and Packaging Society
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• v.25 no.2
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• pp.41-48
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• 2018

The quantitative interfacial adhesion energy measurement method of copper redistribution layer and WPR dielectric interface were investigated using $90^{\circ}$ peel test, 4-point bending test, double cantilever beam (DCB) measurement for FOWLP Applications. Measured interfacial adhesion energy values of all three methods were higher than $5J/m^2$, which is considered as a minimum criterion for reliable Cu/low-k integration with CMP processes without delamination. Measured energy values increase with increasing phase angle, that is, in order of DCB, 4-point bending test, and $90^{\circ}$ peel test due to increasing roughness-related shielding and plastic energy dissipation effects, which match well interfacial fracture mechanics theory. Considering adhesion specimen preparation process, phase angle, measurement accuracy and bonding energy levels, both DCB and 4-point bending test methods are recommended for quantitative adhesion energy measurement of RDL interface depending on the real application situations.

• Journal of the Korean Society of Clothing and Textiles
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• v.19 no.5
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• pp.765-773
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• 1995

Effect of interfacial electrical conditions such as, the f potential of PET fiber and u-Fe203 particles, the stability parameter and potential energy of interaction on adhesion of a-Fe903 particles to PET fabric and their removal from the fabric, were investigated as functions of pH, electrolyte and ionic strength. The stability parameter, potential energy of interaction between a-Fe2O3 particles and PET fabric were calculated by using the heterocoagulation theory for a sphere-plate model The adhesion of a-Fe2O3 particles to PET fabric and their removal from PET fabric were carried out by using water bath shaker and Terg-O-Tometer under various solution conditions. The adhesion of a-Fe2O3 particles to the PET fabric and the removal of a-Fe2O3 particles from the PET fabric were biphasic and were maximum and minimum at pH 7~8, respectively. With high pH and polyanion electrolytes in solution, the adhesion of a-Fe2O3 particles to the PET fabric was low but effects of electrolytes on the removal of a-Fe2O3 particles from the PET fabric was small. The adhesion of a-Fe2O3 particles to the PET fabric and the removal of a-Fe2O3 Particles from the PET fabric were biphasic, and were lowest and highest at the ionic strength 1$\times$10-3, respectively. The adhesion of a-Fe2O3 particles to PET fabric was well related with the interfacial electrical conditions; it was negatively correlated with the f potentials of a-Fe2O3 Particles of its absolute value, the stability parameter and the maximum of total potential energy, while, the adhesion was not related with the t potentials of PET fiber itself. Therefore, the primary factor determining the adhesion of a-Fe203 particles to PET fabric may be the stability of dispersed particles caused by the electrical repulsion of particles. The removal of a-Fe203 particles from PET fabric was not related to such interfacial electrical conditions as the t potentials of PET fiber, the stability parameter and the maximum of total potential energy but removal was related to t potential of a-Fe203 particles.