• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 The IMAPS-Korea Workshop 2001 Emerging Technology on packaging
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• pp.100-103
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• 2001

본 연구에서는 무전해도금으로 증착된 구리박막의 열적 및 접착특성에 관하여 고찰하였다. Si 기판에 MOCVD 방법으로 TaN 확산방지막을 증착한 후, 무전해 도금으로 구리박막을 증착하여 Cu/TaN/Si 다층구조를 제조공정하였다. 그리고, Ar 분위기에서 열처리시켰으며, 열처리온도에 따른 비저항 변화를 고찰함으로서 Cu/TaN/Si 계의 열적 특성을 분석하였다. 무전해도금 구리박막의 접착특성은 스크래치 테스트에 의해 평가하였으며, 열적 증착방법과 스퍼터 방법으로 증착된 구리 박막과 비교하였다. 스크래치 테스트 결과, 무전해도금 구리 박막의 접착력이 열적 증착과 스퍼터 방법으로 증착된 구리 박막보다 더 우수하였다.

• 한국재료학회지
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• 제18권9호
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• pp.486-491
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• 2008

The effect of annealing treatment conditions on the interfacial adhesion energy between electrolessplated Ni film and polyimide substrate was evaluated using a $180^{\circ}$ peel test. Measured peel strength values are $26.9{\pm}0.8,\;22.4{\pm}0.8,\;21.9{\pm}1.5,\;23.1{\pm}1.3,\;16.1{\pm}2.0\;and\;14.3{\pm}1.3g/mm$ for annealing treatment times during 0, 1, 3, 5, 10, and 20 hours, respectively, at $200^{\circ}C$ in ambient environment. XPS and AES analysis results on peeled surfaces clearly reveal that the peeling occurs cohesively inside polyimide. This implies a degradation of polyimide structure due to oxygen diffusion through interface between Ni and polyimide, which is also closely related to the decrease in the interfacial adhesion energy due to thermal treatment in ambient conditions.

• 한국재료학회지
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• 제17권4호
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• pp.215-221
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• 2007

The effect of $CF_4$ plasma treatment condition on the interfacial adhesion energy of inkjet printed Ag/polyimide system is evaluated from $180^{\circ}$ peel test by calculating the plastic deformation energy of peeled metal films. Interfacial fracture energy between Ag and as-received polyimide was 5.5 g/mm. $CF_4$ plasma treatment on the polyimide surface enhanced the interfacial fracture energy up to 17.6 g/mm. This is caused by the increase in the surface roughness as well as the change in functional group of the polyimide film due to $CF_4$ plasma treatment on the polyimide surface. Therefore, both the mechanical interlocking effect and the chemical bonding effect are responsible for interfacial adhesion improvement in ink jet printed Ag/polyimide systems.

• 한국전기전자재료학회논문지
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• 제31권4호
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• pp.244-248
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• 2018

We propose a method for improving the reliability of a solar cell by applying a fluorinated surface coating to protect the cell from the outdoor environment using an atmospheric pressure plasma (APP) treatment. An APP source is operated by radio frequency (RF) power, Ar gas, and $O_2gas$. APP treatment can remove organic contaminants from the surface and improve other surface properties such as the surface free energy. We determined the optimal APP parameters to maximize the surface free energy by using the dyne pen test. Then we used the scratch test in order to confirm the correlation between the APP parameters and the surface properties by measuring the surface free energy and adhesive characteristics of the coating. Consequently, an increase in the surface free energy of the cover glass caused an improvement in the adhesion between the coating layer and the cover glass. After treatment, adhesion between the coating and cover glass was improved by 35%.

• Journal of the Korean Wood Science and Technology
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• 제25권3호
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• pp.16-23
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• 1997

This study was carried out to discuss feasibility of high density polyethylene(HDPE) as a new substitute for the conventional adhesives in plywood manufacture. Plywood was composed of radiata pine(Pinus radiata) and Malas(Homallium feotidium) veneers and bonded by HDPE. Adhesion characteristics and anatomical scanning has been examined through tensile-shear strength test and scanning electron microscopy(SEM). The results are as follows; 1. Optimum loading quantity was 15g/$(30.3{\times}30.3)cm^2$, and tensile-shear strength increased with the increase of loading quantity. 2. Even at the hot pressing time of 1 minute, tensile-shear strength met the value of KS(over the 7.5kgf/$cm^2$), and tensile-shear strength increased with the increase of hot pressing time. 3. Plywood composed of veneer at moisture content of 19.6% showed similar tensile-shear strength to that at air conditioned moisture content of 11.4%. 4. Under the same condition of hot pressing time, tensile-shear strength of plywood bonded by HDPE met the KS value of boil and wet test and proved the same group as phenol formaldehyde adhesive. 5. HDPE films showed mechanical adhesion through penetration into the lathe check and ray of veneer.

• 한국재료학회지
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• 제15권7호
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• pp.458-464
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer surfaces by ion beam irradiation and rf plasma is commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $N_2^+$ ion beam irradiation conditions for pretreatment. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the 90° peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $N_2^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국재료학회지
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• 제15권1호
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• pp.42-46
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• 2005

In microelectronics packaging, the reliability of the metal/polymer interfaces is an important issue because the adhesion strength between dissimilar materials is often inherently poor. The modification of polymer sufaces by ion beam irradiation and rf plasma are commonly used to enhance the adhesion strength of the interface. T-peel strengths were measured using a Cu/polyimide system under varying $Ar^+$ ion beam irradiation pretreatment conditions. The measured T-peel strength showed reversed camel back shape regarding the fixed metal-layer thickness, which was quite different from the results of the $90^{\circ}$ peel test. The elementary analysis suggests that the variation of the T-peel strength is a combined outcome of the plastic bending work of the metal and polymer strips. The results indicate that the peel strength increases with $Ar^+$ ion beam irradiation energy at the fixed metal-layer thickness.

• 한국산학기술학회논문지
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• 제5권5호
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• pp.458-461
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• 2004

본 논문에서는 Si wafer와 Cu사이의 밀착력을 증가시키기 위해 Si wafer전처리 후 plasma와 SAMs처리 방법에 의한 Cu도금의 형성에 관한 방법을 설명하였다. Si wafer를 Piranha solution과 $0.5{\%}$ HF처리 후 유기박막인 SAMs과 plasma를 이용하는 방법으로 wafer와 Cu층 사이의 밀착력을 증가시켰다. 도금층의 밀착력은 scratch test 로 측정하였으며 , AFM을 이용해 시편에 형성된 패턴의 형태를 관찰하고 SEM과 EDS를 이용해 시편의 조직을 관찰하였다. 그 결과 Si wafer를 $O_{2}, He, SAMs$를 혼합처리 했을 때 밀착성이 가장 우수하였다.

• Corrosion Science and Technology
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• 제10권3호
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• pp.80-86
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• 2011

Welding was widely used in shipbuilding industries as a joining method. In present study, the effects of welding fume contaminated on steel surface on corrosion protection were examined by water ballast simulation test and condensation chamber test. Pull-off adhesion test, blistering test and cathodic disbondment test were carried out to evaluate the effects of residual welding fume. Consequently, it was clearly indicated that the residual welding fume didn't affect the corrosion protection of epoxy coated on steel when surface was treated by light sweep blasting to heavy sweep blasting which was applied in this study.

• 한국건축시공학회:학술대회논문집
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• 한국건축시공학회 2018년도 추계 학술논문 발표대회
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• pp.173-174
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• 2018

In this study, the objective of this study was to evaluate the adhesive characteristics of existing self-adhesive rubber asphalt sheet, butyl sheet and acrylate sheet in a low temperature environment through Tack Rolling Ball Test to obtain basic data on acrylate. As a result of this experiment, in the case of the self-molding rubber asphalt sheet and the butyl rubber sheet, the compound of the sheet was frozen in the low temperature environment and the iron bead was separated. On the other hand, the acrylate sheet did not freeze the acrylate even at 0 ℃, It is confirmed that the measured value is shown by Ball Test.