• Title, Summary, Keyword: Adhesion Properties

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A Study on Adhesion of Mechanical Properties of Rubber by MgCl2 (MgCl2에 의한 고무의 접착특성 및 기계적 강도 변화)

  • Kim, Seong-Hye;Jeon, Jun-Ha;Um, Gi-Yong
    • Journal of Adhesion and Interface
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    • v.18 no.2
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    • pp.53-58
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    • 2017
  • In this study, to overcome a complicated shoe adhesion process such as buffing, pre-treatment by primer in the rubber component of the shoe, we studied adhesion and mechanical properties with rubber compound added $MgCl_2$. We determined adhesion properties of $MgCl_2$ content. Especially, the rubber containing $MgCl_2$ exhibited good adhesion properties to water-based adhesion. Since $MgCl_2$ is a water-soluble salt, it was judged that this phenomenon occurred. The results are confirmed by contact angle and surface morphology measurement. In addition, in the case of rubber compound added $MgCl_2$, the crosslinking efficiency was increased and the NBS resistance was increased.

Study on the Adhesive Properties of Polyesters Reinforcing Materials

  • Krump, H.;Hudec, I.;Cernak, M.;Janypka, P.
    • Elastomers and Composites
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    • v.37 no.3
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    • pp.192-194
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    • 2002
  • Polyester cord yarns have been treated in an atmospheric-pressure nitrogen plasma reactor in order to enhance their adhesion to rubber. A thin layer or the plasma was generated in the close vicinity of the yam surface using various types or surface discharge. To assess the effect of the plasma treatment on fiber surface properties, the cord thread/rubber matrix adhesion values measured using the untreated and threads cord threads were compared. The static and dynamic adhesion of the cord thread to rubber was characterized by using the standard Henley test. The dynamic adhesion values for the reference and plasma treated fiber were $7,3{\pm}1,2\;N$ and $83,5{\pm}3,5\;N$. The surface properties were investigated by scanning electron microscopy, infrared spectroscopy and electron spin resonance spectroscopy. It is concluded that both polar group interactions and increased surface area of the fibers are responsible for the improved adhesive strength.

Fundamental properties of polymer composite materials for concrete repair (콘크리트 보수용 폴리머 복합재료의 기초적 성질)

  • 지경용;연규석;이윤수;전철수
    • Proceedings of the Korea Concrete Institute Conference
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    • pp.319-322
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    • 1999
  • The adhesion properties of polymer cement mortars for cement concrete repair were evaluated with respect to polymer-cement ratios and the surface conditions of cement concrete substrate. Styrene-butadiene rubber (SBR) was used as an additive for polymer cement mortars. The adhesion strength of cement mortar was smaller than that of polymer cement mortar. The adhesion strengths to the dry surfaces of substrate were larger than those to the wet surfaces, indicating that the dryness of substrate increased the adhesion strength in repairing concrete structures.

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Enhanced adhesion properties of conductive super-hydrophobic surfaces by using zirco-aluminate coupling agent

  • Park, Myung-Hyun;Ha, Ji-Hwan;Song, Hyeonjun;Bae, Joonwon;Park, Sung-Hoon
    • Journal of Industrial and Engineering Chemistry
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    • v.68
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    • pp.387-392
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    • 2018
  • Various technical approaches and concepts have been proposed to develop conductive super-hydrophobic (SH) surfaces. However, most of these approaches are not usable in practical applications because of insufficient adhesion and cost issues. Additionally, durability and uniformity issues are still in need of improvement. The goal of this research is to produce a large-area conductive SH surface with improved adhesion performance and uniformity. To this end, carbon nanotubes (CNT) with a high aspect ratio and elastomeric polymer were utilized as a conductive filler and matrix, respectively, to form a coating layer. Additionally, nanoscale silica particles were utilized for stable implementation of the conductive SH surface. To improve the adhesion properties between the SH coating layer and substrate, pretreatment of the substrate was conducted by utilizing both wet and dry etching processes to create specific organic functional groups on the substrate. Following pretreatment of the surface, a zirco-aluminate coupling agent was utilized to enhance adhesion properties between the substrate and the SH coating layer. Raman spectroscopy revealed that adhesion was greatly improved by the formation of a chemical bond between the substrate and the SH coating layer at an optimal coupling agent concentration. The developed conductive SH coating attained a high electromagnetic interference (EMI) shielding effectiveness, which is advantageous in self-cleaning EMI shielding applications.

Physico-mechanical Properties and Formaldehyde/TVOC Emission of Particleboards with Volcanic Pozzolan

  • Kim, Sumin;An, Jae-Yoon;Kim, Jin-A;Kim, Hee-Soo;Kim, Hyun-Joong;Kim, Hak-Gyeom
    • Journal of the Korean Wood Science and Technology
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    • v.35 no.2
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    • pp.39-50
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    • 2007
  • The purpose of this study was to investigate the physico-mechanical properties and characteristics on reduction of formaldehyde and total volatile organic compound (TVOC) emission from particleboard (PB) with added volcanic pozzolan. Pozzolan was added as a scavenger at the level of 1, 3, 5, and 10 wt.% of urea formaldehyde (UF) resin for PB manufacture. The moisture content, density, thickness swelling, water absorption and physical properties of PBs were examined. Three-point bending strength and internal bond strength were determined using a universal testing machine. Formaldehyde and TVOC were determined by desiccator and 20L small chamber methods. With increasing pozzolan content the physical and mechanical properties of the PBs were not significantly changed, but formaldehyde and TVOC emissions were decreased. Because pozzolan has a rough and irregular surface with porous form, it can be used as a scavenger for PBs at a content up to 10 wt.% without any detrimental effect on the physical and mechanical properties.

Fabrication and application of post surgical anti-adhesion barrier using bio-compatible materials (생체 적합성 재료를 이용한 수술후 유착 방지막의 제작과 응용)

  • Park S.H.;Kim H.C.;Yang D.Y.;Kim T.K.;Park T.K.
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • pp.203-204
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    • 2006
  • Studies on some biodegradable polymers and other materials such as hydrogels have shown the promising potential for a variety of surgical applications. Postoperative adhesion caused by the natural consequence of surgical wound healing results in problems of the repeated surgery. Recently, scientists have developed absorbable anti-adhesion barriers that can protect a tissue from adhesion in case they are in use; however, they are dissolved when no longer needed. Although these approaches have been attempted to fulfill the criteria for adhesion prevention, none can perfectly prevent adhesions in all situations. Overall of this work, a new method to fabricate an anti-adhesion membrane using biodegradable polymer and hydrogel has been developed. The ideal barrier for preventing postoperative adhesion would have the following properties; it should be (i) resorbable (ii) non-reactive (iii) easy to apply (iv) capable of being fixed in position. In order to fulfill these properties, we adopted solid freeform fabrication method combined with surface modification which includes the hydrogel coating, therefore, inner or outer structure can be controlled and the property of anti adhesion can be improved.

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PC/ASA blends having enhanced interfacial and mechanical properties

  • Kang, M.S.;Kim, C.K.;Lee, J.W.
    • Korea-Australia Rheology Journal
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    • v.18 no.1
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    • pp.1-8
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    • 2006
  • Blend of bisphenol-A polycarbonate (PC) and (acrylonitrile-styrene-acrylic rubber) terpolymer (ASA) having excellent balance in the interfacial properties and mechanical strength was developed for the automobile applications. Since interfacial adhesion between PC and styrne-acrylonitrile copolymer (SAN) matrix of ASA is not strong enough, two different types of compatibilizers, i.e, diblock copolymer composed of tetramethyl polycarbonate (TMPC) and SAN (TMPC-b-SAN) and poly(methyl methacrylate) (PMMA) were examined to improve interfacial adhesion between PC and SAN. TMPC-b-SAN was more effective than PMMA in increasing interfacial adhesion between PC and SAN matrix of ASA (or weld-line strength of PC/ASA blend). When blend composition was fixed, PC/ASA blends exhibited similar mechanical properties except impact strength and weld-line strength. Impact strength of PCI ASA blend at low temperature was influenced by rubber particle size and its morphology. PC/ASA blends containing commercially available PMMA as compatibilizer also exhibited excellent balance in mechanical properties and interfacial adhesion.

Pressure Sensitive Adhesion Performances of SIS/SBS based UV-curable Pressure Sensitive Adhesives using Thiol-ene Reaction (Thiol-ene 반응을 이용한 UV경화형 SIS/SBS계 점착제의 점착물성)

  • Lim, Dong-Hyuk;Do, Hyun-Sung;Kim, Hyun-Joong;Yoon, Goan-Hee;Bang, Jung-Suk
    • Journal of Adhesion and Interface
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    • v.6 no.3
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    • pp.19-25
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    • 2005
  • Synthetic rubber based pressure-sensitive adhesives (PSAs) usually containing SIS or SBS block copolymer, tackifier, plasticizer, and other additives are now widely used on various applications. As these PSAs are physically crosslinked and can be applied without the use of solvent, they are thermally processable and environmentally friendly. However these PSAs cannot be used in high temperature applications and in applications where solvent and chemical resistance properties are required. We developed the PSA adding UV curable system, such as thiol-ene system, to increase adhesion properties at elevated temperature. The adhesion properties such as probe tack, peel strength, shear adhesion failure temperature (SAFT) were evaluated. The probe tack test was conducted with varying probe materials and coating thickness of PSAs. Using the contact angle, the surface property of the cured PSAs was also observed.

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Interface Structure and Thin Film Adhesion (계면구조와 박막의 접착)

  • Lee, Ho-Young;Kim, Sung-Ryong
    • Journal of Adhesion and Interface
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    • v.3 no.4
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    • pp.37-43
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    • 2002
  • A number of thin-film deposition technologies have been developed. However, even a thin film whose properties are excellent may not be used as long as the adhesion strength between the thin film and the substrate is poor. For thin films, the adhesion strength is as important as the properties. In the present article, relation between interface structure and thin film adhesion, and factors affecting thin film adhesion are reviewed. Two kinds of factors, internal factors and external factors, affect thin film adhesion. Such factors as composition, structure, and reactivity of both thin film and substrate as well as surface roughness of the substrate and residual stress of the thin film belong to internal factors. And such factors as load, temperature, humidity, and corrosive environment belong to external factors. It is also reviewed that how we can control the internal factors and the external factors to enhance or keep the adhesion strength.

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Adhesion and Electrical Performance by Plasma Treatment on Semiconductive-Insulation Interface Layer of Silicone Rubber (실리콘 고무의 플라즈마 표면처리된 반도전-절연계면 처리에 따른 접착특성과 절연성능)

  • Hwang, Sun-Mook;Lee, Ki-Taek;Hong, Joo-Il;Huh, Chang-Su
    • Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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    • pp.11-14
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    • 2004
  • In this paper, the effect of adhesion properties of semiconductive-insulating interface layer of silicone rubber on electrical properties was investigated. The modifications produced on the silicone surface by oxygen plasma were accessed using ATR-FTIR, contact angle and AFM. Adhesion was obtained from T-peel tests of semiconductive layer having different treatment durations. In addition, ac breakdown test was carried out for elucidating the change of electrical property with duration of plasma treatment. From the results, the treatment in the oxygen plasma produced a noticeable increase in surface energy, which can be mainly ascribed to the the creation of O-H and C=O. It is observed that adhesion performance was determined by not surface energy but roughness level of silicone surface. It is found that ac dielectric strength was increased with improving the adhesion between the semiconductive and insulating interface.

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