• Journal of Powder Materials
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• v.4 no.3
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• pp.196-204
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• 1997

Joining of AIN ceramics to W and Cu by active-metal brazing method was tried with use of (Ag-Cu)-Ti alloy as insert-metal. Joints were produced under various conditions of temperature, holding time and Ti-content in (Ag-Cu) alloy Reaction and microstructural development in bonded interface were investigated through observation and analysis by SEM/EDS, EPMA and XRD. Joint strengths were measured by shear test. Bonded interface consists of two layers: an insert-metal layer of eutectic Ag- and Cu-rich phases and a reaction layer of TiN. Thickness of reaction layer increases with bonding temperature, holding time and Ti-content of insert-metal. It was confirmed that the growth of reaction layer is a diffusion-controlled process. Activation energy for this process was 260 KJ/mol which is lower than that for N diffusion in TiN. Maximum shear strength of 108 MPa and 72 MPa were obtained for AIN/W and AIN/Cu joints, respectively. Relationship between processing variables, joint strength and thickness of reaction layer was also explained.

• Transactions of the Korean Society of Automotive Engineers
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• v.7 no.8
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• pp.132-142
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• 1999

In this paper, a new formula for primary and secondary thrust of metal belt CVT is proposed considering variation of band tension, block compression and active arc for each of the primary and secondary pulleys. For the secondary thrust, effective friction coefficient is introduced considering the effect of flange deflection. Nondimensional primary and secondary thrust of the metal belt CVT by the new formula agree well with the experimental results except for low torque range, $0\;<\;{\lambda}\;<\;0.2$ at speed ration i = 1.0. The new formula can be used in design of the primary and secondary thrusts control system for the metal belt CVT.

• Journal of the Semiconductor & Display Technology
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• v.4 no.3 s.12
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• pp.17-22
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• 2005

LED lamp was designed by the serial-parallel integration of LED chips in metal-interconnection. The 7 $4.5{\times}4.5\;in^{2}$ masks were designed with the contact type of chrome-no mirror?dark. The white epitaxial thin film was grown by metal-organic chemical vapor deposition. The active layers were consisted with the serial order of multi-quantum wells for blue, green and red lights. The fabricated LED chip showed the electroluminescence peaked at 450, 560 and 600 nm. For the current injection of 20 mA, the operating voltage was measured to 4.25 V and the optical emission power was obtained to 0.7 $\mu$W.

• Journal of Welding and Joining
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• v.32 no.1
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• pp.40-46
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• 2014

Bonding technology and bonding mechanism of metal to ceramic including brazing, diffusion bonding, friction welding and etc were reviewed in this study. Various factors should be considered from a bonding design step to acquire a good bonding joint because of a large difference between metal and ceramic in crystal lattice, coefficient of thermal expansion and various properties. In addition, metal and ceramic bonding technologies are constantly being developed according to precise components, multi-function and application to harsh environment. However, improvement of bonding properties and bonding reliability also should be accompanied. Bonding of ceramics, such as $ZrO_2$, $Ti_3AlC_2$ and SiC, to metals like Ti-alloy, TiAl and steel were described in this paper.

• Proceedings of the Korean Powder Metallurgy Institute Conference
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• 2006.09b
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• pp.1134-1135
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• 2006

A revolutionary "Active Braze Coated Diamond" (ABCD) has been developed for bonding diamond grits firmly in the metal matrix. The molten braze is wetted and reacted with diamond to form strong chemical bond at the interface so that the diamond does not become knocked out of tools. The ABC is a nickel alloy that can form metallurgical diffusion bondswith the metal matrix. In essence, ABCD turns diamond into a metal grain so that the diamond tools can be made by conventional powder metallurgical process without being concerned about the poor bonding between matrix metal powder and the diamond as before.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.24 no.9
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• pp.1-7
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• 2010

Ceramic metal halide lamps have been widely used due to long lifetime, high luminous efficiency and good colour rendering. 35[W] ceramic metal halide lamps has very different characteristics between ignition state and steady state. The developed electronic ballast is satisfied to both ignition state and steady state characteristics by using a micro-controller. The proposed electronic ballast is consists of EMI filter, Full-wave rectifier, Active PFC, DBI(Dual Buck Inverter), Igniter and control circuit. It enables to supply both low-frequency rectangular wave voltage and current to the lamp by using DBI(Dual Bcuk Inverter) structure.

• Bulletin of the Korean Chemical Society
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• v.15 no.12
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• pp.1112-1118
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• 1994

Epoxidation of olefins has been studied using iodosylbenzene (PhIO) as the terminal oxidant and binuclear and mononuclear complexes of $Mn^{2+}$, $Co^{2+}$, and $Cu^{2+}$ as catalysts. Epoxides were the predominant products with trace amounts of allylic oxidation products, and the metal complexes were found to be effective catalysts in the epoxidation reactions. The reactivity of binuclear copper complexes was greater than that of the mononuclear copper complexes, whereas the binuclear and mononuclear complexes of $Mn^{2+}$ and $Co^{2+}$ showed similar reactivities. The nature of the ligands bound to copper did not influence the reactivity of the binuclear copper complexes so long as copper ions were held in close proximity. A metal-iodosylbenzene complex, such as suggested previously for Lewis acidic metal complex-catalyzed epoxidation by iodosylbenzene, is proposed as the active epoxidizing species. Some mechanistic aspects are discussed as well.

• Transactions of Materials Processing
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• v.3 no.2
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• pp.147-155
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• 1994

The service life of tools in metal forming technology is to a large extent limited by wear and fatigue fracture of the active elements. This presents a basic request for tool cost minimization and reduction of extensive machine down time, caused by premature tool failure. Currents developments are dominated by steps to reduce the causes of tool failure. A main problem of forming technology remains the insufficient reliability of tools due to a large and incalculable life time fluctuation. Only a systematic investigation of the failure mechanisms and operational loading of tools can lead to future improvements in tool layout, that is optimization of tool usage.

• Vacuum Magazine
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• v.5 no.2
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• pp.18-22
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• 2018

wo dimensional (2D) van der Waals (vdW) nanosheet semiconductors have recently attracted much attention from researchers because of their potentials as active device materials toward future nano-electronics and -optoelectronics. This review mainly focuses on the features and applications of state-of-the-art vdW 2D material devices which use transition metal dichalcogenides, graphene, hexagonal boron nitride (h-BN), and black phosphorous: field effect transistors (FETs), complementary metal oxide semiconductor (CMOS) inverters, Schottky diode, and PN diode. In a closing remark, important remaining issues of 2D vdW devices are also introduced as requests for future electronics and photonics applications.

• Korean Journal of Materials Research
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• v.33 no.5
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• pp.214-221
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• 2023

As a filler metal for lowering the melting point of Ag, many alloy metal candidates have emerged, such as cadmium, with zinc, manganese, nickel, and titanium as active metals. However, since cadmium is known to be harmful to the human body, Cd-free filler metals are now mainly used. Still, no study has been conducted comparing the characteristics of joints prepared with and without cadmium. In addition, studies have yet to be conducted comparing the typical characteristics of brazing filler metals with special structures, and the joint characteristics of brazing filler metals with available frames. In this study, the characteristics of junctions of silver-based intercalation metals were compared based on the type of filler metal additives, using a special structure, a filler metal sandwich structure, to protect the internal base metal. The general filler metal was compared using the structure, and the thickness of the filler metal according to the thickness was reached. A comparison of the characteristics of the junction was conducted to identify the characteristics of an intersection of silver-based brazing filler metal and the effect on joint strength. Each filler metal's collective tensile strength was measured, and the relationship between joint characteristics and tensile joint strength was explored. The junction was estimated through micro strength measurement, contact angle measurement with the base metal when the filler metal was melted, XRD image observation, composition analysis for each phase through SEM-EDS, and microstructure phase acquisition.