• Journal of Advanced Marine Engineering and Technology
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• v.33 no.1
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• pp.144-152
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• 2009

This paper propose highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner for application to wireless communication system. The conventional passive $90^{\circ}C$ power divider and combiner cannot be integrated on MMIC because of their very large circuit size. Therefore, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner are required for a development of highly integrated MMIC. In this paper, the highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner employing InGaAs/GaAs HBT were designed, fabricated on GaAs substrate. According to the results, the circuit size of fabricated active $90^{\circ}C$ phase difference power divider and combiner were $1.67{\times}0.87$ mm and $2.42{\times}1.05$ mm, respectively, which were 31.6% and 2.2% of the size of conventional passive branch-line coupler. The output gain division characteristic of proposed divider circuit showed 8.4 dB and 7.9 dB respectively, and output phase difference characteristic showed $-89.3^{\circ}C$. The output gain coupling characteristic of proposed combiner circuit showed 9.4 dB and 10.5 dB respectively, and output phase difference characteristic showed $-92.6^{\circ}C$. The highly miniaturized active $90^{\circ}C$ phase difference power divider and combiner exhibited good RF performances compared with the conventional passive branch-line coupler.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.18 no.9
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• pp.1064-1069
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• 2007

This paper proposes the highly miniaturized active $90^{\circ} power combiner for application to MMIC. Conventional passive $90^{\circ} power combiners can't be integrated on MMIC because of their very larger size. Therefore, the highly miniaturized $90^{\circ} power combiners are required for a development of highly integrated MMIC. For this paper, the highly miniaturized active $90^{\circ} power combiner employing InGaP/GaAs HBT was fabricated on GaAs substrate for application to highly integrated MMIC. A size of fabricated active $90^{\circ} power combiner was $2.42{\times}1.05$ mm, which was 2.2 % of conventional passive $90^{\circ} power combiner. The fabricated active $90^{\circ} power combiner showed a gain characteristic about 10 dB and a good phase-difference coupling characteristic of $-92.6^{\circ} than conventional passive $90^{\circ} power combiner at 2.4 GHz. The highly miniaturized active $90^{\circ} power combiner exhibited good RF performances comparable to conventional passive $90^{\circ} power combiners. This work is the first report of an active $90^{\circ} power combiner.