• 마이크로전자및패키징학회지
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• 제7권1호
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• pp.41-49
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• 2000

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. For the characterization of modified ACAs composites with different content of non-conducting fillers, dynamic scanning calorimeter (DSC), and thermo-gravimetric analyser (TGA), dynamic mechanical analyzer (DMA), and thermo-mechanical analyzer (TMA) were utilized. As the non-conducting filler content increased, CTE values decreased and storage modulus at room temperature increased. In addition, the increase in the content of filler brought about the increase of $Tg^{DSC}$ and $Tg^{TMA}$. However, the TGA behaviors stayed almost the same. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2001년도 Proceedings of 6th International Joint Symposium on Microeletronics and Packaging
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• pp.35-43
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• 2001

Flip chip assembly on organic substrates using ACAs have received much attentions due to many advantages such as easier processing, good electrical performance, lower cost, and low temperature processing compatible with organic substrates. ACAs are generally composed of epoxy polymer resin and small amount of conductive fillers (less than 10 wt.%). As a result, ACAs have almost the same CTE values as an epoxy material itself which are higher than conventional underfill materials which contains lots of fillers. Therefore, it is necessary to lower the CTE value of ACAs to obtain more reliable flip chip assembly on organic substrates using ACAs. To modify the ACA composite materials with some amount of conductive fillers, non-conductive fillers were incorporated into ACAs. In this paper, we investigated the effect of fillers on the thermo-mechanical properties of modified ACA composite materials and the reliability of flip chip assembly on organic substrates using modified ACA composite materials. Contact resistance changes were measured during reliability tests such as thermal cycling, high humidity and temperature, and high temperature at dry condition. It was observed that reliability results were significantly affected by CTEs of ACA materials especially at the thermal cycling test. Results showed that flip chip assembly using modified ACA composites with lower CTEs and higher modulus by loading non-conducting fillers exhibited better contact resistance behavior than conventional ACAs without non-conducting fillers. Microwave model and high-frequency measurement of the ACF flip-chip interconnection was investigated using a microwave network analysis. ACF flip chip interconnection has only below 0.1nH, and very stable up to 13 GHz. Over the 13 GHz, there was significant loss because of epoxy capacitance of ACF. However, the addition of $SiO_2filler$ to the ACF lowered the dielectric constant of the ACF materials resulting in an increase of resonance frequency up to 15 GHz. Our results indicate that the electrical performance of ACF combined with electroless Wi/Au bump interconnection is comparable to that of solder joint.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2009년 추계학술발표대회
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• pp.73-73
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• 2009

In this sutdy, a new class ACA(Anisotropic Conductive Adhesive) with low-melting-point alloy(LMPA) and self-organized interconnection method were developed. This developed self-organized interconnection method are achieved by the flow, melting, coalescence and wetting characteristics of the LMPA fillers in ACA. In order to observe self-interconnection characteristic, the QFP($14{\times}14{\times}2.7mm$ size and 1mm lead pitch) was used. Thermal characteristic of the ACA and temperature-dependant viscosity characteristics of the polymer were observed by differential scanning calorimetry(DSC) and torsional parallel rheometer, respectively. A electrical and mechanical characteristics of QFP bonding were measured using multimeter and pull tester, respectively. Wetting and coalescence characteristics of LMPA filler particles and morphology of conduction path were observed by microfocus X-ray inspection systems and cross-sectional optical microscope. As a result, the developed self-organized interconnection method has a good electrical characteristic($2.41m{\Omega}$) and bonding strength(17.19N) by metallurgical interconnection of molten solder particles in ACA.

• 대한기계학회논문집A
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• 제36권4호
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• pp.395-403
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• 2012

오늘날 접합시 열에 의한 재료 손상과 접착제(ACA, NCA) 이용으로 부품간의 정렬이 문제가 되고있다. 따라서, 본 논문은 FPCB 와 HPCB 금속(Au) PAD를 직접 접합하였다. 이때 박막인 재료에 손상을 입히는 열, 부품간의 정렬에 문제가 되는 접착제(ACA, NCA)를 사용하지 않고 상온에서 접합을 하였다. 접합시 초음파 혼을 이용하여 접합을 하였으며, 초음파혼은 40kHz이다. 공정 조건은 접합압력 0.60MPa, 접합시간 0.5, 1.0, 1.5, 2.0sec이다. 또한, 산업에서 요구하는 접합강도는 필강도 테스트 결과값으로 0.60Kgf 이상이며, 본 실험에서는 접합강도가 0.80MPa 이상이 나왔다. 이로서, 열에 의한 재료 손상과, 접 착제(ACA, NCA)에 의한 정렬 문제를 해결하였다. 그리고 산업산업에서 바로 적용하고 생산할 수 있는 FPCB, HPCB 시료 제작을 하였다.

• 폴리머
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• 제34권1호
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• pp.52-57
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• 2010

고 신뢰도와 높은 물성을 갖는 이방성 전도성접착제(anisotropic conductive adhesive, ACA)용 레진 개발을 위하여, 환원특성을 갖는 카르복실산을 포함한 bisphenol F계열의 에폭시 레진에 저융점 솔더입자(low melting point alloys, LMPA)를 분산시켜 제조하였다. LMPA의 융점에서의 에폭시 레진의 경화특성 및 온도에 따른 유변학 특성을 동적 시차 주사 열량계(differential scanning calorimeter, DSC)와 레오미터(rheometer)로 측정하여 최적화된 ACA 접합 공정을 설계하였다. 접합 공정시 LMPA 표면에 생성되는 산화막을 제거하여 높은 전기전도도와 안정적인 전기적 특성을 얻을 수 있도록 세가지 종류의 카르복실산을 환원제로 사용하여 각각의 젖음(wetting) 특성을 확인하였다. 부틸 카르복실산은 $28^{\circ}$의 낮은 젖음각을 나타내었으나, 경화반응 중 다량의 기포가 발생하는 문제가 있었다. 그러나, 이관능성 카르복실산(1,3-bis(2-carboxypropyl)tetramethyl disaoxane(2-CTMS)) 및 1,3-bis(3-carboxypropyl)tetramethyl disiloxane(3-CTMS))의 경우, 기포의 발생 없이 각각 $18^{\circ}$와 $20.3^{\circ}$의 매우 우수한 젖음 특성을 보였다.

• Archives of Pharmacal Research
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• 제17권3호
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• pp.154-160
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• 1994

The antigenicity of the aqueous extract of red ginseng (ARG) was evaluated using the following assay procedures : 1. active systemic anaphylaxis (ASA) in guinea pigs, 2 active cutaneous anaphylaxis (ACA) in guinea pigs, 3 passive cutaneous anaphylaxis (PCA) in guinea pigs, 2.active cutaneous anaphylaxis (ACA) in guinea pigs, 3. passive cutanepous anaphylaxis (PCA) in guina pigs with serum for guina pigs sensitized with ARG and 4. passive hemagglutination (PHA) with serum from guinea pigs sensitized with ARG. 1. ASA : No anaphylaxis reaction was observed in any of the sensitized guinea pigs by elictitation with ARG. 2. ACA : No skin reaction was observed in sensitized guinea pigs after intrademal injection of ARG. 3. PCA in guinea pigs : PCA titer of sera from all the sensitized animals was less than 10 in eliciation with ARG. 4. PHA reaction : When eythrocytes coated with challenge antigen were added to sensitized sera, the hemagglutination titer was less than 1. These results suggest that ARG has no antigenicity under the conditions used. And the dose levels of ARG employed in the present experiment were confirmed not to suppress immune reactions.

• Biotechnology and Bioprocess Engineering:BBE
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• 제10권6호
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• pp.510-515
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• 2005

Pseudomonas cepacia BY21 was found to produce glutaryl acylase that is capable of deacylating glutaryl-7-aminocephalosporanic acid (glutaryl-7-ACA) to 7-aminocephalosporanic acid (7-ACA), which is a starting material for semi-synthetic cephalosporin antibiotics. Amino acids of the reported glutaryl acylases from various Pseudomonas sp. strains show a high similarity (>93% identity). Thus, with the known nucleotide sequences of Pseudomonas glutaryl acylases in GenBank, PCR primers were designed to clone a glutaryl acylase gene from P. cepacia BY21. The unknown -subunit gene of glutaryl acylase from chromosomal DNA of P. cepacia BY21 was cloned successfully by PCR. The -subunit amino acids of P. cepacia BY21 acylase (GenBank accession number AY948547) were similar to those of Pseudomonas diminuta KAC-1 acylase except that Asn408 of P. diuminuta KAC-1 acylase was changed to Leu408.

• 정보관리학회지
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• 제28권1호
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• pp.123-144
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• 2011

본 연구는 학문의 지적 구조를 분석하는 새로운 분석기법인 저자프로파일링분석과 전통적인 분석기법인 저자동시인용분석을 비교하여 분석함으로써 국내 연구환경에 맞는 지적 구조 분석 방법을 제안하는 데 목적을 두고 있다. 이를 위하여 본 연구에서는 인용색인을 이용하지 않고 학문의 지적 구조를 분석할 수 있는 텍스트마이닝을 이용한 저자프로파일링분석을 통하여 새로운 지적 구조 방법의 유용성을 확인하 고자 하였다. 분석대상 학술지는 "대한건축학회 논문집 - 계획계"를 대상으로 하였다.

• 건축사
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• 1호통권238호
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• pp.92-94
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• 1989

• 건축사
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• 10호통권378호
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• pp.88-93
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• 2000