• Ceramist
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• v.9 no.6
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• pp.37-41
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• 2006

A novel grinding technology, known as ELID (Electrolytic In-Process Dressing), which incorporates 'inprocess dressing' of metal- bonded diamond grinding wheels, provides continuous protruding abrasives effectively applied to ceramic grinding. This article describes the ELID-grinding method and introduces its application examples on ceramics

• Journal of the Korean Society for Precision Engineering
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• v.26 no.7
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• pp.44-50
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• 2009

High-pressured jetting is now widely used in the advanced cutting processes of polymers, metals, glass, ceramics and composite materials because of some advantages such as heatless and non-contacting cutting. Similarly to the focused laser beam machining, it is well known as a type of high-density energy processes. High-pressured jetting is going to be developed not only to minimize the cutting line width but also to achieve the short cutting time as soon as possible. However, the interaction behavior between a work piece and high-velocity abrasive particles during the high-pressured jet cutting makes the impact mechanism even more complicated. Conventional high-pressured jetting is still difficult to apply to precision cutting of micro-scaled thin work piece such as thin metal sheets, thin ceramic substrates, thin glass plates and TMM (Thin multi-layered materials). In this paper, we proposed the advanced high-pressured jetting technology by introducing a new abrasives supplying method and investigated the optimal process conditions of the cutting pressure, the cutting velocity and SOD (Standoff distance).

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.10
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• pp.1499-1505
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• 2010

In general, magnetic abrasive polishing can be used to effectively produce a mirror-like surface; however, industrial applications of this process involve some unsolved problems. For example, the polishing efficiency is low, and the used abrasives have to be treated. In this study, which is aimed at solving these problems, a novel medium of silicone gel, consisting of ferromagnetic particles and abrasives, is developed, and the effect of this medium is assessed on the basis of Taguchi's experimental method. The workpiece is a tungsten carbide steel and the surface roughness after magnetic abrasive polishing using the silicone gel is evaluated.

• Tribology and Lubricants
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• v.35 no.6
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• pp.330-336
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• 2019

Conditioning is a process involving pad surface scraping by a moving metallic disk that is electrodeposited with diamond abrasives. It is an indispensable process in chemical-mechanical planarization, which regulates the pad roughness by removing the surface residues. Additionally, conditioning maintains the material removal rates and increases the pad lifetime. As the conditioning continues, the pad profile becomes unevenly to be deformed, which causes poor polishing quality. Simulation calculates the density at which the diamond abrasives on the conditioner scratch the unit area on the pad. It can predict the profile deformation through the control of conditioner dwell time. Previously, this effect of the diamond shape on conditioning has been investigated with regard to microscopic areas, such as surface roughness, rather than global pad-profile deformation. In this study, the effect of diamond shape on the pad profile is evaluated by comparing the simulated and experimental conditioning using two conditioners: a) random-shaped abrasive conditioner (RSC) and b) uniform-shaped abrasive conditioner (USC). Consequently, it is confirmed that the USC is incapable of controlling the pad profile, which is consistent with the simulation results.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Tribology and Lubricants
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• v.32 no.4
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• pp.119-124
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• 2016

In the sapphire wafering process, lapping is a crucial operation in order to reduce the damaged layer and achieve the target thickness. Many parameters, such as pressure, velocity, abrasive, slurry and plate, affect lapping characteristics. This paper presents an experimental investigation on the effect of the plate groove on the material removal rate and roughness of the wafer. We select the spiral pattern and rectangular type as the groove shapes. We vary the groove density by controlling the groove shape dimension, i.e., the groove width and pitch. As the groove density increases to 0.4, the material removal rate increases and gradually reaches a saturation point. When the groove density is low, the pressing load is mostly supported by the thick film, and only a small amount acts on the abrasives resulting to a low material removal rate. The roughness decreases on increasing the groove density up to 0.3 because thick film makes partial participations of large abrasives which make deep scratches. From these results, we could conclude that the groove affects the contact condition between the wafer and plate. At the same groove density, the pitch has more influence on reducing the film thickness than the groove width. By decreasing the groove density with a smaller pitch and larger groove width, we could achieve a high material removal rate and low roughness. These results would be helpful in understanding the groove effects and determining the appropriate groove design.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.118-118
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• 2008

The oxide CMP has been applied to interlayer dielectric(ILD) and shallow trench isolation (STI) in chip fabrication. Recently the slurry used in oxide CMP being changed from silica slurry to ceria (cerium dioxide) slurry particularly in STI CMP, because the material selectivity of ceria slurry is better than material selectivity of silica slurry. Moreover, the ceria slurry has good a planarization efficiency, compared with silica slurry. However ceria abrasives make a material removal rate too high at the region of wafer center. Then we focuses on why profile of material removal rate is convex. The material removal rate sharply increased to 3216 $\AA$/min by $4^{th}$ run without conditioning. After $4^{th}$ run, material removal rate converged. Furthermore, profile became more convex during 12 run. And average material removal rate decreased when conditioning process is added to end of CMP process. This is due to polishing mechanism of ceria. Then the ceria abrasive remains at the pad, in particular remains more at wafer center contacted region of pad. The field emission scanning electron microscopy (FE-SEM) images showed that the pad sample in the wafer center region has a more ceria abrasive than in wafer outer region. The energy dispersive X-ray spectrometer (EDX) verified the result that ceria abrasive is deposited and more at the region of wafer center. Therefore, this result may be expected as ceria abrasives on pad surface causing the convex profile of material removal rate.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.16 no.5
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• pp.85-90
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• 2017

Mica-glass ceramics has features such as micro-sized crystals, high strength, chemical resistance, semitransparent optical properties, etc. Due to its superior material properties, mica glass ceramics have increasing applications in dental and medical components, insulation boards, chemical devices, etc. In many applications, especially for dental and medical components, ultra-precise polishing is required. However, it is known to be a very difficult-to-grind material because of its high hardness and brittle properties. Thus, in this study, a newly developed ultra-precise polishing method is applied to obtain nano-level surface roughness of the mica glass ceramics using magnetorheological (MR) fluids and nano abrasives. Nano-sized ceria particles were used for the polishing of the mica glass ceramics. A series of experiments were performed under various polishing conditions, and the results were analyzed. A very fine surface roughness of Ra=6.127 nm could be obtained.

• Journal of the Korean Magnetics Society
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• v.6 no.1
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• pp.28-35
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• 1996

Dispersion behavior was investigated as functions of species and arrount of addtives, binders, abrasives, lubricants, etc.. Dispersibilityand other various properties were affected by the fuctional groups of binders. Friction coefficient and surface roughness of tape were changed with lubricants, therefore duratility of magnetic tape was varied. As a result of above investigations, we concluded that dispersion behavior of particles was very sensitive for obtaining maximum properties of metal particle tape.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.5 no.1
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• pp.13-18
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• 2006

The magnetic abrasive machining has been developed as a new finishing technology to obtain a fine surface of workpiece. In this paper, a static magnetic field method and a magnetic abrasive brush which has many technical advantages, are applied for the magnetic abrasive machining. In the experiment, some items such as finishing time, ratio of the magnetic abrasives to Fe-powder, motor revolutions per minute, and motor ratio revolutions per minute are tested. The results of this study have shown the fact that the burr height is mostly affected by the finishing time and the abrasive ratio. Also, it has been found that the magnetic abrasive machining is a possible new technology for the deburring.