• 한국윤활학회:학술대회논문집
• /
• 한국윤활학회 2000년도 제31회 춘계학술대회
• /
• pp.166-172
• /
• 2000

Friction characteristics of phenolic resin-based friction composites containing threedifferent relative amounts of graphite and zirconium silicate were investigated by using a pad-on-disk type friction tester. Constant temperature test and constant interval test at three different initial temperatures(100. 200, 300$^{\circ}C$) were performed to examine the effects of friction heat on friction characteristics at elevated temperature. The friction composite(FMO.7) with higher content of ZrSiO$_4$showed unstable friction force at higher temperature and resulted in larger fluctuations of vibration during friction test. The abrasive action of ZrSiO$_4$in friction composite impeded stable transfer film and induced higher friction heat at friction interface. Friction oscillations according to the temperature were associated with the formation of transfer film(i'd body layer) on the friction composite and the counter part.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2008년도 추계학술대회 논문집 Vol.21
• /
• pp.161-161
• /
• 2008

The oxide film of silicon wafer has been mainly polished by fumed silica, colloidal silica or ceria slurry. Because colloidal silica slurry is uniform and highly dispersed composed of spherical shape particles, by which the oxide film polished remains to be less scratched in finishing polishing process. Even though the uniformity and spherical shape is advantage for reducing the scratch, it may also be the factor to decrease the removal rate. We have studied the correlation of silica abrasive particles and CMP characteristics by varying pH, down force, and table rotation rate in polishing. It was found that the CMP polishing is dependent on the morphology, aggregation, and the surface property of the silica particles.

• 대한전기학회논문지:전기물성ㆍ응용부문C
• /
• 제55권12호
• /
• pp.549-554
• /
• 2006

In this paper we first applied the chemical mechanical polishing (CMP) process to the planarization of ferroelectric film in order to obtain a good planarity between electrode and ferroelectric film. $Pb_{1.1}(Zr_{0.52}Ti_{0.48})O_3$ (shortly PZT) ferroelectric film was fabricated by the sol-gel method. And then, we compared the structural characteristics before and after CMP process of PZT films. Removal rate, WIWNU% and surface roughness have been found to depend on slurry abrasive types and their hardness, especially, surface roughness and planarity were strongly depends on its pH value. A maximum in the removal rate is observed in the silica slurry, in contrast with the minimum removal rate occurs at ceria slurry. We found that the surface roughness of PZT films can be significantly reduced using the CMP technique.

• 한국소음진동공학회논문집
• /
• 제24권8호
• /
• pp.643-650
• /
• 2014

Gear transmission system is widely applied in engineering. As the problem of contact fatigue, wear, lubrication failure etc, the condition of gear teeth contacts will be worse. The vibration and sound signals in the gear system will be affected by the some failures like scuffing, abrasive wear and spalling due to the deterioration of gear teeth surface. By studying the estimation of specific film thickness, measurement of reduction in tooth thickness, visual examination of wear mechanisms on the gear teeth and their effects on the statistical parameters of vibration and sound signals, the research obtained the satisfactory results on accessing the surface fatigue wear in a spur gear system. The paper utilizes the relationship between statistical parameters obtained from sound signals and Stribeck curve to confirm the hypothesis of dependency of surface fatigue wear, specific film thickness.

• Tribology and Lubricants
• /
• 제36권6호
• /
• pp.320-323
• /
• 2020

Thin film coatings are commonly exploited to minimize wear and optimize the frictional behavior of various precision mechanical systems. The enhancement of thin film durability is directly related to the performance maximization of the system. Therefore, a fine approach to analyze the thin film wear behavior is required. Archard's equation is a representative and well-developed law that defines the wear coefficient, which is the probability of creating wear particles. A ploughing model is a commonly used model to determine the friction force during the abrasive contact. The equations demonstrate that the friction force and wear coefficient are inversely proportional to the hardness of the material. In this study, Archard's equation and ploughing models are modified with an effective hardness to minimize the gap between the experimental and numerical results. It is noted that the effective hardness is the hardness variation with respect to the penetration depth owing to the substrate effect. The nanoindentation method is utilized to characterize the effective hardness of Cu film. The wear coefficient value considering the effective hardness is more than three times higher than that without considering the effective hardness. The friction force predicted with the effective hardness agreed better with the results obtained directly from the friction force detecting sensor. This outcome is expected to improve the accuracy of friction and wear amount predictions.

• 한국기계가공학회지
• /
• 제13권1호
• /
• pp.121-128
• /
• 2014

Superfinishing is essential for mirror surfaces, because among mechanical components cylindrical workpieces such as spindles must maintain precision and reliability with respect to functional characteristics. However, research on standardization of polishing film application combination to obtain mirror surfaces is insufficient. Consequently, this has been a factor in rising costs of mechanical components. Therefore, in this study, experiments have been conducted to determine efficient polishing film application combination for mirror surfaces ranging from ductile materials such as SM45C, brass, aluminium 7075, and titanium to brittle materials such as $Al_20_3$, SiC, $Si_3N_4$, and $ZrO_2$. From the experimental results, efficient polishing film application combination for metallic materials and ceramic materials is confirmed.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 하계학술대회 논문집 Vol.4 No.1
• /
• pp.88-91
• /
• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina ($Al_2O_3$) abrasive containing slurry with $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• 한국전기전자재료학회:학술대회논문집
• /
• 한국전기전자재료학회 2003년도 춘계학술대회 논문집 센서 박막재료 반도체 세라믹
• /
• pp.33-36
• /
• 2003

Tungsten is widely used as a plug for the multi-level interconnection structures. However, due to the poor adhesive properties of tungsten (W) on $SiO_2$ layer, the Ti/TiN barrier layer is usually deposited onto $SiO_2$ for increasing adhesion ability with W film. Generally, for the W-CMP (chemical mechanical polishing) process, the passivation layer on the tungsten surface during CMP plays an important role. In this paper, the effect of oxidants controlling the polishing selectivity of W/Ti/TiN layer were investigated. The alumina $(Al_2O_3)$ abrasive containing slurry with 5 % $H_2O_2$ as the oxidizer, was studied. As our preliminary experimental results, very low removal rates were observed for the case of no-oxidant slurry. This low removal rate is only due to the mechanical abrasive force. However, for Ti and TiN with 5 % $H_2O_2$ oxidizer, different removal rate was observed. The removal mechanism of Ti during CMP is mainly due to mechanical abrasive, whereas for TiN, it is due to the formation of metastable soluble peroxide complex.

• Tribology and Lubricants
• /
• 제33권5호
• /
• pp.220-227
• /
• 2017

In this work, carbon nanotube and nano-size alumina particle are exploited as additive for lubrication experiment. We used pin-on-disk type tribometer to investigate the tribological characteristics of lubricants with respect to additives and rotational speed. We conducted more than 15 trials of tribotests for two hours for each specimen to obtain stable and accurate frictional force and to create measurable wear track on the substrate. We conducted tests at the boundary/mixed lubrication regime to evaluate the influence of additives on the tribological characteristics. We found that the friction coefficient decreased as the rotational speed increased and as additives were added. In particular, the reduction of friction by adding additives was more significant at low rotational speed than at high rotational speed. We speculate that the additives helped to separate and protect the two contacting surfaces at low speed, while the influence of additives was not significant at high speed since sufficiently thick lubricant film was formed. The wear of the substrate was also reduced by adding additives to the lubricant. However, in contrast to friction, the amount of wear at high rotational speed was less when alumina particles were added to the lubricant than the amount of wear at low speed. We speculate that the increased wear at low rotational speed is as a result of the intermittent abrasive wear caused by alumina particles with uneven shape, while the reduced wear at high speed is as a result of sufficient film thickness which prevented the abrasive wear.

• 한국윤활학회:학술대회논문집
• /
• 한국윤활학회 1998년도 제28회 추계학술대회
• /
• pp.272-277
• /
• 1998

Chemical-Mechanical Polishing (CMP) refers to a material removal process done by rubbing a work piece against a polishing pad under load in the presence of chemically active, abrasive containing slurry. CMP process is a combination of chemical dissolution and mechanical action. The mechanical action of CMP involves tribology. The liquid slurry is trapped between the wafer(work piece) and pad(tooling) forming a lubricating film. For the first step to understand material removal rate of the CMP process, the lubricational analyses were done with commercial 100mm diameter silicon wafers to get nominal clearance of the slurry film, roll and pitch angle at the steady state. For this purpose, we calculate slurry pressure, resultant forces and moments at the steady state in the range of typical industrial polishing conditions.