Characteristics of 2-Step CMP (Chemical Mechanical Polishing) Process using Reused Slurry by Adding of Silica Abrasives (실리카 연마제가 첨가된 재활용 슬러리를 사용한 2단계 CMP 특성)
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- Journal of the Korean Institute of Electrical and Electronic Material Engineers
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- v.16 no.9
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- pp.759-764
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- 2003