• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2012년도 춘계학술대회 논문집
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• pp.139-140
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• 2012

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 추계학술대회 논문집
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• pp.495-496
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• 2006

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2007년도 춘계학술대회 논문집
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• pp.647-648
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• 2007

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2005년도 추계학술대회 논문집
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• pp.488-491
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• 2005

Abrasive Jet Micromachining (AJM) is a process that uses high pressure air with micron-sized particles to erode a substrate. It has been considered as the most economic and appropriate technique to pattern glass surfaces for the flat panel applications. To accelerate the industrialization of AJM, it is necessary to understand the erosion mechanisms thoroughly. Thus, this paper introduces a new method to model the erosion mechanism in AJM. The model is developed by using the concept of the accumulation of the microdeformation caused by each particle. And this paper proposes the model added the effects of second impact. The developed model is used to simulate the erosion profile, and is compared with the model considered only first impact. It can be concluded that the proposed model predicts the erosion profile more accurately.

• 한국정밀공학회지
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• 제18권10호
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• pp.178-183
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• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2000년도 추계학술대회 논문집
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• pp.963-966
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• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.