• Tribology and Lubricants
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• v.27 no.1
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• pp.7-12
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• 2011

Interest in advanced machining process such as AJM(abrasive jet machining) and CMP(chemical-mechanical polishing) using micro/nano-sized abrasives has been on the increasing demand due to wide use of super alloys, composites, semiconductor and ceramics, which are difficult to or cannot be processed by traditional machining methods. In this paper, the effects of pressure, wafer moving velocity and fluid viscosity were investigated by 2-dimensional finite element analysis method considering slurry fluid flow. From the investigation, it could be found that the simulation results quite corresponded well to the Preston's equation that describes pressure/velocity dependency on material removal. The result also revealed that the stress and corresponding material removal induced by the collision of particle may decrease under relatively high wafer moving speed due to the slurry flow resistance. In addition, the increase in slurry fluid viscosity causes the reduction of material removal rate. It should be noted that the viscosity effect can vary with the shape of abrasive particle.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.10a
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• pp.503-504
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• 2006

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2007.06a
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• pp.663-664
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• 2007

• Journal of the Semiconductor & Display Technology
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• v.10 no.3
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• pp.35-42
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• 2011

This paper describes the characteristics of high speed grinding and the influence of wheel surface speed V and a grindability of the grinding materials. The various fine ceramics pieces was ground by metal and vitrified bonded diamond wheel. The surface roughness of fine ceramics(Zirconia($ZrO_2$), Silicon Carbide(SiC), Silicon Nitride($Si_3N_4$), Alumina($Al_2O_3$)) decreases from $0.05{\mu}m(R_{max})$ to $0.025{\mu}m(R_{max})$ when the wheel speed at grinding point increases the wheel speed. Relation between the temperature at grinding point and surface roughness was linear. Abrasive jet machining(AJM), a specialized from of shot blasting, is considered one of the most helpful micro machining methods for hard and brittle materials such as glasses and ceramics by constant pressure grinding.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.5
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• pp.367-373
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• 2014

Surface texturing is a machining process on the surface to give engineering functions. The representative process of the surface texturing is lotus effect to give hydrophobic property by the lithography and chemical etching, which is the bio mimic from the nature. Surface texturing can be manufactured by a lot of processes, in particular using mechanical method such as a precise diamond turning, grinding, rolling, embossing, vibrorolling, and abrasive jet machining (AJM). Among them, the grinding process is notable in terms of the wide range of texturing area and fast processing time. The patterning by grinding is done by the grooved grinding wheel on the work piece. In this case, the pattern shape is determined by the grinding conditions as well as the wheel dressing conditions. In this paper, experimental study on the pattern shapes were done and provide the feasibility in use for the large area patterning.

• Transactions of the Korean Society of Mechanical Engineers
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• v.16 no.9
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• pp.1632-1642
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• 1992

When a blind hole of small diameter is drilled in the field of residual stress, strain relieved around the hole is function of magnitude of stress, patterns of stress distribution and hole geometry of diameter and depth. Relieved strain coefficients can be calculated from FEM analysis of relieved strain and actual stress. These relieved strain coefficients make it possible to measure residual stress which vary along the depth in the subsurface of stressed material. In this study, the calibration tests of residual stress measurement are carried out by drilling a hole incrementally on the cantilever or on the tensile test bar. Residual stresses can be determined from measured strains around a shallow hole by application of power series method. For the sake of reliable measurement of residual stress, much efforts should be done to measure relieved strains and hole depth more accurately comparing with conventional procedures of gage subject to the external load. Otherwise linear equations converting strains into stresses may yield erratic residual stresses because of ill-conditions of linear equations. With accurate measurements of relieved strains, residual stress even if varying along the depth can be measured. It is also possible to measure residual stress in the thin film of material by drilling a shallow hole.