• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2000.11a
• /
• pp.963-966
• /
• 2000

Abrasive jet machining(AJM) process is similar to the sand blasting, and effectively removes hard and brittle materials. AJM has applied to rough working such as deburring and rough finishing. As the needs for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM was developed, and became the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro groove cutting of glass. Diameter of hole and width of line in this groove cutting is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro groove cutting in glass, but the size of machined groove was increased about 2~4${\mu}{\textrm}{m}$. therefore, this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD parts.

• Journal of the Korean Society for Precision Engineering
• /
• v.18 no.10
• /
• pp.178-183
• /
• 2001

Abrasive jet machining(AJM) process is similar to the sand blasting and effectively removes hard and brittle materials. AJM has applied to rough working such as debarring and rough finishing. As the need for machining of ceramics, semiconductor, electronic devices and LCD are increasing, micro AJM is developed, and has become the inevitable technique to micromachining. This paper describes the performance of the micro AJM in micro grooving of glass. Diameter of hole and width of line in grooving is 80${\mu}{\textrm}{m}$. Experimental results showed good performance in micro grooving of glass, but the size of machined groove increased about 2~4${\mu}{\textrm}{m}$. With the fine tuning of masking process and compensation of film wear. this micro AJM could be effectively applied to the micro machining of semiconductor, electronic devices and LCD.

• Journal of the Korean Society of Manufacturing Process Engineers
• /
• v.10 no.6
• /
• pp.95-101
• /
• 2011

Micro-abrasive jet machining(${\mu}AJM$) using mask is a fine machining technology which can carve a figure on a material. The mask should have holes exactly same as the required figure. Abrasive particles are jetted into the holes of the mask and it collide with the material. The collision break off small portion of the material. And the ${\mu}AJM$ nozzle should move all over the machining area. However, in general the carving shape is modeled as in a bitmap figure, because it often contains characters. And the mask model is also often modeled from the bitmap image. Therefore, the machining path of the ${\mu}AJM$ also efficient if it can be generated from the bitmap image. This paper suggest an algorithm which can generate ${\mu}AJM$ tool path directly from the bitmap image of the carving figure. And shows some test results and applications.

• Journal of the Korean Society for Precision Engineering
• /
• v.24 no.1 s.190
• /
• pp.71-78
• /
• 2007

Abrasive jet machining (AJM) has been traditionally used for removing rusts or paints. Nowadays, this is promising technology for micro bulk machining where brittle substrate materials are used. In order to get accurate details, masks such as metal, polymer or elastomer is inevitable. Among them, photo polymer which is sensitive to the light has been attractive for it's high accuracy using photolithography. In this research, SU-8 as a photo polymer is used since it is adequate for making thick mask. So, this paper describes how to make AJM masks using SU-8 with a photolithography process, and investigates the characteristics of SU-8 masks during AJM process. Also, an example of fabrication using AJM was shown.

• Journal of the Korean Society for Precision Engineering
• /
• v.25 no.1
• /
• pp.138-144
• /
• 2008

Micro-machining of a brittle material such as glass, silicon, etc., is important in micro fabrication. Particularly, micro-abrasive jet machining (${\mu}-AJM$) has become a useful technique for micro-machining of such materials. The ${\mu}-AJM$ process is mainly based on the erosion of a mask which protects brittle substrate against high velocity of micro-particle. Therefore, fabrication of an adequate mask is very important. Generally, for the fabrication of a mask in the ${\mu}-AJM$ process, a photomask based on the semi-conductor fabrication process was used. In this research a rapid mask fabrication technology has been developed for the ${\mu}-AJM$. By scanning the focused UV laser beam, a micro-mask pattern was fabricated directly without photolithography process and photomask. Two kinds of mask patterns were fabricated using SU-8 and photopolymer (Watershed 11110). Using fabricated mask patterns, abrasive-jet machining of Si wafer were conducted successfully.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2005.06a
• /
• pp.1175-1178
• /
• 2005

Brittle materials, especially single-crystal silicon wafer, are widely used for sensors, IC industry, and MEMS applications. e general machining process of crack easy materials is by chemical agents, but it is hazardous and time consuming. Also, it is difficult to get high aspect ratio micro structure. As an alternative tool, an AJM(Abrasive jet machining) is promising method in terms of high aspect ratio and production cost. In this study, to get more precise detail compared to general AJM, photo polymer mask, SU-8, used in photolithography was applied in AJM. Process parameters such as abrasive diameter, air pressure, nozzle diameter, flow rate of abrasive in AJM and a variety of conditions in spin coating were decided. Finally, micro channel and mixer was fabricated to see the efficiency of the AJM with photo polymer mask.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2006.05a
• /
• pp.493-494
• /
• 2006

SU-8 can be implemented as a mask for micro Abrasive Jet Machining (micro-AJM) process [1]. In this paper, we will evaluate the quality of micro grooving result on glass substrate by micro-AJM process which using SU-8 as a mask. It was evaluated on width and edge profile of the micro grooving. The result was having distortion compare with the master film used to pattern the SU-8 mask. The value of distortion with other properties which came along with it, such as depth and surface roughness, can be optimized in order to fabricate micro-channel for micro-fluidic application.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2004.10a
• /
• pp.379-382
• /
• 2004

Abrasive jet machining (AJM) has a large number of parameters such as powder flow rate, air pressure, diameter of abrasive, stand off distance, material hardness and fracture toughness, etc. It is not easy matter to control those parameter. To achieve high accurate machining, in this study, Taguchi method was used to select process parameters. The objective of the optimization was to get higher material removal rate (MRR). From the experiments and analysis, some process parameters were found to make efficient machining.

• Journal of Welding and Joining
• /
• v.6 no.3
• /
• pp.37-42
• /
• 1988

The Hole Drilling Method(HDM) is widely used to measure residual stresses in the welded structures. The purpose of this study is to evaluate the accuracy fo measuring residual stresses when drilling the hole by Air-abrasive Jet machine(AJM). Simulated residual stresses wre introduced by applying known stresses to steel bars. These known streses were then compared with measured stresses relaxed from hole drilling. the obtained results are summarized as follows; 1) It was possible to obtain well defined holes with the nozzle designed for this study. 2) If the hole shape is not cylindrical, critical may occur. 3) In the uniaxial strain field, the measurement error of the maximum principal stress was within .+-.10 percent. The orientation angle of the maximum principal stress was within 8.deg. from the given directioin. 4) meausrements were made varying hole depths. Little or no change of stresses occurs since holse were drilled more than the depth of the 0.6 times diameter. 5) The air-abrasive jet machining for drilling holse does not cause appreciable apparent stresses which si critical to measure residual stresses.

• Proceedings of the Korean Society of Precision Engineering Conference
• /
• 2012.05a
• /
• pp.535-536
• /
• 2012