• Journal of the Korea Academia-Industrial cooperation Society
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• v.17 no.4
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• pp.448-453
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• 2016

Erosion and abrasion caused by cavitation damage occur in fluid equipment, such as ships or impellers. Similarly, the equipment damage from noise and vibration can shorten its life. This study analyzed the importance of the parameter characteristics of the process optimization of HVOF (High Velocity Oxygen Fuel spraying), which is generally used in a variety of industries for enhancing the resistibility from the cavitation phenomenon. The surface of the ALBC3 substrate was coated with an amorphous powder as a filler metal according to the experimental design using the Taguchi method, and then the characteristics with each parameter were analyzed using a porosity measurement test. The optimal process conditions was a combustion pressure of 80psi, coating distance of 270mm, gun speed of 200mm/s, and powder feed rate of 25g/min as a result of the HVOF coating by applying the experimental design. The combustion pressure, coating distance and powder feed rate were more than 25% and indicated a similar contribution rate, but the contribution rate of the gun speed was 19%, which was slightly less than the others. The contribution rate with each parameter was only slightly significant. On the other hand, all four parameters were found to be important in the contribution rate aspects of the HVOF coating process.

• Journal of Korean Ophthalmic Optics Society
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• v.9 no.1
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• pp.125-134
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• 2004

By applying the test methods of "Protection Eyewear Standard (KS P 8147)", "Glasses Frame Standard (KS G 3306)" and "Lens Standard for Sunglasses (KS P 4404)", this study analyzed optical functions of sunglasses now being sold in a road shop (A shop), a fashion goods store (B shop), a shop of highway rest area (C shop) and an optical shop (D shop). When compared with sunglasses (UV transmittance rate 8.8%) of a road shop, UV Block effects of sunglasses (UV transmittance rate 0.7%) of an optical shop showed good results. In addition, the average surface resistance against abrasion for sunglasses which was sold at an optical shop was 1.4% that was much higher than that of sunglasses of a road shop(2.2%).

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.17 no.10
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• pp.1049-1055
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• 2004

Chemical Mechanical Polishing (CMP) is referred to as a three body tribological system, because it includes two solids in relative motion and the CMP slurry. On the assumption that the abrasives between the pad and the wafer could be a major reason not only for the friction force but also for material removal during polishing, the friction force generated during CMP process was investigated with the change of abrasive size and concentration of CMP slurry. The threshold point of average coefficient of friction (COF) with increase in abrasives concentration during interlayer dielectric (ILD) CMP was found experimentally and verified mathematically based on contact mechanics. The predictable models, Mode I (wafer is in contact with abrasives and pad) and Mode II (wafer is in contact with abrasives only), were proposed and used to explain the threshold point. The average COF value increased in the low abrasives concentration region which might be explained by Mode I. In contrast the average COF value decreased at high abrasives concentration which might be regarded to as Mode II. The threshold point observed seemed to be due to the transition from Mode I to Mode II. The tendency of threshold point with the variation of abrasive size was studied. The increase of particle radius could cause contact status to reach transition area faster. The correlation between COF and material removal rate was also investigated from the tribological and energetic point of view. Due to the energy loss by vibration of polishing equipment, COF value is not proportional to the material removal rate in this experiment.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.07a
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• pp.50-53
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• 2003

CMP (chemical mechanical polishing) process remained to solve several problems in deep sub-micron integrated circuit manufacturing process. especially consumables (polishing pad, backing film, slurry, pad conditioner), one of the most important components in the CMP system is the slurry. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are important in determining polish rate and planarization ability of a CMP process. However, the cost of abrasives is still very high. So, in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slurry. As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Journal of Korea Foundry Society
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• v.15 no.3
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• pp.272-282
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• 1995

Iron-based metal matrix composites have been recently investigated for the use of inexpensive abrasion resistance material. This paper carried out to investigate the in-situ reaction effects on the microstructural characteristics and the formation mechanism of tungsten carbides in a white cast iron matrix. The specimens of Fe-3.2%C-2.8%Si alloy cast-bonded with tungsten wire were cast in the metal mold and isothermally heat treated at $950^{\circ}C$ up to 48 hours. The typical microstructure of heat treated specimens showed the reaction layer of WC at the interface of tungsten wire and the carbon depletion zone between the WC layer and the matrix. During the formation of WC layer, if the carbon supply is insufficient due to the decarburization of matrix or the isolation of matrix by cast-bonded W wires, the reaction layer develops coarse hexagonal crystalline WC. From the microstructural investigation, it was found that the volume of WC layer and the carbon depletion zone increased linearly with the isothermal heat treating time. This results supported that the formation rate of WC in the white cast iron matrix is controlled by the interfacial reaction with a constant reaction rate.

• Elastomers and Composites
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• v.33 no.3
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• pp.185-192
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• 1998

This study was investigated on the physical properties of synthetic rubber compounds containing silica and silane copuled silica. Surface area and pore volume of silane copuled silica appeared to be low compared with those of pure silica because silane coupling agent blocks the pore of silica surface during silanization reaction. Silica with large surface area and high structure showed the short scorch time$(t_5)$ and rapid cure rate. The silane coupled silica showed the shorter scorch time and more rapid cure rate than pure silica because of the of effect of sulfur in the silane coupling agent(Si 69), The high value of $N_2SA$ minus CTAB com-pared with surface area and structure of silica showed the high 300% modulus. Also, the surface area and structure of silica did not affected the amount of PICO loss that indicate the abrasion resistance but affected the amount of cut and chip loss.

• Fashion & Textile Research Journal
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• v.8 no.3
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• pp.295-302
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• 2006

The purpose of this study was to research the purchasing traits and the wearing satisfaction of ski wears to provide the data needed to design ski wears to the related industries. This survey was performed during 2003's and 2004's winter with the 157 questionnaires containing 16 items of purchasing traits, 8 of design satisfaction, 12 of purchasing satisfaction and 13 of satisfaction of using convenience. The data were analysed with the frequency, the percentile, $X^2$-test, the average, the standard deviation and t-test through comparing with the groups of general people and experts, and the groups of male and female. The results were:1.The most preferred style was the two pieces style(88.5%), and then the loose style(61.1%), and the shoulder-wireless style(36.9%). 2.The imported brands were more preferred because of the design(44.1%). 3.The main place of purchasing was the ski wear speciality shop(48.4%), the main source of the merchandise information was the surrounding men(43.3%), the most significant consideration aspect when purchasing was the design(35.7%), and the rate of size perception was 51.6%. 4.The wearing satisfaction score(5) of ski wears were; the satisfaction of design was 3.24, the satisfaction of material 3.00, and the satisfaction of using convenience 3.07. 5.In the rate of design satisfaction, the female(3.10) showed higher than the male(3.35) (p<.05). 6.In the satisfaction of material, 'the discoloration'(2.37), 'the abrasion'(2.75), 'the sense of volume'(2.76) and 'the sense of touch' showed dissatisfaction. 7.In the satisfaction of using convenience, 'the pollution by lifting ticket'(2.36)was showed most dissatisfaction.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2003.05c
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• pp.145-148
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• 2003

Recently, the recycle of CMP (chemical mechanical polishing) slurries have been positively considered in order to reduce the high COO (cost of ownership) and COC (cost of consumables) in CMP process. Among the composition of slurries (buffer solution, bulk solution, abrasive particle, oxidizer, inhibitor, suspension, antifoaming agent, dispersion agent), the abrasive particles are one of the most important components. Especially, the abrasive particles of slurry are needed in order to achieve a good removal rate. However, the cost of abrasives, is still very high. In this paper, we have collected the silica abrasive powders by filtering after subsequent CMP process for the purpose of abrasive particle recycling. And then, we have studied the possibility of recycle of reused silica abrasive through the analysis of particle size and hardness. Also, we annealed the collected abrasive powders to promote the mechanical strength of reduced abrasion force. Finally, we compared the CMP characteristics between self-developed KOH-based silica abrasive slurry and original slury, As our experimental results, we obtained the comparable removal rate and good planarity with commercial products. Consequently, we can expect the saving of high cost slurry.

• Elastomers and Composites
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• v.33 no.4
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• pp.231-237
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• 1998

In order to investigate the physical properties of rubber blend compound, this experiment was carried out on the cure rate, loss tangent, reinforcement and abrasion properties of S-SBR (solution styrene-butadiene rubber) blends containing silane coupled silica and E-SBR (emulsion styrene-butadiene rubber) blends containing carbon black as a model compound. E-SBR blend showed the highest total bound rubber(TBR), while S-SBR blends showed constant TBR level regardless of rubber type. Rapid cure rate was achieved when the styrene and vinyl content of rubber microstructure decreased and TBR content of rubber compounds increased. The modulus as the index of rubber reinforcement showed the linear relation with TBR content. The large amount of PICO loss was observed when the styrene and vinyl content of rubber microstructure increased, while the small amount of PICO loss was observed when the ratio of bu-tadiene increased in the S-SBR blends with silane copuled silica. The high loss tangent at $0^{\circ}C$, the low loss tangent at $60^{\circ}C$, and the large difference of loss tangent were shown in the S-SBR blends with high styrene content compared to E-SBR blend.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2008.06a
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• pp.546-546
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• 2008

Copper (Cu) Chemical mechanical polishing (CMP) has been an essential process for Cu wifing of DRAM and NAND flash memory beyond 45nm. Copper has been employed as ideal material for interconnect and metal line due to the low resistivity and high resistant to electro-migration. Damascene process is currently used in conjunction with CMP in the fabrication of multi-level copper interconnects for advanced logic and memory devices. Cu CMP involves removal of material by the combination of chemical and mechanical action. Chemicals in slurry aid in material removal by modifying the surface film while abrasion between the particles, pad, and the modified film facilitates mechanical removal. In our research, we emphasized on the role of chemical effect of slurry on Cu CMP, especially on the effect of amine functional group on removal rate selectivity between Cu and Tantalum-nitride (TaN) film. We investigated the two different kinds of complexing agent both with amine functional group. On the one hand, Polyacrylamide as a polymer affected the stability of abrasive, viscosity of slurry and the corrosion current of copper film especially at high concentration. At higher concentration, the aggregation of abrasive particles was suppressed by the steric effect of PAM, thus showed higher fraction of small particle distribution. It also showed a fluctuation behavior of the viscosity of slurry at high shear rate due to transformation of polymer chain. Also, because of forming thick passivation layer on the surface of Cu film, the diffusion of oxidant to the Cu surface was inhibited; therefore, the corrosion current with 0.7wt% PAM was smaller than that without PAM. the polishing rate of Cu film slightly increased up to 0.3wt%, then decreased with increasing of PAM concentration. On the contrary, the polishing rate of TaN film was strongly suppressed and saturated with increasing of PAM concentration at 0.3wt%. We also studied the electrostatic interaction between abrasive particle and Cu/TaN film with different PAM concentration. On the other hand, amino-methyl-propanol (AMP) as a single molecule does not affect the stability, rheological and corrosion behavior of the slurry as the polymer PAM. The polishing behavior of TaN film and selectivity with AMP appeared the similar trend to the slurry with PAM. The polishing behavior of Cu film with AMP, however, was quite different with that of PAM. We assume this difference was originated from different compactness of surface passivation layer on the Cu film under the same concentration due to the different molecular weight of PAM and AMP.