• Asian-Australasian Journal of Animal Sciences
• /
• v.33 no.5
• /
• pp.856-865
• /
• 2020

Objective: This study was conducted to evaluate the physicochemical properties and changes in moisture concentrations of bedding materials under the conditions of rearing Korean Hanwoo cows. Methods: Two experiments were conducted to investigate the physicochemical characteristics (Exp. I) and usefulness as beddings for rearing cattle (Exp. II) by the type of beddings such as sawdust (SD), wood shavings (WS) and sawdust+wood shavings (S+W; 1:1 in volume), and the species of pine trees from different countries of origins (China, Pinus armandii, AR; Vietnam, Pinus kesiya, KE; USA, Pinus rigida, RI). Results: In Exp. I, SD-AR showed the largest proportion (78.3%) of fine particles (250 ㎛+below 250 ㎛) and the highest bulk density (208 kg/㎥) among treatments (p<0.05). The water absorption capacity at 24 h of both S+W-RI (713%) and -KE (701%) was the highest among treatments (p<0.05) and higher than those of SD or WS alone within each species of pine tree (p<0.05). Moisture evaporation rates (%) at 12 h were ranged from 52.3 to 60.8 for SD, 69.9 to 74.4 for WS, and 72.3 to 73.5 for S+W. Total amounts (mg/㎡) of ammonia emissions were the lowest (p<0.05) in KE species among the pine species within each type of bedding material, having higher ability of ammonia absorption. In Exp II, KE species in both side A and B had lower moisture concentrations (%) than other species. Regardless of types of beddings except SD-AR, moisture concentrations of beddings within a pen were higher (p<0.01) at side A than B. Conclusion: The KE species has better physical characteristics than other beddings and more useful for rearing Hanwoo cattle than other beddings, probably caused by the differences in the method and degree of wood processing rather than the species.

• Journal of the Korean Vacuum Society
• /
• v.4 no.S2
• /
• pp.1-7
• /
• 1995

Cu(400$\AA$)/Polyimide has been mixed with 80 keV Ar+ and N2+from 1.0X1015ions/$\textrm{cm}^2$ to 2.0X1016 ions/$\textrm{cm}^2$. The changes of chemical bond and internal properties of sample are investigated by X-ray photoelectron spectroscopy(XPS). The quantitative adhesion strength is measured by using scratch test. The optimized mixing condition is that Cu/PI is irradiated with 80 keV N2+ at a dose of 1.0X1015 ions/$\textrm{cm}^2$, because N2+ ions can product more pyridine-like moiety, amide group, and tertiary amine moiety which are known as adesion promoters than Ar+.

• Proceedings of the Korean Institute of Surface Engineering Conference
• /
• 1999.10a
• /
• pp.59-59
• /
• 1999

In this study, planer inductively coupled $Cl_2$ based plasmas were used to etch InGaN and the effects of plasma conditions on the InGaN etch properties have been characterized using quadrupole mass spectrometry(QMS) and optical emission spectroscopy(OES). As process conditions used to study the effects of plasma characteristics on the InGaN etch properties, $Cl_2$ was used as the main etch gas and $CHF_3,{\;}CH_4$, and Ar were used as additive gases. Operational pressure was varied from SmTorr to 3OmTorr, inductive power and bias voltage were varied from 400W to 800W and -50V to -250V, respectively while the substrate temperature was fixed at 50 centigrade. For the $Cl_2$ plasmas, selective etching of GaN to InGaN was obtained regardless of plasma conditions. The small addition of $CHF_3$ or Ar to $Cl_2$ and the decrease of pressure generally increased InGaN etch rates. The selective etching of InGaN to GaN could be obtained by the reduction of pressure to l5mTorr in $CI_2/IO%CHF_3{\;}or{\;}CI_2/IO%Ar$ plasma. The enhancement of InGaN etch rates was related to the ion bombardment for $CI_2/Ar$ plasmas and the formation of $CH_x$ radicals for $CI_2/CHF_3(CH_4)$ plasmas.

• Proceedings of the KIEE Conference
• /
• 2003.07c
• /
• pp.1704-1706
• /
• 2003

Low-Pressure inductively coupled RF discharge sources have important industrial applications mainly because they can provide a high-density electrodeless plasma source with low ion energy and low power loss. In an inductive discharge, the RF power is coupled to the plasma by an electromagnetic interaction with the current flowing in a coil. In this paper, the experiments have been focussed on the electric characteristic and carried out using a single Langmuir probe. The internal electric characteristics of inductively coupled Ar RF discharge at 13.56 [MHz] have been measured over a wide range of power at gas pressure ranging from $1{\sim}70$ [mTorr].

• Proceedings of the KIEE Conference
• /
• 1994.07b
• /
• pp.1236-1238
• /
• 1994

TiAlN thin films were prepared by a multi target r.f magnetron sputtering system under different conditions. We have investigated the resistivity and T.C.R. (Temperature Coefficient of Resistance) characteristics of TiAlN films deposited on $Al_2O_3$ and glass substrates by sputtering in an $Ar:N_2$ gas mixture. We used Al and Ti metal as Target Material and $Ar:N_2$ gas as working gas. We varied the partial pressure ratio of $N_2/Ar$ from 0.2/7 to 1.0/6.2 (SCCM). And the R.F power of Ti and Al Target also were varied as 160/240, 200/200 and 240/160(W). In this experiment, we can get the precision thin film resistor with a very low T.C.R. (Temperature Coefficient of Resistance) below 25 ppm ${\Omega}/^{\circ}C$.

• Proceedings of the Korean Vacuum Society Conference
• /
• 2011.02a
• /
• pp.284-284
• /
• 2011

Recently, the increasing degree of device integration in the fabrication of Si semiconductor devices, etching processes of nano-scale materials and high aspect-ratio (HAR) structures become more important. Due to this reason, etch selectivity control during etching of HAR contact holes and trenches is very important. In this study, The etch selectivity and etch rate of TEOS oxide layer using ACL (amorphous carbon layer) mask are investigated various process parameters in CH2F2/C4F8/O2/Ar plasma during etching TEOS oxide layer using ArF/BARC/SiOx/ACL multilevel resist (MLR) structures. The deformation and etch characteristics of TEOS oxide layer using ACL hard mask was investigated in a dual-frequency superimposed capacitively coupled plasma (DFS-CCP) etcher by different fHF/ fLF combinations by varying the CH2F2/ C4F8 gas flow ratio plasmas. The etch characteristics were measured by on scanning electron microscopy (SEM) And X-ray photoelectron spectroscopy (XPS) analyses and Fourier transform infrared spectroscopy (FT-IR). A process window for very high selective etching of TEOS oxide using ACL mask could be determined by controlling the process parameters and in turn degree of polymerization. Mechanisms for high etch selectivity will discussed in detail.

• Journal of the Korean Ceramic Society
• /
• v.40 no.12
• /
• pp.1165-1169
• /
• 2003

The Ta$_2$O$_{5}$ thin film was deposited on Si-(III) and glass substrate with the change of Ar:O$_2$ gas flow rate in the assist ion gun by the Dual ion-Beam Sputtering (DIBS). As the $O_2$ gas flow of the assist ion gun was decreased, the deposition rate of the thin films decreased. The refractive index was fixed (2.11, at 1550 nm) without regarding to $O_2$ gas flow of the range 3∼12 sccm in assist ion gun. The condition of Ar:O$_2$=3:12 was formatted stoichiometry composition of Ta$_2$O$_{5}$ and the ms roughness was small (0.183 nm).

• Journal of the Korean Institute of Telematics and Electronics D
• /
• v.36D no.4
• /
• pp.56-62
• /
• 1999

In this study, (Ba, Sr)$TiO_3$ thin films were etched with $Cl_2$/Ar gas mixing ratio in an inductively coupled plasma (ICP) by varying the etching parameter such as rf power, dc bias voltage, and chamber pressure. The etch rate was 56 nm/min under $Cl_2$/($Cl_2$+Ar) gas mixing ratio of 0.2, rf power of 600 W, dc bias voltage of 250 V, and chamber pressure of 5 mTorr. At this time, the selectivity of BST to Pt, $SiO_2$ was respectively 0.52, 0.43. The surface reaction of the etched (Ba, Sr)$TiO_3$ thin films was investigated with X-ray photoelectron spectroscopy (XPS). Ba is removed by chemical reaction between Sr and Cl to remove Sr. Ti is removed by chemical reaction such as $TiCl_4$ with ease. The results of secondary ion mass spectrometer (SIMS) analysis compared with the results of XPS analysis and the results were the same.

• The Korean Journal of Applied Statistics
• /
• v.24 no.2
• /
• pp.307-313
• /
• 2011

In this paper, we compare performance of three models. The Holt-Winters, FARIMA and ARGARCH models, are used in predicting internet traffic data for analysis of traffic characteristics. We first introduce the time series models and apply them to real traffic data to forecast. Finally, we examine which model is the most suitable for explaining the long memory, the characteristics of the traffic material, and compare the respective prediction performance of the models.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
• /
• 1997.11a
• /
• pp.309-312
• /
• 1997

The Ce-Cr(-Ta) film are one of the most suitable candidates for perpendicular magnetic media. the control of the preparation conditions, such as Ar gas pressure P$\_$Ar/ substrates temperature T$\_$s/, films thickness $\delta$, deposition speed R$\_$d/, is considered to be important to attain ultra high density recording far perpendicular magnetic recording media. In this study, the Co-Cr thin films and Co-Cr-Ta thin films were deposited on the glass side substrates by using Facing Targets Sputtering apparatus(FTS). Crystallographic characteristics and magnetic characteristics were evaluated by X-ray diffractometry(XRD), Vibrating Sample Magnetometer(VSM) respectively.