• 한국전기전자재료학회논문지
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• 제16권8호
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• pp.700-704
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• 2003

This paper describes on characteristics of 2" 3C-SiC wafer bonding using PECVD (plasma enhanced chemical vapor deposition) oxide and HF (hydrofluoride acid) for SiCOI (SiC-on-Insulator) structures and MEMS (micro-electro-mechanical system) applications. In this work, insulator layers were formed on a heteroepitaxial 3C-SiC film grown on a Si (001) wafer by thermal wet oxidation and PECVD process, successively. The pre-bonding of two polished PECVD oxide layers made the surface activation in HF and bonded under applied pressure. The bonding characteristics were evaluated by the effect of HF concentration used in the surface treatment on the roughness of the oxide and pre-bonding strength. Hydrophilic character of the oxidized 3C-SiC film surface was investigated by ATR-FTIR (attenuated total reflection Fourier transformed infrared spectroscopy). The root-mean-square suface roughness of the oxidized SiC layers was measured by AFM (atomic force microscope). The strength of the bond was measured by tensile strength meter. The bonded interface was also analyzed by IR camera and SEM (scanning electron microscope), and there are no bubbles or cavities in the bonding interface. The bonding strength initially increases with increasing HF concentration and reaches the maximum value at 2.0 ％ and then decreases. These results indicate that the 3C-SiC wafer direct bonding technique will offers significant advantages in the harsh MEMS applications.ions.

• 대한전기학회논문지:전기물성ㆍ응용부문C
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• 제52권7호
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• pp.288-292
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• 2003

AlM thin film has been deposited on A1$_2$O$_3$ substrate by reactive radio frequency(RF) magnetron sputtering method under various operating conditions such as working pressure, fraction of nitrogen partial pressure, and substrate temperature. Scanning Electron Microscope(SEM), X-ray Diffraction(XRD), and Atomic Force Microscope(AFM) have been measured to find out structural properties and preferred orientation of AlN thin films. SAW velocity of IDTs/AlN/Si structure was about 5038［㎧］ at the center frequency of 251.9［MHz］ and insertion loss was measured to be relatively low value of 35.6［dB］. SAW velocity of IDTs/AlN/A1$_2$O$_3$ structure was improved to be about 5960［㎧］ at the center frequency of 296.7［MHz］.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2013년도 제45회 하계 정기학술대회 초록집
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• pp.318.2-318.2
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• 2013

기존의 염료감응형 태양전지(Dye Sensitized Solar Cells; DSSCs)는 최대 효율 11~12%의 광전변환효율을 가지고 있다. 이러한 한계를 극복하기 위해서 광흡수 층 최적화, 상대전극의 촉매성 증대, 전해질의 산화 환원 반응 최적화 등의 많은 연구가 이루어지고 있다. 본 연구에서는 DSSCs의 광전변환효율을 증가시키고자 기존의 투명전극 및 기판으로 사용되는 FTO(Fluor-doped Tin Oxide)를 GZO(Gallium-doped Zinc Oxide)를 사용하여 투명전극기판에 따른 계면 저항, 전류손실 등 DSSCs에 미치는 영향을 분석하였다. 본 연구에 사용된 FTO는 ${\sim}7{\Omega}/{\square}$의 면저항과 80%이상의 투과도를 갖고 있으나 Ion-Sputtering 법으로 증착된 GZO는 열처리 과정을 통하여 $3{\sim}4{\Omega}/{\square}$의 면 저항을 나타내고 80%이상의 우수한 투과도를 가지고 있다. 이러한 두 기판의 특성 비교를 위해, UV-Visble Spectrophotometer를 사용하여 광학적 특성을 분석하고, SEM(Scanning Electron Microscope), AFM(Atomic Force Microscope)를 사용하여 표면 특성을 평가하였다. 또한 전기적 특성을 분석하기 위하여 4-Point-probe를 이용하여 면 저항을 측정하였고, DSSCs의 효율 및 Fill Factor를 분석하기 위하여 Solar Simulator의 I-V measurement를 이용하였다.

• 한국재료학회지
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• 제19권6호
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• pp.344-348
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• 2009

The electrolyte effects of the electroplating solution in Cu films grown by ElectroPlating Deposition(EPD) were investigated. The electroplated Cu films were deposited on the Cu(20 nm)/Ti (20 nm)/p-type Si(100) substrate. Potentiostatic electrodeposition was carried out using three terminal methods: 1) an Ag/AgCl reference electrode, 2) a platinum plate as a counter electrode, and 3) a seed layer as a working electrode. In this study, we changed the concentration of a plating electrolyte that was composed of $CuSO_4$, $H_2SO_4$ and HCl. The resistivity was measured with a four-point probe and the material properties were investigated by using XRD(X-ray Diffraction), an AFM(Atomic Force Microscope), a FE-SEM(Field Emission Scanning Electron Microscope) and an XPS(X-ray Photoelectron Spectroscopy). From the results, we concluded that the increase of the concentration of electrolytes led to the increase of the film density and the decrease of the electrical resistivity of the electroplated Cu film.

• 한국진공학회:학술대회논문집
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• 한국진공학회 2010년도 제39회 하계학술대회 초록집
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• pp.65-65
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• 2010

Extreme ultraviolet lithography (EUVL) is expected to be applied for making patterns below 32 nm in device industry. An ultrathin EUV photoresist (PR) of a few nm in thickness is required to reduce minimum feature size further. Here, we show that pentacene molecular layers can be employed as a new EUV resist for the first time. Dots and lines in nm scale are successfully realized using the new molecular resist. We clearly provide the mechanism for forming the nanopatterns with scanning photoemission microscope (SPEM), EUV interference lithography (EUV-IL), atomic force microscope (AFM), photoemission spectroscopy (PES), etc. The molecular PR has several advantages over traditional polymer EUV PRs; for example, high thermal/chemical stability, negligible outgassing, ability to control the height and width on the nanometer scale, leaving fewer residuals, no need for a chemical development process and thus reduction of chemical waste to make the nanopatterns. Besides, it could be applied to any substrate to which pentacene bonds chemically, such as $SiO_2$, SiN, and SiON, which is of importance in the device industry.

• 한국전기전자재료학회논문지
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• 제35권4호
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• pp.348-352
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• 2022

Resistive switching behaviors of a co-sputtered zinc silicate thin film (ZnO and SiO₂ targets) have been investigated. We fabricated an Ag/ZnSiO_x/highly doped n-type Si substrate device by using an RF magnetron sputter system. X-ray diffraction pattern (XRD) indicated that the Zn₂SiO₄ was formed by a post annealing process. A unique morphology was observed by scanning electron microscope (SEM) and atomic force microscope (AFM). As a result of annealing process, 50 nm sized nano clusters were formed spontaneously in 200~300 nm sized grains. The device showed a unipolar resistive switching process. The average value of the ratio of the resistance change between the high resistance state (HRS) and the low resistance state (LRS) was about 106 when the readout voltage (0.5 V) was achieved. Resistance ratio is not degraded during 50 switching cycles. The conduction mechanisms were explained by using Ohmic conduction for the LRS and Schottky emission for the HRS.

• 한국결정성장학회지
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• 제21권2호
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• pp.65-69
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• 2011

RF 마그네트론 스퍼터링으로 가스조성비와 기판의 온도를 변화시키면서 $Tio_2$ 박막을 성장하였다. XRD, SEM, AFM 및 분광 광도계를 이용하여 박막의 구조와 광학적 특성을 고찰하였다. 박막에는 아나타제 결정성만 관찰되었으며 온도가 높아질수록 회절 피크의 강도가 증가하였다. 산소농도가 증가함에 따라 기둥구조의 결정성장률이 감소되었으며 굴절률과 흡수율은 감소하였다. $Tio_2$ 박막은 300~400oC의 기판온도와 10 %의 $O_2$ 분위기에서 성장한 박막의 표면이 매끄럽고 투과특성이 우수한 $300{\sim}400^{\circ}C$ 박막을 얻을 수 있었다.

• 접착 및 계면
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• 제12권1호
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• pp.26-33
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• 2011

폴리케톤 필름의 산처리 조건에 따른 필름 표면의 화학적인 변화를 접촉각과 XPS를 이용하여 분석하고, 모폴로지의 변화를 SEM과 AFM을 통하여 살펴보고, 최종적으로 이러한 변화가 폴리케톤 필름과 고무와의 계면접착력에 어떠한 영향을 미치는지를 살펴보았다. 인산처리에 의하여 폴리케톤 필름의 표면에 젖음성이 증가하여 인산의 농도 및 처리시간에 따라서 접촉각이 감소하였으며, 표면에 산소함유기들이 증가하는 결과를 보였다. 인산농도와 처리시간이 증가함에 따라 표면에 crack과 etching이 증가하여 표면거칠기가 증가하였으나, 산처리 조건이 강화되면서 폴리케톤 필름의 표면에 degradation이 발생하여 roughness가 감소하는 결과를 보였다. 폴리케톤과 고무와의 계면접착력을 살펴본 결과, pH 0.74에서 120 min, pH 0.4에서 60 min 처리한 경우에 최대 계면접착력을 보였으며, 산처리 조건이 그 이상으로 증가하면서 degradation이 발생하면서 계면접착력이 감소하였다.

• 접착 및 계면
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• 제13권1호
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• pp.24-30
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• 2012

폴리아릴레이트(polyarylate, PAR) 섬유의 산 처리와 자외선 조사 처리에 의한 섬유표면의 미세구조 변화를 SEM과 AFM을 통하여 살펴보고 RMS roughness로 분석하였으며, 접촉각 측정을 하였다. 또한, PAR 섬유의 표면개질이 폴리에틸렌 나프탈레이트(polyethylene naphthalate, PEN) 수지와의 계면접착력에 어떠한 영향을 미치는지를 섬유 풀-아웃 시험(Fiber Pull-out)을 통해 분석하였다. 산처리 농도와 자외선 조사 처리 시간이 증가함에 따라 PAR 섬유의 표면에 에칭이나 크랙이 발생하면서 표면의 거칠기가 증가하는 양상을 보였으며, 물에 대한 접촉각은 감소하는 결과를 보였다. PEN 수지와의 계면접착력을 분석한 결과, 산 처리 농도의 증가와 자외선 조사처리 시간이 경과에 따라 증가하였고 특히, 산 처리 농도 pH 3, 자외선 조사 처리시간이 24 h일 때 최대 계면접착력을 보였다. 이는 섬유표면조도의 증가에 따른 섬유 표면적의 증가로, 계면에서 상호작용할 수 있는 면적이 증가하기 때문이라고 볼 수 있다.

• 한국전기전자재료학회논문지
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• 제27권8호
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• pp.486-490
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• 2014

$Al_2O_3$ films on silicon carbide were fabricated by Aerosol deposition with annealing temperature at $800^{\circ}C$ and $1,000^{\circ}C$. The effect of thermal treatment on physical properties of $Al_2O_3$ thin films has been investigated by XRD (X-ray diffraction), AFM (atomic force microscope), SEM (scanning electron microscope), and AES (auger electron spectroscopy). Also electrical properties have been investigated by Keithley 4,200 semiconductor parameter analyzer to explain the interface trapped charge density ($D_{it}$), flatband voltage ($V_{FB}$) and leakage current ($I_o$). $Al_2O_3$ films become crystallized with increasing temperature by calculating full width at half maximum (FWHM) of diffraction peaks, also surface morphology is observed by topography measurement in non-contact mode AFM. $D_{it}$ was $2.26{\times}10^{-12}eV^{-1}.cm^{-2}$ at $800^{\circ}C$ annealed sample, which is the lowest value in all samples. Also the sample annealed at $800^{\circ}C$ has the lowest leakage current of $4.89{\times}10^{-13}A$.