• Title/Summary/Keyword: ABCD Matrices

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Crosstalk Analysis of Coupled Lines Connected with Vias in a 4-Layer PCB (4층 기판에서 비아로 연결된 결합 선로의 누화 해석)

  • Han Jae-Kwon;Park Dong-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.17 no.6 s.109
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    • pp.529-537
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    • 2006
  • Multi-layer PCBs are of ien used In compact microwave circuit design as density of PCB layout is increased. In this paper, the crosstalk between coupled lines connected with vias in a 4-layer PCB is investigated theoretically based on the circiuit-concept approach. Coupled lines connected with vias in a 4-layer PCB are divided into three sections, which are coupled microstrip lines and upper via section, center via section, and lower via and coupled microstrip lines section, respectively. Each section is represented by ABCD matrix. By cascading these three ABCD matrices crosstalk between coupled lines connected with vias in a 4-layer PCB is approximately calculated. The validity of this theoretical approach is verified by comparing the calculated results with the simulated ones using HFSS.

New Analysis Method for Wireless Power Transfer System with Multiple n Resonators

  • Kim, Ju-Hui;Park, Byung-Chul;Lee, Jeong-Hae
    • Journal of electromagnetic engineering and science
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    • v.13 no.3
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    • pp.173-177
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    • 2013
  • This paper presents a new method for analyzing the maximum efficiency of a wireless power transfer (WPT) system with multiple n resonators. The method is based on ABCD matrices and allows transformation of the WPT system with multiple n resonators into a single two-port network system. The general maximum efficiency equation of a WPT system with multiple n resonators is derived using the ABCD matrix. Use of this equation allows placement of the relay resonators for maximum efficiency even though they are asymmetrical. The general maximum efficiency equation and the method of the optimum placement are verified by a full wave simulation. The results show that the method is useful for the analysis of a WPT system with relay resonators.

Analysis of Crosstalk Reduction by Metal Filled Via Hole Fence in Bent Transmission Lines (구부러진 전송선에서 비아 홀 펜스에 의한 누화 감소 해석)

  • Kim Jong-Ho;Han Jae-Kwon;Park Dong-Chul
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.10 s.101
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    • pp.1036-1042
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    • 2005
  • The crosstalk between bent transmission lines and the effects of additional trace with the metal filled via holes on alleviating the crosstalk are investigated using the circuit concept approach for transmission line sections and impedance modeling for via hole sections. All sections are represented by ABCD matrices and then cascaded. Finally the calculated results by proposed method are confirmed that they agree with the measured results in less than 3 dB except a band of low frequency.

Extraction of Electrical Parameters for Single and Differential Vias on PCB (PCB상 Single 및 Differential Via의 전기적 파라미터 추출)

  • Chae Ji Eun;Lee Hyun Bae;Park Hon June
    • Journal of the Institute of Electronics Engineers of Korea SD
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    • v.42 no.4 s.334
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    • pp.45-52
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    • 2005
  • This paper presents the characterization of through hole vias on printed circuit board (PCB) through the time domain and frequency domain measurements. The time domain measurement was performed on a single via using the TDR, and the model parameters were extracted by the fitting simulation using HSPICE. The frequency domain measurement was also performed by using 2 port VNA, and the model parameters were extracted by fitting simulation with ADS. Using the ABCD matrices, the do-embedding equations were derived probing in the same plane in the VNA measurement. Based on the single via characterization, the differential via characterization was also performed by using TDR measurements. The time domain measurements were performed by using the odd mode and even mode sources in TDR module, and the Parameter values were extracted by fitting with HSPICE. Comparing measurements with simulations, the maximum calculated differences were $14\%$ for single vias and $17\%$ for differential vias.

Implementation of an Adaptive Equalizer for the Home Phone Lines (댁내 전화 선로의 적응형 등화기 구현)

  • 이성현;은창수;김홍석
    • The Journal of Korean Institute of Communications and Information Sciences
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    • v.26 no.11A
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    • pp.1820-1826
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    • 2001
  • In this paper, we present a modeling scheme for the already-installed two-wire home phone lines with arbitrary topologies and show that the inter-symbol interference due to the topology can be removed using an adaptive equalizer. The transmission characteristics of the arbitrary-configured two-wire home phone lines can be analyzed through the ABCD matrices. The simulation result shows that the impedance mismatch due to the branch lines renders nulls in the frequency response or delayed pulses in the impulse response. These nulls or delayed pulses cause inter-symbol interference that inhibits correct signal detection. An adaptive equalizer is shown to be effective in eliminating the interference. Also, the simulation result shows that the equalizer converges in 1.5 ms at a data rate of 1 Msps at signal-to-noise ratios greater than 15 dB. In addition, from the result of relation between E$\_$b//N$\_$and BER(Bit Error Rate), we can see that E$\_$b//N$\_$o/ more than 19 dB is required for the data communication with a BER less than 10$\^$-5/.

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