• Journal of the Korean Solar Energy Society
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• v.36 no.2
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• pp.53-63
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• 2016

Building Integrated Photovoltaic (BIPV) is one of the best ways to generate electric power using the solar energy, which is clean and inexhaustible energy resources. The most of BIPV modules have the form of GtoG (Glass to Glass) photovoltaic in building applications. Degradation leading to failure in photovoltaic modules is very important factor in BIPV modules. This paper analyzed the performance of various BIPV modules through outdoor exposure tests. Performance of three BIPV modules(c-Si type, a-Si type and DSSC type) with three installation angles influenced by sun light, outdoor temperature, and wind velocity was monitored and analyzed. As a result, c-Si type BIPV module outperforms other BIPV modules(a-Si type). In terms of power efficiency of the module, the installed angle of $45^{\circ}$ is better than others(90 degree, 0 degree). In addition, more realistic data of various BIPV system performance could be available through the field test and integrated building test. In this study, relationship of the BIPV system is identified module's installation angle, power generation, architectural performance, etc.

• Journal of the Korean Institute of Illuminating and Electrical Installation Engineers
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• v.23 no.12
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• pp.75-82
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• 2009

In this thesis, presented module choice plan that analyze relation with weather condition (work trillion amounts, mean air temperature, precipitation, cloudiness, wind speed etc.) because diagnoses June output amount of 247.5[kW] bulk type module and a-Si type module that is established in equal environment in our country and is the high effectiveness enemy more by climate fluctuation by latest global warming back.

• Proceedings of the Korean Institute of IIIuminating and Electrical Installation Engineers Conference
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• 2009.05a
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• pp.67-71
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• 2009

In this treatise, presented module choice plan that analyze relation with meteorological condition (work trillion amounts, mean air temperature, precipitation, cloudiness, wind speed etc.) because diagnoses June output amount of 247.5kW bulk type module and a-Si type module that is established in equal environment in our country and is the high effectiveness enemy more by climate fluctuation by latest global warming back.

• Current Photovoltaic Research
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• v.11 no.4
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• pp.114-117
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• 2023

Transparent Photovoltaic (PV) modules have recently been in the spotlight because they can be applied to buildings and vehicles. However, crystalline silicon (c-Si) solar modules, which account for about 90% of the PV module market, have the disadvantage of applying transparent PV modules due to their unique opacity. Recently, a see-through type PV module using a crystalline silicon solar strap has been developed. However, there is a problem due to a decrease in aesthetics due to the metal ribbon in the center of the see-through type PV module and difficulty bonding the metal ribbon due to the low voltage output of the strap. In this study, to solve this problem, we developed a fabrication process of series connected c-Si solar strap cells using the c-Si solar cells. We succeeded in fabricating a series connected strap with a width of 2-10 mm, and we plan to manufacture an aesthetic see-through type c-Si PV module.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.31 no.3
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• pp.182-187
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• 2018

In this study, 20.8% of a p-type Si bifacial solar cell was used to develop a photovoltaic (PV) module to obtain the maximum power under a limited installation area. The transparent back sheet material was replaced during fabrication with a white one, which is opaque in commercial products. This is very beneficial for the generation of more electricity, owing to the additional power generation via absorption of light from the rear side. A new model is suggested herein to predict the power of the bifacial PV module by considering the backside reflections from the roof and/or environment. This model considers not only the frontside reflection, but also the nonuniformity of the backside light sources. Theoretical predictions were compared to experimental data to prove the validity of this model, the error range for which ranged from 0.32% to 8.49%. Especially, under $700W/m^2$, the error rate was as low as 2.25%. This work could provide theoretical and experimental bases for application to a distributed and microgrid network.

• Journal of Welding and Joining
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• v.33 no.3
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• KIEAE Journal
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• v.11 no.3
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• pp.69-73
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• 2011

In general, there are two types of PVT module depending on the existence of the glass in front of PV module: glazed and unglazed. On the other hand, the water-type PVT modules can be classified into two types, according to absorber type: the sheet-and-tube absorber PVT module and the fully wetted absorber PVT module. The aim of this study is to analyze the electrical and thermal performance of a water-type PVT module with fully wetted absorber. For this study, a prototype of unglazed PVT module with fully wetted absorber was designed and built, and both the thermal and electrical performances of the prototype module were measured in outdoor conditions. A conventional mono-crystalline Si PV module was tested alongside the PVT module for their electrical performance comparison. The results showed that the thermal efficiency of the PVT module was average 51% and its electrical efficiency was average 14.3% in mean fluid temperature $10-40^{\circ}C$, whereas the electrical efficiency of the conventional PV module was average 12.6%. It is found that the electrical efficiency of the PVT module was improved by approximately 14% compared to that of the PV module. The temperature of PVT module becomes lower due to the cooling effect by the fluid of the absorber. The results proved that the electrical efficiency was higher when the mean fluid temperature was lower.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1105-1111
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• 2006

In this paper, using low-temperature co-fired ceramic(LTCC) based system-in-package(SiP) technology, a very compact power amplifier LTCC module was designed, fabricated, and then characterized for 60 GHz wireless transmitter applications. In order to reduce the interconnection loss between a LTCC board and power amplifier monolithic microwave integrated circuits(MMIC), bond-wire transitions were optimized and high-isolated module structure was proposed to integrate the power amplifier MMIC into LTCC board. In the case of wire-bonding transition, a matching circuit was designed on the LTCC substrate and interconnection space between wires was optimized in terms of their angle. In addition, the wire-bonding structure of coplanar waveguide type was used to reduce radiation of EM-fields due to interconnection discontinuity. For high-isolated module structure, DC bias lines were fully embedded into the LTCC substrate and shielded with vias. Using 5-layer LTCC dielectrics, the power amplifier LTCC module was fabricated and its size is $4.6{\times}4.9{\times}0.5mm^3$. The fabricated module shows the gain of 10 dB and the output power of 11 dBm at P1dB compression point from 60 to 65 GHz.

• Membrane Journal
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• v.6 no.1
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• pp.44-52
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• 1996

For the purpose of the optimal design of a frame and plate type of pervaporation module, model equations which can predict the effects of feed flow condition on the temperature distribution of the feed developed in the module were established and the temperature distribution with feed flow condition was investigated through the model si$$\mu$ation. With increasing the Reynolds number of feed flow in the module, the flow velocity gradient in the channel height-direction as well as the volume rate of feed which acts as energy source for the evaporation of perrneants on the permeate-side surface of a membrane increased to such an extent that both mass and heat flux in the channel height direction could increase and the temperature drop of feed due to the evaporation of the permeant could be reduced correspondingly. A decrease in channel height caused the temperature drop of feed because of decreasing feed flow in the module. It was observed that the si$$\mu$ation result on the effect of Re on the temperature distribution of feed in the module has an agreement with experiment.

• Current Photovoltaic Research
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• v.8 no.1
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• pp.12-16
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• 2020

This study investigates the degradation characteristics of different material types of ethyl vinyl acetate (EVA) and polyolefin (POE) with combining transparent backsheet. To this end, we fabricated samples with structure of glass/encapsulant/transparent backsheet for each type of encapsulants, and shingled Si modules with the same structure. The samples were then subjected to accelerated test by storing under damp heat condition of 85℃ and 85% RH. As a result, encaplsulant discoloration was observed, which the transmittance of the samples with EVA decreased in a rapid rate than the samples with POE. The discoloration also affected a power degradation of the shingled modules with a reduction of current density, resulting that the module with EVA showed more drop on the efficiency than the modules with POE. Furthermore, corrosion of the soldered ribbon caused by acetic acid produced from the degraded EVA also contributed in fill factor reduction.