• 한국태양에너지학회 논문집
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• 제36권2호
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• pp.53-63
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• 2016

Building Integrated Photovoltaic (BIPV) is one of the best ways to generate electric power using the solar energy, which is clean and inexhaustible energy resources. The most of BIPV modules have the form of GtoG (Glass to Glass) photovoltaic in building applications. Degradation leading to failure in photovoltaic modules is very important factor in BIPV modules. This paper analyzed the performance of various BIPV modules through outdoor exposure tests. Performance of three BIPV modules(c-Si type, a-Si type and DSSC type) with three installation angles influenced by sun light, outdoor temperature, and wind velocity was monitored and analyzed. As a result, c-Si type BIPV module outperforms other BIPV modules(a-Si type). In terms of power efficiency of the module, the installed angle of $45^{\circ}$ is better than others(90 degree, 0 degree). In addition, more realistic data of various BIPV system performance could be available through the field test and integrated building test. In this study, relationship of the BIPV system is identified module's installation angle, power generation, architectural performance, etc.

• 조명전기설비학회논문지
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• 제23권12호
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• pp.75-82
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• 2009

본 논문에서는 우리나라에서 동일한 환경에 설치되어 있는 247.5[kW] bulk형 모듈과 a-Si형 모듈의 6월 발전량을 조사 분석하여 기상조건(일조량, 평균기온, 강수량, 운량, 풍속 등)과의 관계를 분석하고 최근 지구온난화 등으로 인한 기후변화에 따라 보다 고효율적인 모듈 산정방안을 제시하였다.

• 한국조명전기설비학회:학술대회논문집
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• 한국조명전기설비학회 2009년도 춘계학술대회 논문집
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• pp.67-71
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• 2009

본 논문에서는 우리나라에서 동일한 환경에 설치되어 있는 247.5kW bulk형 모듈과 a-Si형 모듈의 6월 발전량을 조사 분석하여 기상조건(일조량, 평균기온, 강수량, 운량, 풍속 등)과의 관계를 분석하고 최근 지구온난화 등으로 인한 기후변화에 따라 보다 고효율적인 모듈 산정방안을 제시하였다.

• Current Photovoltaic Research
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• 제11권4호
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• pp.114-117
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• 2023

Transparent Photovoltaic (PV) modules have recently been in the spotlight because they can be applied to buildings and vehicles. However, crystalline silicon (c-Si) solar modules, which account for about 90% of the PV module market, have the disadvantage of applying transparent PV modules due to their unique opacity. Recently, a see-through type PV module using a crystalline silicon solar strap has been developed. However, there is a problem due to a decrease in aesthetics due to the metal ribbon in the center of the see-through type PV module and difficulty bonding the metal ribbon due to the low voltage output of the strap. In this study, to solve this problem, we developed a fabrication process of series connected c-Si solar strap cells using the c-Si solar cells. We succeeded in fabricating a series connected strap with a width of 2-10 mm, and we plan to manufacture an aesthetic see-through type c-Si PV module.

• 한국전기전자재료학회논문지
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• 제31권3호
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• pp.182-187
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• 2018

In this study, 20.8% of a p-type Si bifacial solar cell was used to develop a photovoltaic (PV) module to obtain the maximum power under a limited installation area. The transparent back sheet material was replaced during fabrication with a white one, which is opaque in commercial products. This is very beneficial for the generation of more electricity, owing to the additional power generation via absorption of light from the rear side. A new model is suggested herein to predict the power of the bifacial PV module by considering the backside reflections from the roof and/or environment. This model considers not only the frontside reflection, but also the nonuniformity of the backside light sources. Theoretical predictions were compared to experimental data to prove the validity of this model, the error range for which ranged from 0.32% to 8.49%. Especially, under $700W/m^2$, the error rate was as low as 2.25%. This work could provide theoretical and experimental bases for application to a distributed and microgrid network.

• Journal of Welding and Joining
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• 제33권3호
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• pp.19-24
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• 2015

Joint properties of electric control unit (ECU) module using Sn-Cu-(X)Al(Si) lead-free solder alloy were investigated for automotive electronics module. In this study, Sn-0.5Cu-0.01Al(Si) and Sn-0.5Cu-0.03Al(Si) (wt.%) lead-free alloys were fabricated as bar type by doped various weight percentages (0.01 and 0.03 wt.%) of Al(Si) alloy to Sn-0.5Cu. After fabrications of lead-free alloys, the ball-type solder alloys with a diameter of 450 um were made by rolling and punching. The melting temperatures of 0.01Al(Si) and 0.03Al(Si) were 230.2 and $230.8^{\circ}C$, respectively. To evaluation of properties of solder joint, test printed circuit board (PCB) finished with organic solderability perseveration (OSP) on Cu pad. The ball-type solders were attached to test PCB with flux and reflowed for formation of solder joint. The maximum temperature of reflow was $260^{\circ}C$ for 50s above melting temperature. And then, we measured spreadability and shear strength of two Al(Si) solder materials compared to Sn-0.7Cu solder material used in industry. And also, microstructures in solder and intermetallic compounds (IMCs) were observed. Moreover, thickness and grain size of $Cu_6Sn_5$ IMC were measured and then compared with Sn-0.7Cu. With increasing the amounts of Al(Si), the $Cu_6Sn_5$ thickness was decreased. These results show the addition of Al(Si) could suppress IMC growth and improve the reliability of solder joint.

• KIEAE Journal
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• 제11권3호
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• pp.69-73
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• 2011

In general, there are two types of PVT module depending on the existence of the glass in front of PV module: glazed and unglazed. On the other hand, the water-type PVT modules can be classified into two types, according to absorber type: the sheet-and-tube absorber PVT module and the fully wetted absorber PVT module. The aim of this study is to analyze the electrical and thermal performance of a water-type PVT module with fully wetted absorber. For this study, a prototype of unglazed PVT module with fully wetted absorber was designed and built, and both the thermal and electrical performances of the prototype module were measured in outdoor conditions. A conventional mono-crystalline Si PV module was tested alongside the PVT module for their electrical performance comparison. The results showed that the thermal efficiency of the PVT module was average 51% and its electrical efficiency was average 14.3% in mean fluid temperature $10-40^{\circ}C$, whereas the electrical efficiency of the conventional PV module was average 12.6%. It is found that the electrical efficiency of the PVT module was improved by approximately 14% compared to that of the PV module. The temperature of PVT module becomes lower due to the cooling effect by the fluid of the absorber. The results proved that the electrical efficiency was higher when the mean fluid temperature was lower.

• 한국전자파학회논문지
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• 제17권11호
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• pp.1105-1111
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• 2006

본 논문에서는 저온 소성 세라믹(LTCC)에 기초한 SiP 기술을 이용하여 60 GHz 무선 통신을 위한 송신기용 초소형 전력 증폭기 LTCC모듈을 설계 및 제작하여 그 특성을 측정하였다. 60 GHz대역에서 LTCC 다층 기판과 전력 증폭기 MMIC의 상호 연결 손실을 줄이기 위해 와이어 본드와 기판 사이의 천이를 최적화하였고, MMIC 집적을 위한 고 격리 구조를 제안하였다. 와이어 본드 천이의 경우, 와이어의 인덕턴스를 감소시키기 위해 매칭 회로의 설계와 와이어 상호간의 간격을 최적화하였다. 또한 상호 연결 불연속 효과로 인한 전계의 방사를 억제하기 위해 코프라나 와이어 본드 구조를 이용하였다. 고 격리 모듈 구조를 위하여, LTCC 기판 내부에 DC 전원 배선을 내장시키고 비아로 그 주위를 차폐를 시켰다. 5층의 LTCC 기판을 사용하여 제작된 전력 증폭기 LTCC모듈의 크기는 $4.6{\times}4.9{\times}0.5mm^3$이고, $60{\sim}65GHz$ 대역에서 이득과 P1dB 출력 전력은 각각 10 dB와 11 dBm이다.

• 멤브레인
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• 제6권1호
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• pp.44-52
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• 1996

평판형 모듈 설계의 최적화를 목적으로 feed 흐름 조건에 따른 feed 온도 및 유속분포를 예측할 수 있는 모델식을 확립하였고 모델 모사를 통해 흐름 조건들이 온도 분포에 끼치는 영향들을 조사하였다. 모델내의 유체의 Re 크기가 커지면 채널 두께방향으로의 유속 구배가 커질 뿐 아니라 투과물 증발을 위한 에너지원인 feed 흐름 속도가 커져 물질 및 열흐름이 증가하여 투과물 증발로 인한 feed 온도 강하가 증어든다. 반면에 채널 간격이 작아지면 feed 흐름량이 상대적으로 작아져 급격한 온도 강하를 야기시킨다. Re 크기에 따른 feed 온도 변화는 실험결과와 일치함이 관찰되었다.

• Current Photovoltaic Research
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• 제8권1호
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• pp.12-16
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• 2020

This study investigates the degradation characteristics of different material types of ethyl vinyl acetate (EVA) and polyolefin (POE) with combining transparent backsheet. To this end, we fabricated samples with structure of glass/encapsulant/transparent backsheet for each type of encapsulants, and shingled Si modules with the same structure. The samples were then subjected to accelerated test by storing under damp heat condition of 85℃ and 85% RH. As a result, encaplsulant discoloration was observed, which the transmittance of the samples with EVA decreased in a rapid rate than the samples with POE. The discoloration also affected a power degradation of the shingled modules with a reduction of current density, resulting that the module with EVA showed more drop on the efficiency than the modules with POE. Furthermore, corrosion of the soldered ribbon caused by acetic acid produced from the degraded EVA also contributed in fill factor reduction.