• Information and Communications Magazine
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• v.27 no.2
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• pp.27-31
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• 2010

Tera 대역으로 일반적으로 여겨지는 300 ~ 3000GHz 대역을 이용하여 무선 근거리 개인 영역 통신 (WPAN) 에서 20~40Gbps 급의 데이터 통신을 하기 위한 국제 표준화가 현재 IEEE802.15표준화 그룹에서 진행 중이다. 본 논문에서는 표준화의 진행 상항과 더불어 테라 대역의 주파수 할당, 물리계층에서 테라 대역을 이용하여 WPAN이 가능하기 위한 요소 기술로서 빔포밍 기법에 대하여 정리한다. 주파수 할당은 비허가 주파수 대역의 가능성 여부 및 시기 등에 대하여 지난 수년간 테라 대역과 관련되어 ITU에서 발표된 문서들을 요약한다. 테라 대역에서 WPAN을 위한 물리계층의 요소 기술로서는 테라 대역의 주파수 특성인 전파의 직진성 및 거리에 따른 전력 감쇄를 극복하기 위하여 저전력 빔포밍 기술에 대하여 소개한다. 본 논문은 향후 약 5년 후에 표준화가 완성될 것으로 예상되는 시점에서 국내의 통신 관련 연구자에게 초고속 데이터 통신을 가능하기 위한 테라 대역 WPAN시스템을 준비하는데 있어서 유용한 자료로서 사용될 수 있을 것이라 여겨진다.

• ETRI Journal
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• v.40 no.1
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• pp.89-100
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• 2018

Millimeter wave communication is one of the main disruptive technologies in upcoming 5G mobile networks. One of the first candidate applications, which will be commercially ready by 2020, is wireless backhaul links or wireless last mile communication. This paper provides an analysis of this use-case from radio engineering and implementation perspectives. Furthermore, preliminary experimental results are shown for a proof-of-concept wireless backhaul solution developed within the EU-KR 5GCHAMPION project, which will be showcased during the 2018 Winter Olympic Games in Korea. In this paper, we verify system level calculations and a theoretical link budget analysis with conductive and radiated over-the-air measurements. The results indicate that the implemented radio solution is able to achieve the target key performance indicator, namely, a 2.5 Gbps data rate on average, over a range of up to 200 m.

• Journal of information and communication convergence engineering
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• v.17 no.4
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• pp.227-233
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• 2019

In long-haul optical communication system consisting of standard single-mode fiber spans and fiber amplifiers, such as the erbium-doped fiber amplifier, performance is deteriorated by signal distortion due to chromatic dispersion and nonlinearity of the fiber. A combination of dispersion management and optical phase conjugation is an effective technique to compensate for the distortion. In an optical link configured by this combination, a dispersion map mainly affects the compensation of the distorted optical signals. This paper proposes new dispersion maps configured by the decaying or expanding distribution of residual dispersion per span (RDPS) in a dispersion-managed link combined with a midway optical phase conjugator. The effect of the proposed dispersion maps on the compensation for distorted 24 channel × 40 Gbps wavelength-division multiplexed signals was assessed through numerical simulation. It was confirmed that all the proposed dispersion maps are most appropriate for the compensation and, furthermore, for the flexibility of link configuration than conventional links.

• ETRI Journal
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• v.26 no.6
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• pp.589-596
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• 2004

Packaging technologies for a broadband and narrowband modulator with a traveling wave electro-absorption modulator (TWEAM) device were developed. In developing a broadband modulator, the effects of the device and packaging designs on the broadband performance were investigated. The optimized designs were obtained through a simulation with the result that we developed a broadband modulator with a 3 dB bandwidth of 38 GHz in the electrical-to-optical (E/O) response, an electrical return loss of less than -10 dB at up to 26 GHz, an rms jitter of 1.832 ps, and an extinction ratio of 5.38 dB in a 40 Gbps non-return to zero (NRZ) eye diagram. For analog application, the effect of the RF termination scheme on the fractional bandwidth was studied. The microstrip line with a double stub as a matching circuit and a laser trimming process were used to obtain an $S_{11}$ of -34.58 dB at 40 GHz and 2.9 GHz bandwidth of less than -15 dB.

• Journal of Advanced Navigation Technology
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• v.13 no.1
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• pp.27-33
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• 2009

New optical transmission link techniques improving performance of WDM channels, each channel have bit rate of 40 Gbps, are proposed. The proposed optical link configuration consist of optical phase conjugator (OPC) placed at middle of total transmission length, and dispersion management (DM) as a role of compensating dispersion cumulated in transmission line. It is confirmed that Q-factor of total channels are improved by combining OPC and DM in optical transmission link as a result of following fact; DM not only mitigate the cumulated dispersion in total transmission line but also help OPC to compensate optical nonlinearities. And, it is confirmed that the improvement of Q-factor of overall WDM channels depends on net residual dispersion (NRD) of optical link.

• Proceedings of the IEEK Conference
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• 2001.06a
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• pp.155-158
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• 2001

A 640Gb/s high-speed ATM switching system that is based on the technologies of advanced MCM, 0.25um CMOS and optical WDM interconnection is fabricated for future N-ISDN services. A 40 layer, 160mm$\times$114mm ceramic MCM realizes the basic ATM switch module with 80Gbps throughput. The basic unit ATM switch module with 80Gb/s throughput. The basic unit ATM switch MCM consists of in 8 chip advanced 0.25um CMOS VLSI and 32 chip I/O Bipolar VLSIs. The MCM employs an 40 layer, very thin layer ceramic MCM and a uniquely structured closed loop type liquid colling system is adopted to cope with the MCM's high-power dissipation of 230w. The MCM is Mounted on a 32cm$\times$50cm mother board. A three stage ATM switch is realized by optical WDM interconnection between the high-performance MCM.

• Journal of the Optical Society of Korea
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• v.13 no.3
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• pp.354-360
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• 2009

We investigate theoretically the tolerance of 40 Gbps phase-modulated (PM) duobinary signals using a vestigial sideband (VSB) filter on impairments which occurred in dense wavelength-division multiplexing (DWDM) systems, compared to the conventional duobinary signals. Our simulation results show that PM duobinary signals can't have the gain on the spectral efficiency achieved by utilizing the VSB filtering technique. In order to increase the spectral efficiency, they indispensably require to be transmitted at the optimum bandwidth of multiplexer (MUX) and demultiplexer (DEMUX) since they are susceptible to inter-channel crosstalk. It is also shown that the PM duobinary modulation format has a large tolerance on self-phase modulation (SPM) and cross-phase modulation (XPM) under the condition which MUX and DEMUX have been tuned at an optimum bandwidth; it has 1.2 dB power penalty at the fiber launching power (FLP) of 15 dBm and the channel spacing of 50 GHz.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2010.10a
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• pp.780-783
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• 2010

Net residual dispersion (NRD) available to transmit RZ formats with different 24 wavelength as a function of duty cycles of RZ format and residual dispersion per span (RDPS) is induced by controlling precompensation only in 960 km optical transmission links of single mode fiber (SMF) with inline dispersion management (DM) for compensating of accumulated dispersion. It is confirmed that effective NRD range for different 24 wavelengths is gradually broadening as RDPS is more smaller, and as duty cycle of RZ format is more larger in the same RDPS.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.17 no.7
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• pp.1747-1753
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• 2013

Signal performances according link span dispersion compensation conditions at the 2000 km long-haul transmission distance using 10 Gbps 40 wavelength division multiplexing channels were analyzed and compared. 95%, 97.5%, 100%, 102.5% and 105% compensation conditions were applied and 97.5% gave the best performance without post dispersion compensation. the effects of accumulated dispersion value and average dispersion value per transmission link for each link compensation condition were analyzed. When post dispersion compensation optimization was applied to five link span dispersion compensation conditions, 102.5% was given the best performance.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2007.06a
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• pp.183-184
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• 2007

A 40 Gb/s transimpedance amplifier IC was designed and fabricated with a InP/InGaAs HBTs technology. In this study, we interconnect 40Gbps trans impedance amplifier IC to a duroid substrate by a flip chip bonding instead of conventional wire bonding for interconnection. For flip chip bonding, we developed fine pitch bump with the $70{\mu}m$ diameter and $150{\mu}m$ pitch using WLP process. To study the effect of WLP, electrical performance was measured and analyzed in wafer and package module using WLP. The Small signal gains in wafer and package module were 7.24 dB and 6.93dB respectively. The difference of small signal gain in wafer and package module was 0.3dB. This small difference of gain is due to the short interconnection length by bump. The characteristics of return loss was under -10dB in both wafer and module. So, WLP process can be used for millimeter wave GaAs MMIC with the fine pitch pad and duroid substrate can be used in flip chip bonding process.