• Title/Summary/Keyword: 4-Axis Machining

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Development of Online Realtime Positioning Error Compensation System for CNC Machine Tools (CNC 공작기계용 온라인 실시간 위치오차 보정시스템의 개발)

  • Chung, Chae-Il;Kim, Jong-Won;Nam, Weon-Woo;Lee, Sang-Jo
    • Journal of the Korean Society for Precision Engineering
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    • v.16 no.10
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    • pp.45-52
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    • 1999
  • The online realtime positioning error compensation system 'SKY-PACS' is developed to correct geometric errors, thermal errors and tool deflection errors induced by cutting forces on the vertical machining center. 'SKY-PACS' communicates position commands and position compensation signals with the CNC controller at 100Hz, which is CNC control frequency. So the compensation procedure can be applied during axis movement. Using 'SKY-PACS', Maximum 1 axis positioning accuracy was corrected from 5{\mu}m$ to 2{\mu}m$and the squareness error of X-Y table was corrected from 51{\mu}m$/m to below 4{\mu}m$/m. The error compensation under the cutting condition is carried out by ISO10791-7. And the measurement of test-pieces shows that the roundness is corrected rom 8{\mu}m$ to below 5{\mu}m$.

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Ultra High-Gain Displaced-Axis Metal Reflectarray Antenna for Millimeter-Wave Region (밀리미터파 대역의 초고이득 축이동 금속배열안테나)

  • Yi, Minwoo;Yang, Jongwon;Lee, Woosang;Jang, Won;So, Joonho
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.27 no.4
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    • pp.342-349
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    • 2016
  • We design a displaced-axis Gregorian dual antenna in the form of a metal reflectarray antenna for millimeter wave region, W-band. Unlike a reflectarray composed of printed patch antennas on a dielectric substrate, metallic rectangular waveguide unit-cells are proposed to avoid the loss of substrate and take an advantage of ease of typical metal machining fabrication. In this paper, the radiation characteristics of constructed metal reflectarray antennas show ultra high-gain antenna over 50 dBi at a target frequency in W-band. The experimental measurements are conducted in millimeter-wave compact range antenna measurement system.

The Effect of Interpass Peening on Mechanical Properties in Additive Manufacturing of Ti-6Al-4V (Ti-6Al-4V의 AM에서 기계적 성질에 미치는 Interpass Peening의 영향)

  • Byun, Jae-Gyu;Yi, Hui-jun;Cho, Sang-Myung
    • Journal of Welding and Joining
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    • v.35 no.2
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    • pp.6-12
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    • 2017
  • Ti-alloys have high specific strength and are widely used for the filed of space aeronautics plant. However, it is difficult to process Ti-Alloys due to its high yield strength and it cannot raise the machining speed because it has a possibility of catching fire while processing. In order to reduce the number of processes for the Ti-alloys, the researches related to Additive Manufacturing(AM) have been actively carried out at the moment. As for the initial stage of AM market related to Ti-alloys, it started to use the raw material of powder metal, and it is currently being developed based on welding. In this study, Interpass peening reduced the size of the primary ${\beta}$ grain in the z-axis direction, increased the nucleation site of ${\alpha}-colony$, and decreased the length and width of ${\alpha}$ laths as though interpass rolling. Interpass peening leads to an increase in yield/ultimate tensile strength without decrease elongation, resulting decrease in anisotropy of the material.

A Study on the Development of Ultra-precision Small Angle Spindle for Curved Processing of Special Shape Pocket in the Fourth Industrial Revolution of Machine Tools (공작기계의 4차 산업혁명에서 특수한 형상 포켓 곡면가공을 위한 초정밀 소형 앵글 스핀들 개발에 관한 연구)

  • Lee Ji Woong
    • Journal of Practical Engineering Education
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    • v.15 no.1
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    • pp.119-126
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    • 2023
  • Today, in order to improve fuel efficiency and dynamic behavior of automobiles, an era of light weight and simplification of automobile parts is being formed. In order to simplify and design and manufacture the shape of the product, various components are integrated. For example, in order to commercialize three products into one product, product processing is occurring to a very narrow area. In the case of existing parts, precision die casting or casting production is used for processing convenience, and the multi-piece method requires a lot of processes and reduces the precision and strength of the parts. It is very advantageous to manufacture integrally to simplify the processing air and secure the strength of the parts, but if a deep and narrow pocket part needs to be processed, it cannot be processed with the equipment's own spindle. To solve a problem, research on cutting processing is being actively conducted, and multi-axis composite processing technology not only solves this problem. It has many advantages, such as being able to cut into composite shapes that have been difficult to flexibly cut through various processes with one machine tool so far. However, the reality is that expensive equipment increases manufacturing costs and lacks engineers who can operate the machine. In the five-axis cutting processing machine, when producing products with deep and narrow sections, the cycle time increases in product production due to the indirectness of tools, and many problems occur in processing. Therefore, dedicated machine tools and multi-axis composite machines should be used. Alternatively, an angle spindle may be used as a special tool capable of multi-axis composite machining of five or more axes in a three-axis machining center. Various and continuous studies are needed in areas such as processing vibration absorption, low heat generation and operational stability, excellent dimensional stability, and strength securing by using the angle spindle.

The Design and Construction of the Nuclear Microprobe (핵 마이크로프로브 설계 및 제작)

  • Woo, Hyung-Ju;Kim, Jun-Gon;Choi, Han-Woo;Hong, Wan;Kim, Young-Seok;Lee, Jin-Ho;Kim, Ki-Dong;Yang, Tae-Gun
    • Journal of the Korean Vacuum Society
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    • v.10 no.3
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    • pp.380-386
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    • 2001
  • A nuclear microprobe system with adjustable precision object slits and a magnetic quadrupole doublet was designed by the beam optics simulation using a first order matrix formalism, and installed in a $30^{\circ}$ beam line connected with KIGAM 1.7 MV Tandem VDG Accelerator. Demagnification factors for x and y axis are calculated to be 25 and 4.9, respectively, and a minimum beam spot side is expected to be about 5 $\mu\textrm{m}$ for 3 MeV proton beams with a current of about 1 nA. A multi-purpose octagonal target chamber has been built to facilitate MeV ion-beam analytical techniques of PIXE, RBS, ERDA, and ion beam micro-machining. It contains X-ray and particle detectors, a zoom microscope, a Faraday cup, a 4-axis sample manipulator and a high vacuum pumping system. The system performance of the nuclear microprobe is now being tested, and automatic manipulator control and data acquisition system will be installed for routine applications of micro ion-beam analytical techniques.

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Development of Uniform Press for Wafer Bonder (웨이퍼 본딩 장비용 Uniform Press 개발)

  • Lee, Chang-Woo;Ha, Tae-Ho;Lee, Jae-Hak;Kim, Seung-Man;Kim, Yong-Jin;Kim, Dong-Hoon
    • Transactions of the KSME C: Technology and Education
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    • v.3 no.4
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    • pp.265-271
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    • 2015
  • The bonding process should be achieved in vacuum environment to avoid air bubble. In this study, we studied about pressure uniformity that became an issue in thermo compression bonding usually. Uniform press is realized by the method that use air spring and metal form spring. The concept of uniform press using air spring is removed except pressing direction in the press processing so angle between the vector of pressure surface and the pressure axis is parallel automatically. Air spring compensate the errors of machining and assembly. Metal form compensate the thermal deformation and flatness error.

$TiO_2$ Thin Film Patterning on Modified Silicon Surfaces by MOCVD and Microcontact Printing Method

  • 강병창;이종현;정덕영;이순보;부진효
    • Proceedings of the Korean Vacuum Society Conference
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    • 2000.02a
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    • pp.77-77
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    • 2000
  • Titanium oxide (TiO2) thin films have valuable properties such as a high refractive index, excellent transmittance in the visible and near-IR frequency, and high chemical stability. Therefore it is extensively used in anti-reflection coating, sensor, and photocatalysis as electrical and optical applications. Specially, TiO2 have a high dielectric constant of 180 along the c axis and 90 along the a axis, so it is highlighted in fabricating dielectric capacitors in micro electronic devices. A variety of methods have been used to produce patterned self-assembled monolayers (SAMs), including microcontact printing ($\mu$CP), UV-photolithotgraphy, e-beam lithography, scanned-probe based micro-machining, and atom-lithography. Above all, thin film fabrication on $\mu$CP modified surface is a potentially low-cost, high-throughput method, because it does not require expensive photolithographic equipment, and it produce micrometer scale patterns in thin film materials. The patterned SAMs were used as thin resists, to transfer patterns onto thin films either by chemical etching or by selective deposition. In this study, we deposited TiO2 thin films on Si (1000 substrateds using titanium (IV) isopropoxide ([Ti(O(C3H7)4)] ; TIP as a single molecular precursor at deposition temperature in the range of 300-$700^{\circ}C$ without any carrier and bubbler gas. Crack-free, highly oriented TiO2 polycrystalline thin films with anatase phase and stoichimetric ratio of Ti and O were successfully deposited on Si(100) at temperature as low as 50$0^{\circ}C$. XRD and TED data showed that below 50$0^{\circ}C$, the TiO2 thin films were dominantly grown on Si(100) surfaces in the [211] direction, whereas with increasing the deposition temperature to $700^{\circ}C$, the main films growth direction was changed to be [200]. Two distinct growth behaviors were observed from the Arhenius plots. In addition to deposition of THe TiO2 thin films on Si(100) substrates, patterning of TiO2 thin films was also performed at grown temperature in the range of 300-50$0^{\circ}C$ by MOCVD onto the Si(100) substrates of which surface was modified by organic thin film template. The organic thin film of SAm is obtained by the $\mu$CP method. Alpha-step profile and optical microscope images showed that the boundaries between SAMs areas and selectively deposited TiO2 thin film areas are very definite and sharp. Capacitance - Voltage measurements made on TiO2 films gave a dielectric constant of 29, suggesting a possibility of electronic material applications.

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