• Title/Summary/Keyword: 4,4'-Oxydiphthalic acid

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Synthesis and Curing Behaviors of Polyisoimide Oligomers with Ethynyl End Groups (Ethynyl 말단기를 갖는 Polyisoimide 올리고머의 합성 및 이들의 경화거동에 관한 연구)

  • Choi, Seok Woo;Kim, Bo Ock;Kim, Ji-Heung;Nam, Sung Woo;Jeon, Boong Soo;Kim, Young Jun
    • Polymer(Korea)
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    • v.38 no.6
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    • pp.774-781
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    • 2014
  • Acetylenic or phenylethynyl end-capped polyisoimide oligomers ($M_w$ 2500 g/mol, 5000 g/mol) based upon 4,4'-diamino diphenyl ether (4,4'-ODA)/4,4'-oxydiphthalic anhydride (ODPA) and 4,4'-ODA/3,3',4,4'-benzophenone tetracarboxylic acid dianhydride (BTDA) were synthesized by using 4-ethynylaniline (4-EA) or 4-phenylethynyl phthalic anhydride (4-PEPA) as an end capper. The incorporation of ethynyl groups were confirmed by FTIR spectroscopy. The isomerization temperature was influenced by molecular weight as well as the backbone structure of polyisoimides oligomers. Thus, polyisoimide oligomers with molecular weight of 2500 g/mol was found to be imidized at temperature $10^{\circ}C$ lower than that for the oligomers with molecular weight of 5000 g/mol. The crosslinking reaction of ethynyl groups occurred at a higher temperature than that for the isoimide/imide isomerization reaction. These two reactions were totally or partially overlapped on the DSC thermograms for the polyisoimide oligomer end-capped with 4-EA. Kinetics of thermal imidization and crosslinking reactions for the 4,4'-ODA/ODPA polyisoimide oligomers end-capped with 4-PEPA were investigated by performing dynamic DSC experiments at heating rate of $10^{\circ}C/min$. The activation energy and pre-exponential factors were 141 kJ/mol and $1.45{\times}10^{13}min^{-1}$ for the imidization reaction and 177 kJ/mol and $2.90{\times}10^{13}min^{-1}$ for the crosslinking reaction, respectively.

Changes in the Optical and Thermal Properties of Low-Temperature Cured Polyimide Thin Films Using the Catalyst (촉매를 이용한 저온경화 폴리이미드 박막의 광학적/열적 특성 변화)

  • Park, Myeong-Soon;Kim, Kwang-In;Nam, Ki-Ho;Han, Haksoo
    • Applied Chemistry for Engineering
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    • v.24 no.3
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    • pp.320-326
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    • 2013
  • In this study, various polyimide films were synthesized via low temperature cure in order to understand changes in their physical properties when using 4,4'-oxydianiline (ODA) as a diamine and dianhydride molecules with different backbones on a single diamine such as 4,4'-Oxydiphthalic anhydride (ODPA), 4,4-hexafluoroisopropylidene diphthalic dianhydride (6FDA), and 3,3', 4,4'-benzophenone tetracarboxylic dianhydride (BTDA). After the synthesis of poly(amic acid), polyimide films were fabricated by adding 1,4-diazabicyclo [2.2.2]octane (DABCO), a low-temperature catalyst, at various wt% to poly(amic acid)s. Changes of optical and thermal properties were compared and analyzed between polyimide films without catalyst and polyimide films with catalyst by FT-IR, UV-Vis transmittance, DSC/TGA, and WAXD analysis. Wide-angle X-ray diffraction (WAXD) analysis revealed that the mean intermolecular distance decreased with the use of a catalyst by the type of dianhydride. Thus, while the optical properties of the films improve by a low-temperature cure performed using a catalyst, their thermal properties decrease. These changes can be explained by the changes in the morphological structure of the films triggered by a catalyst-induced reduction in the mean intermolecular distance. Moreover, the results show that the type of dianhydride determines the degree of change in the optical and thermal properties in each types of polyimide, demonstrating that changes in the optical and thermal properties are directly associated with the backbone of the polyimide structure.