• Title/Summary/Keyword: 3D-stacked

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Rational Design and Facile Fabrication of Tunable Nanostructures towards Biomedical Applications

  • Yu, Eun-A;Choe, Jong-Ho;Park, Gyu-Hwan
    • Proceedings of the Korean Vacuum Society Conference
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    • 2016.02a
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    • pp.105.2-105.2
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    • 2016
  • For the rational design and facile fabrication of novel nanostructures, we present a new approach to generating arrays of three-dimensionally tunable nanostructures by exploiting light-matter interaction. To create controlled three-dimensional (3D) nanostructures, we utilize the 3D spatial distribution of light, induced by the light-matter interaction, within the matter to be patterned. As a systematic approach, we establish 3D modeling that integrates the physical and chemical effects of the photolithographic process. Based on a comprehensive analysis of structural formation process and nanoscale features through this modeling, we are able to realize three-dimensionally tunable nanostructures using facile photolithographic process. Here we first demonstrate the arrays of three-dimensionally controlled, stacked nanostructures with nanoscale, tunable layers. We expect that the promising strategy would open new opportunities to produce the arrays of tunable 3D nanostructures using more accessible and facile fabrication process for various biomedical applications ranging from biosensors to drug delivery devices.

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IEEE 1500 Wrapper Design Technique for Pre/Post Bond Testing of TSV based 3D IC (TSV 기반 3D IC Pre/Post Bond 테스트를 위한 IEEE 1500 래퍼 설계기술)

  • Oh, Jungsub;Jung, Jihun;Park, Sungju
    • Journal of the Institute of Electronics and Information Engineers
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    • v.50 no.1
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    • pp.131-136
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    • 2013
  • TSV based 3D ICs have been widely developed with new problems at die and IC levels. It is imperative to test at post-bond as well as pre-bond to achieve high reliability and yield. This paper introduces a new testable design technique which not only test microscopic defects at TSV input/output contact at a die but also test interconnect defects at a stacked IC. IEEE 1500 wrapper cells are augmented and through at-speed tests for pre-bond die and post-bond IC, known-good-die and defect free 3D IC can be massively manufactured+.

Hydraulic Stability and Wave Transmit Property of Stacked Geotextile Tube by Hydraulic Model Test (수리모형시험을 통한 다단식 지오텍스타일 튜브의 안정성 및 파랑 전달특성에 관한 연구)

  • Oh Young In;Shin Eun Chul
    • Journal of the Korean Geotechnical Society
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    • v.21 no.2
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    • pp.57-65
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    • 2005
  • Geotextile have been used for the past 30 years for various types of containers, such as small sandbag, 3-D fabric forms and aggregate filled gabion etc. While they are mainly used for flood and water control, they are also used against beach erosion fir shore protection. Especially, large-sized geotextile tube structures are used in various innovative coastal systems involving breakwaters. This paper presents the hydrodynamic behavior of geotextile tubes based on the results of hydraulic model tests. These tube are generally about 1.0 m to 2.0 m in diameter, thou띤 they can be sized for any application. The tubes can be used solely, or stacked to add greater height and usability. Stacked geotextile tubes will be created by adding the height necessary for some breakwaters and embankment, therefore increasing the usability of geotextile tubes. The hydraulic model test was conducted as structural condition and wave conditions. Structural condition is installation direction to the wave (perpendicular and 45$^{circ}$$), and wave condition is varied with the significant wave height ranging from 3.0 m to 6.0 m. Compared with previous test result, the stacked geotextile tube is more stable against wave attack than single tube. Also, the case of none-water depth above crest is more stable than 0.5H of water depth above crest. The incline installed stacked tube is more effective for wave adsorption.

TSV Liquid Cooling System for 3D Integrated Circuits (3D IC 열관리를 위한 TSV Liquid Cooling System)

  • Park, Manseok;Kim, Sungdong;Kim, Sarah Eunkyung
    • Journal of the Microelectronics and Packaging Society
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    • v.20 no.3
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    • pp.1-6
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    • 2013
  • 3D integrated circuit(IC) technology with TSV(through Si via) liquid cooling system is discussed. As a device scales down, both interconnect and packaging technologies are not fast enough to follow transistor's technology. 3D IC technology is considered as one of key technologies to resolve a device scaling issue between transistor and packaging. However, despite of many advantages, 3D IC technology suffers from power delivery, thermal management, manufacturing yield, and device test. Especially for high density and high performance devices, power density increases significantly and it results in a major thermal problem in stacked ICs. In this paper, the recent studies of TSV liquid cooling system has been reviewed as one of device cooling methods for the next generation thermal management.

Stacked LTCC Band-Pass Filter for IEEE 802.11a (IEEE 802.11a용 적층형 LTCC 대역통과 여파기)

  • Lee Yun-Bok;Kim Ho-Yong;Lee Hong-Min
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.16 no.2 s.93
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    • pp.154-160
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    • 2005
  • Microwave Otters are essential device in modem wireless systems. A compact dimension BPF(Band-pass Filter) for IEEE 802.11a WLAN service is realized using LTCC multi-layer process. To extrude 2-stage band-pass equivalent circuit, band-pass and J-inverter transform applied to Chebyshev low-pass prototype filter. Because parallel L-C resonator is complicate and hard to control the inductor characteristics in high frequency, the shorted $\lambda/4$ stripline is selected for the resonator structure. The passive element is located in the different layers connected by conventional via structure and isolated by inner GND. The dimension of fabricated stacked band-pass filter which is composed of six layers, is $2.51\times2.27\times1.02\;mm^3$. The measured filter characteristics show the insertion loss of -2.25 dB, half-power bandwidth of 220 MHz, attenuation at 5.7 GHz of -32.25 dB and group delay of 0.9 ns at 5.25 GHz.

Design and Fabrication of Wideband Antenna Using E-shaped Stacked Patches for IMT-Advanced AccessPoint. (E형 적층패치를 이용한 4세대 이동통신 AccessPoint용 광대역 안테나의 설계 및 제작)

  • Yoon, Hyun-Soo;Choi, Byoung-Ha
    • Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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    • 2007.10a
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    • pp.223-228
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    • 2007
  • In this paper, Wideband antenna using E-shaped stacked patches has been designed and fabricated for 4th generation mobile communication(IMT-Advanced) AccessPoint application. E-shaped patch was miniature and brodband by made the movement route of current long. And inductive of coaxial probe compensates capacitive by slot. Therefore we fabricated to improve the bandwidth of proposed antenna. The E-shaped single patch antenna has an impedance bandwidth of about 13%(510[MHz]), By adding a second patch at the top of the first patch a bandwidth of 56%(2060[MHz]). The final fabricated antenna could have a good return loss(Return loss ${\leq}-10dB$) and a high gain(over 9.6dBi) at the range of 3.23 ${\sim}$ 5.29 [GHz].

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Design of Stacked Bow-Tie Antenna for Wireless LAN (무선 LAN을 위한 적층 구조의 Bow-Tie Antenna의 설계)

  • 고영호
    • The Journal of Korean Institute of Electromagnetic Engineering and Science
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    • v.11 no.8
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    • pp.1455-1461
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    • 2000
  • There are many researches to increase bandwidth of the microstrip patch antenna for wireless LAN. In spite of broad bandwidth, Bow-Tie antenna has disadvantages that are low gain and big size. In this paper, stacked Bow-Tie microstrip patch antenna for wireless LAN is designed in 5.725 ~5.825 GHz band. This antenna has characteristics that are broadband bandwidth, high gain and small size compared with microstrip patch antenna. In simulated results, the return loss is -34.2 dB at 5.78 GHz and bandwidth is 11.345% for VSWR 2:1 and 7.75%for VSWR 1.5:1. In measured results, the return loss is -38.45 dB at 5.78 GHz and bandwidth is 13% for VSWR 2:1 and 5.6% for VSWR 1.5:1. It has 73.16$^{\circ}$ -3dB beam width and 6.5dB gain.

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Development of Machine Learning Method for Selection of Machining Conditions in Machining of 3D Printed Composite Material (3D 프린팅 복합소재의 가공에서 가공 조건 선정을 위한 머신러닝 개발에 관한 연구)

  • Kim, Min-Jae;Kim, Dong-Hyeon;Lee, Choon-Man
    • Journal of the Korean Society of Manufacturing Process Engineers
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    • v.21 no.2
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    • pp.137-143
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    • 2022
  • Composite materials, being light-weight and of high mechanical strength, are increasingly used in various industries such as the aerospace, automobile, sporting-goods manufacturing, and ship-building industries. Recently, manufacturing of composite materials using 3D printers has increased. 3D-printed composite materials are made in free-form and adapted for end-use by adjusting the fiber content and orientation. However, research on the machining of 3D printed composite materials is limited. The aim of this study is to develop a machine learning method to select machining conditions for machining of 3D-printed composite materials. The composite material was composed of Onyx and carbon fibers and stacked sequentially. The experiments were performed using the following machining conditions: spindle speed, feed rate, depth of cut, and machining direction. Cutting forces of the different machining conditions were measured by milling the composite materials. PCA, a method of machine learning, was developed to select the machining conditions and will be used in subsequent experiments under various machining conditions.

Design of Three-stacked Microstrip Patch Array Antenna Having Tx/Rx Feeds For Satellite Communication (위성통신을 위한 송수신 겸용 삼중 적층 마이크로스트립 패치 배열 안테나 설계)

  • Park, Ung-Hee;Noh, Haeng-Sook
    • Journal of the Korea Institute of Information and Communication Engineering
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    • v.11 no.5
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    • pp.853-859
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    • 2007
  • This paper presents a microstrip patch array antenna having transmission feed and reception feed for satellite communication in the Ku band. In this paper, the element of the patch array antenna is a three-stacked structure consisting of one radiation patch and two parasitic patches for high gain and wide bandwidth characteristics. To obtain higher gain, the unit elements are expanded into a $1{\times}8$ may using a mixture of series and parallel feeds. The proposed antenna has horizontal polarization for the Rx band and vertical polarization for the Tx band. To verify the practicality of this antenna, we fabricated a three-stacked patch array antenna and measured its performance. The gain of the array antenna in the Rx and Tx bands exceeds 17 and 18 dBi, respectively. The impedance bandwidth is over 10 % in both bands. The cross-polarization level is below -25 dB, and the sidelobe level is below -9.4 dB.

Additive Manufacturing of Various Ceramic Composition Using Inkjet Printing Process (잉크젯 프린팅을 이용한 연속 조성 세라믹 화합물 구조체 형성)

  • Park, Jae-Hyeon;Choi, Jung-Hoon;Hwang, Kwang-Taek;Kim, Jin-Ho
    • Korean Journal of Materials Research
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    • v.30 no.11
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    • pp.627-635
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    • 2020
  • 3D printing technology is a processing technology in which 3D structures are formed by fabricating multiple 2D layers of materials based on 3D designed digital data and stacking them layer by layer. Although layers are stacked using inkjet printing to release various materials, it is still rare for research to successfully form a product as an additive manufacture of multi-materials. In this study, dispersion conditions are optimized by adding a dispersant to an acrylic monomer suitable for inkjet printing using Co3O4 and Al2O3. 3D structures having continuous composition composed of a different ceramic material are manufactured by printing using two UV curable ceramic inks whose optimization is advanced. After the heat treatment, the produced structure is checked for the formation and color of the desired crystals by comparing the crystalline analysis according to the characteristics of each part of the structure with ceramic pigments made by solid phase synthesis method.