• Journal of Korea Society of Industrial Information Systems
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• v.12 no.4
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• pp.119-125
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• 2007

In this paper, a miniaturized PCB-integrated antenna is proposed for bluetooth applications. The proposed antenna is a modified form of the printed inverted F antenna where the size reduction is achieved by employing the meander strip for the resonant length part of the radiator. The antenna dimension is optimized using the commercial electromagnetic software MWSTM. The designed antenna is fabricated by the standard photo-etching technique and its performance is measured. The fabricated antenna shows a bandwidth of 125MHz centered at 2.45GHz and a gail of -0.23dBi. The size of the proposed antenna is $9.65mm{\times}5.95mm$ corresponding to the 55 percent of the area of the existing printed inverted F antenna.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.17 no.11 s.114
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• pp.1089-1095
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• 2006

In this paper, the circuit analysis of three-dimensional bandpass filter with transmission zero in multi-layer printed circuit board is presented. The equivalent circuit of bandpass filter is evaluated by microwave network analysis. Compare to the established paper that have configured the circuit model of filter except the effect of distribute element, the proposed model can include the effect. As a result, the multi-layer PCB bandpass filter with transmission zero has designed by extracting mutual capacitance from electrical component inside inductor. The structure size is only $10mm{\times}20mm{\times}1.251mm$. Measured data of the bandpass filter indicate 1.9 dB of insertion loss and 28 dB of return loss at the center frequency of 1.84 GHz, as well as 43 dB attenuation at the refraction frequency of 2.78 GHz.

• The Journal of the Institute of Internet, Broadcasting and Communication
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• v.14 no.6
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• pp.245-250
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• 2014

This paper presents the broadband printed sleeve-monopole antenna implementing the sleeve monopole structure in the form of PCB. In the proposed antenna, the antenna performance was improved by the diameter variation of the radiator, the length variation of the sleeve, and the variation of the diameter of the sleeve conductor. HFSS simulator of ANSYS corp. was used in order to confirm the antenna parameter characteristic. According to the simulation results, the VSWR was less than 2 for the range of 2.12GHz~3.18GHz. The frequency bandwidth is 1.08GHz. The frequency range of the actual fabricated antenna was 2.0GHz~3.55GHz, the frequency bandwidth is 1.55GHz. The maximum gain was 1.64dBi. The proposed antenna was $56{\times}5{\times}1.6mm$ in size. The utilization possibility of the broadband printed sleeve-monopole antenna could be confirmed according to compare and analyze the simulation and measurement data.

• Journal of Institute of Convergence Technology
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• v.1 no.1
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• pp.34-40
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• 2011

In this paper, a hybrid design tool combining one-dimensional(1D) lumped model and three-dimensional computational fluid dynamics(CFD) approach has been developed in order to evaluate the performance of inkjet print head and droplet control process are studied to reduce the deviations between nozzles which affect the size of the printed line for the industrial application of direct writing on printed circuit boards(PCB). 1D lumped model analysis shows that it is useful tool for evaluating performance of an inkjet head by varying the design parameters. The differences in ejected volume and droplet velocity between analytical and experimental result are within 12%. Time sequence of droplet generation is verified by the comparison between 3D analysis result and photographic images acquired by stroboscopic technique. In addition, by applying DPN process, velocity and volume uniformity between nozzles is dramatically improved that the tolerance achieved by the piezoelectric inkjet printhead across the 64 nozzles is 5 to 8%. A printed line pattern is successfully obtained using the fabricated inkjet print head and droplet calibration system.

• JSTS:Journal of Semiconductor Technology and Science
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• v.12 no.3
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• pp.320-330
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• 2012

In this paper, we investigate the power integrity of grid structures for power and ground distribution on printed circuit board (PCB). We propose the 2D transmission line method (TLM)-based model for efficient frequency-dependent impedance characterization and PCB-package-integrated circuit (IC) co-simulation. The model includes an equivalent circuit model of fringing capacitance and probing ports. The accuracy of the proposed grid model is verified with test structure measurements and 3D electromagnetic (EM) simulations. If the grid structures replace the plane structures in PCBs, they should provide effective shielding of the electromagnetic interference in mobile systems. An analytical model to predict the shielding effectiveness (SE) of the grid structures is proposed and verified with EM simulations.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.29 no.10
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• pp.752-757
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• 2018

This study presents the performance evaluation results of a 77-GHz waveguide slot array antenna that was fabricated by attaching a patterned printed circuit board(PCB) on a metal block. The 77-GHz waveguide was divided into a top plate and a bottom structure. The top plate was fabricated using a patterned PCB that can implement a fine slot at low cost. The top cover was then bonded to the bottom metal structure with a waveguide trough using anisotropic conductive film. For evaluating the antenna performance, a $1{\times}16$ slot array antenna was fabricated using our proposed method and the gain and pattern were measured and compared with the simulation results. Though the measurement results demonstrate a reduction in gain of around 2.3~3.5 dB compared to the simulation results assuming ideal bonding conditions, the pattern hardly changed and the slot antenna with a gain of approximately 17 dBi at 77 GHz can be easily manufactured at a low cost using the proposed method.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.21 no.3
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• pp.265-271
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• 2008

TCP(Tape Carrier Package), COG (Chip On Glass), COF(Chip On Film) are three methods for connecting LDI(LCD Driver IC) with LCD panels. Especially COF is growing its portion of market place because of low cost and fine pitch correspondence. But COF has a problem of the lead broken failure in LCD module process and the usage of customer. During PCB (Printed Circuit Board) bonding process, the mismatch of the coefficient of thermal expansion between PCB and D-IC makes stress-concentration in COF lead, and also D-IC bending process during module assembly process makes the level of stress in COF lead higher. As an affecting factors of lead-broken failure, the effects of SR(Solder Resister) coating on the COF lead, surface roughness and grain size of COF lead, PI(Polyimide) film thickness, lead width and the ACF(Anisotropic Conductive Film) overlap were studied, The optimization of these affecting manufacturing processes and materials were suggested and verified to prevent the lead-broken failure.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.24 no.4
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• pp.357-365
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• 2013

The 4 by 4 series slot sub-array antenna is proposed using substrate integrated waveguide(SIW) technology for 35 GHz of Ka band application. The proposed antenna is realized with multi-layered structure for compact size and easy integration features. 4 by 4 radiating slots are arrayed on top PCB with equal spacing and the feeding SIWs are arranged on middle and bottom PCBs for uniform power distribution. The multi-layered antenna is realized using RT/Duroid 5880 that has dielectric constant of 2.2 and the total antenna size is $750.76mm^2$. The individual parts such as radiators and feeding networks are simulated using full-wave simulator CST MWS. Furthermore, the total sub-array antenna also fabricated and measured the electrical performances such as impedance bandwidth under the criteria of -10 dB(490 MHz), maximum gain(18.02 dBi), sidelobe level(SLL)(-11.0 dB), and cross polarization discrimination (XPD)(-20.16 dB).

• Journal of the Microelectronics and Packaging Society
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• v.26 no.3
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• pp.81-88
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• 2019

In this study, the effects of graphene oxide (GO) addition on electromigration (EM) lifetime of Sn-3.0Ag-0.5Cu Pb-free solder joint between a ball grid array (BGA) package and printed circuit board (PCB) were investigated. After as-bonded, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) was formed at the interface of package side finished with electroplated Ni/Au, while $Cu_6Sn_5$ IMC was formed at the interface of OSP-treated PCB side. Mean time to failure of solder joint without GO solder joint under $130^{\circ}C$ with a current density of $1.0{\times}10^3A/cm^2$ was 189.9 hrs and that with GO was 367.1 hrs. EM open failure was occurred at the interface of PCB side with smaller pad diameter than that of package side due to Cu consumption by electrons flow. Meanwhile, we observed that the added GO was distributed at the interface between $Cu_6Sn_5$ IMC and solder. Therefore, we assumed that EM reliability of solder joint with GO was superior to that of without GO by suppressing the Cu diffusion at current crowding regions.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.30 no.2
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• pp.104-110
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• 2019

In this paper, a complementary metal oxide semiconductor(CMOS) power amplifier(PA) integrated circuit operating in the 900 MHz band for long-term evolution(LTE) communication systems is presented. The output matching network based on a transformer was implemented on a printed circuit board for low loss. Simultaneously, to achieve high efficiency of the PA, the second harmonic impedances are controlled. The CMOS PA was fabricated using a $0.18{\mu}m$ CMOS process and measured using an LTE uplink signal with a bandwidth of 10 MHz and peak to average power ratio of 7.2 dB for verification. The implemented CMOS PA module exhibits a power gain of 24.4 dB, power-added efficiency of 34.2%, and an adjacent channel leakage ratio of -30.1 dBc at an average output power level of 24.3 dBm.