• Proceedings of the Korea Information Processing Society Conference
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• 2016.10a
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• pp.518-519
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• 2016

AOI 검사기는 SMT 공정 상에서 PCB (printed Circuit Board) 상의 부품들을 카메라로 촬영하고 촬영된 영상을 2D 혹은 3D 형태의 이미지로 재구성하고 분석하여 이상 여무를 판단하는 장비다. 검사를 하고자 하는 PCB의 크기가 카메라가 촬영할 수 있는 영역 보다 큰 경우가 대부분이기 때문에 PCB 상에 마운트 되어 있는 부품들을 모두 촬영하기 위해서는 여러 차례 나누어 촬영해야 할 필요가 있으며 이 때문에 PCB 상에 촬영해야 하는 부품들을 가능한 FOV에 많이 포함될 수 있도록 여러 FOV 영역으로 나누고 이렇게 나누어진 FOV 영역들을 최적의 경로로 이동하며 촬영할 수 있도록 하기 위한 알고리즘이 필요하다. 기존 논문들은 대부분 이 문제를 해결하기 위한 알고리즘에 대해 다루어 왔다. 일반적으로 생산이 진행되는 시점에서는 검사해야 할 PCB에 대한 정보 (PCB의 크기, 부품의 위치, 크기, 종류 등)는 이미 정해져 있기 때문에 경로 계획 최적화 수행은 PCB 정보에 변동이 없다면 한차례만 하면 된다. 하지만 검사를 할 수 있도록 Teaching 하는 단계에서는 PCB 정보가 지속적으로 변경될 수 있으며 이에 따라 최적화를 여러 차례 수행해야 할 필요성이 있다. 최적화를 위한 처리 시간은 부품의 개수, PCB 상에서의 분포정도등에 따라 증가하기 때문에 PCB 정보가 변경될 때 마다 최적화를 수행하게 되면 비효율적으로 처리 시간이 증가하게 된다. 본 논문에서는 이 문제에 대해 연구하고 해결책을 제시하였다.

• Journal of Applied Reliability
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• v.9 no.3
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• pp.259-274
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• 2009

Printed circuit boards for RAM are widely used in modern electronics such as computers, artificial satellites and consumer durables. They are exposed to a very diverse environment and consists of many complicated components and therefore needs careful approach to the enhancement and assessment of reliability of the item. In this article reliability standards for PCBs for RAM are established in terms of quality certification tests and failure rate tests.

• Korean Journal of Materials Research
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• v.12 no.9
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• pp.750-760
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• 2002

In this study, three solders, Sn-37Pb, Sn-3.5Ag, and Sn-3.8Ag-0.7Cu were screen printed on both electroless Ni/Au and OSP metal finished micro-via PCBs (Printed Circuit Boards). The interfacial reaction between PCB metal pad finish materials and solder materials, and its effects on the solder bump joint mechanical reliability were investigated. The lead free solders formed a large amount of intermetallic compounds (IMC) than Sn-37Pb on both electroless Ni/Au and OSP (Organic Solderabilty Preservatives) finished PCBs during solder reflows because of the higher Sn content and higher reflow temperature. For OSP finish, scallop-like $Cu_{6}$ /$Sn_{5}$ and planar $Cu_3$Sn intermetallic compounds (IMC) were formed, and fracture occurred 100% within the solder regardless of reflow numbers and solder materials. Bump shear strength of lead free solders showed higher value than that of Sn-37Pb solder, because lead free solders are usually harder than eutectic Sn-37Pb solder. For Ni/Au finish, polygonal shaped $Ni_3$$Sn_4$ IMC and P-rich Ni layer were formed, and a brittle fracture at the Ni-Sn IMC layer or the interface between Ni-Sn intermetallic and P-rich Ni layer was observed after several reflows. Therefore, bump shear strength values of the Ni/Au finish are relatively lower than those of OSP finish. Especially, spalled IMCs at Sn-3.5Ag interface was observed after several reflow times. And, for the Sn-3.8Ag-0.7Cu solder case, the ternary Sn-Ni-Cu IMCs were observed. As a result, it was found that OSP finished PCB was a better choice for solders on PCB in terms of flip chip mechanical reliability.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.15 no.2
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• pp.1-8
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• 2016

Generally, electrical circuits are fabricated as Printed Circuit Boards (PCBs) and mounted on the casing of the product. Additionally, this requires many other parts and some labor for assembly. Recently, molding technology has increasingly been applied to embed simple circuits in plastic casing. The technology is called a Molded Interconnected Device (MID). By using this technology, PCB fabrication can be replaced by molding, and much of the corresponding assembly process for PCBs can be eliminated if the circuit is simple enough for molding. Furthermore, as the improvement of conductive materials and printing technologies of simple electric circuits can be printed directly on the casing part, this also reduces the complexity of the product design and production cost. Therefore, this paper introduces a new MID fabrication process using direct 3D printing technology. Additionally, it is applied to an automotive part of a cruise control switch. The methodology and design are shown.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.12 no.1
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• pp.136-142
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• 2001

In this paper, a method of canceling and suppressing differential mode crosstalk noise signals caused by non-uniform coupling between two transmission lines in UTP (unshielded twisted pair) modular jacks is discussed. Differential mode crosstalk noise signals in balanced transmission lines with UTP modular jacks were suppressed, by applying field cancellation techniques to this modular jack. To verify an effectiveness of the field cancellation techniques, 8 pin modular jacks were made, and the NEXT (Near End Crosstalk) losses were measured to prove its applicability by the network analyzer(HP8720C) at 100 Mb/s.

• The Journal of Korean Institute of Electromagnetic Engineering and Science
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• v.14 no.5
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• pp.444-449
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• 2003

In this paper, a PCB(Printed Circuit Board) antenna for IMT-2000 is designed and analyzed. The antenna has a helical structure with via-holes and lines on FR-4($\varepsilon$$\sub$${\gamma}$/=4.6 ) PCB, and the type of feeding is GCPW(Grounded Co-Planar Waveguide). Using HFSS of Ansoft, the antenna was designed and the measured results of frequency and radiation characteristic,3 with VSWR<2.0 are satisfied within operating frequency band of 1.920∼2.170 GHz. And it has resonating frequency of 2.045 GHz and a bandwidth of 321 MHz. The radiation gain of the antenna was measured to be -1 dBi.

• Journal of the Institute of Electronics and Information Engineers
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• v.54 no.6
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• pp.25-29
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• 2017

This paper presents a hetero-integration of electrostatically actuated RF MEMS Switch and step up DC-DC converter on a redistribution layer using commercial PCB process. RF characteristics of Duroid with $56{\Omega}$ impedance GCPW transmission line and that of FR4 with $59{\Omega}$ impedance CPW transmission line were analyzed. From DC to 6GHz, RF characteristics of Duroid were better than that of FR4, insertion loss was 2.08dB lower, return loss was 3.91dB higher, and isolation was 3.33dB higher.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.100-103
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• 2003

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz local wireless communication system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed. By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.4% frequency bandwidth for VSWR under 1.5 and 3dB gain.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.7 no.6
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• pp.1103-1108
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• 2003

In this paper, the characteristics of an inverted-F antenna for the 2.4GHz local wireless communication system have been analysed in terms of the variation of design parameters. The antenna can be integrated on printed circuit board, and the characteristics in terms of the variation of the gap between feed line and shorting stub, gap between antenna's leg and ground plane, antenna leg's width, substrate's height and dielectric constant are analysed. By using these characterization plot of design parameter, the tuning techniques are proposed to design optimum antenna. The designed antenna has 6.4 % frequency bandwidth for VSWR under 1.5 and 3dB gain.

• Journal of Platform Technology
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• v.8 no.1
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• pp.24-32
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• 2020

This paper designed and manufactured a chip mounter based on 3D printer technology that can be used for educational research or sample production to disseminate chip mounter, a core technology of SMT line. A stepper motor with open loop control is used for low cost drive design. The shortcomings of the motor's vibration and disassembly caused by the use of the step motor were compensated by the Micro-Step control method. In the chip mounter experiment, the gerber file was generated on the small chip mounter, printed at the actual size, and the solder cream was printed on the HASL-treated PCB in the same manner as the sample board fabrication. As a result of the experiment, unlike the 2012 micro components, parts such as SOIC and TQFP that require correction are twice as long as the component mounting time, but it can be confirmed that they are mounted relatively accurately. In addition, as a result of repeatedly measuring the error of the initial position 10 times, it was confirmed that a relatively small error of about 0.110mm occurs.