• Journal of Microbiology and Biotechnology
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• 제34권4호
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• pp.891-901
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• 2024

This study focuses on improving the 3D printability of pea protein with the help of food inks designed for jet-type 3D printers. Initially, the food ink base was formulated using nanocellulose-alginate with a gradient of native potato starch and its 3D printability was evaluated. The 3D-printed structures using only candidates for the food ink base formulated with or without potato starch exhibited dimensional accuracy exceeding 95% on both the X and Y axes. However, the accuracy of stacking on the Z-axis was significantly affected by the ink composition. Food ink with 1% potato starch closely matched the CAD design, with an accuracy of approximately 99% on the Z-axis. Potato starch enhanced the stacking of 3D-printed structures by improving the electrostatic repulsion, viscoelasticity, and thixotropic behavior of the food ink base. The 3D printability of pea protein was evaluated using the selected food ink base, showing a 46% improvement in dimensional accuracy on the Z-axis compared to the control group printed with a food ink base lacking potato starch. These findings suggest that starch can serve as an additive support for high-resolution 3D jet-type printing of food ink material.

• 대한화학회지
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• 제30권3호
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• pp.289-295
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• 1986

전해질 고분자인 polyvinylsulfate(PVS) 및 polystyrenesulfonate(PSS) 존재하에서 나타나는 methylene blue(MB) 및 acridine orange(AO)의 metachromasy현상을 각각 분광학적 방법으로 연구하였다. P/D값의 변화에 따르는 meta-band의 특성적 변화는 stacking이론에 의하여 설명하였으며 PVS-dye계의 stacking효과는 PSS-dye계의 그것보다 더 강하였거 MB가 AO보다 더 강한 stacking효과를 나타냄을 발견하였다. 전에 제안한 바 있는 평면구조의 방향색소들이 수용액속에서 형성하는 dimer의 모형과 dimension을 근거로 고분자사슬 표면에 결합되어 있는 색소분자들의 stacking 모형을 제안하였으며 이 모형을 제안하였으며 이 모형은 여러 연구자들에 의하여 밝혀진 실험적 결과와 비교 검토한 결과 합리적임이 발견되었다.

• 전기학회논문지
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• 제64권4호
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• pp.592-597
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• 2015

3D-IC is a novel semiconductor packaging technique stacking dies to improve the performance as well as the overall size. TSV is ideal for 3D-IC because it is convenient for stacking and excellent in electrical characteristics. However, due to high-density and micro-size of TSVs, they should be tested with a non-invasive manner. Thus, we introduce a TSV test method on test prober without a direct contact in this paper. A capacitive coupling effect between a probe tip and TSV is used to discriminate small TSV faults like voids and pin-holes. Through EM simulation, we can verify the size of eye-patterns with various frequencies is good for TSV test tools and non-contact test will be promising.

• 한국자동차공학회논문집
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• 제14권1호
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• pp.79-85
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• 2006

CFRP(Carbon Fiber Reinforced Plastics) of the advanced composite materials as structural materials for vehicle, has a wide application in light-weigh structural materials of airplanes, ships and automobiles because of high strength and stiffness, However, there is a design variable to be considered in practical application of the laminate composite materials, these materials are vulnerable to transverse impact. This paper is to study the effects of stacking sequence and curvature on the penetration characteristics of composite laminate shell. They are stacked to $[0_3/90_3]S,\;[90_3/0_3]s\;and\;[0_2/90_3/0]s,\;[90_2/0_3/90]s$ and their interlaminar number two and four. They are manufactured to various curvature radius (R=100, 150, 200mm and $\infty$), When the specimen is subjected to transverse impact by a steel ball, the velocity of the steel ball was measured both before and after impact by determing the time for it to pass two ballistics-screen sensors located a known distance apart. The critical penetration energy of specimen A and B with less interfaces were a little higher than those of C and D. As the curvature increases, the critical penetration energy increases linearly because the resistance to the in-plane deformation as well as bending deformation increases, which need higher critical penetration energy. The specimen A and C have higher critical penetration energy than B and D because of different stacking sequences. We examined crack length through a penetration test. For the specimen A with 2interfaces, the longest circumferential direction crack length were observed on the first interface from the impact point. For the specimen B 4-interface, the longest circumferential direction crack length were observed on the second interface from the impact point.

• 한국기계가공학회지
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• 제14권3호
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• pp.15-20
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• 2015

After the US government declared 3D printing technology a next-generation manufacturing technology, there have been many practical studies conducted to expand 3D printing technology to manufacturing technologies, called AMERICA MAKES. In particular, the Keck Center, located at the University of Texas at El Paso, has studied techniques for easily combing the 3D stacking process with space mobility and expanded these techniques to simultaneous staking techniques for multiple materials. Additionally, it developed convergence manufacturing techniques, such as direct inking techniques, in order to produce a module structure that combines electronic circuits and components, such as CUBESET. However, in these studies, it is impossible to develop a unified system using traditional independent through simple sequencing connections. This is because there are many problems in the integration between the stacking modeling of 3D printers and post-machining, such as thermal deformations, the precision accuracy of 3D printers, and independently driven coordinate problems among process systems. Therefore, in this paper, the integration method is suggested, which combines these 3D printers and subsequent machining process systems through an Internet-based cloud. Additionally, the sequential integrated system of a 3D printer, an NC milling machine, machine vision, and direct inking are realized.

• 정보처리학회논문지:컴퓨터 및 통신 시스템
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• 제4권2호
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• pp.41-46
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• 2015

컴퓨터 사용 환경이 모바일 시장 및 소형 전자기기 시장 등으로 다양해짐에 따라 저전력 고성능 시스템에 대한 요구도 커지고 있다. 3차원 die-stacking 기술은 한정된 공간에서 DRAM의 집적도과 접근 속도를 높여 차세대 공정방식으로 많은 연구가 되고 있다. 이 논문에서는 3차원 구조의 DRAM 로직층에 재구성형 가속기를 구현하여 저전력 고성능 시스템을 구성하는 방법을 제안한다. 또한 재구성형 가속기의 지역 메모리로 캐시를 적용하고 활용하는 방법에 대해서 논의한다. DRAM의 로직층에 재구성형 가속기를 구현할 경우 위치적인 특성으로 데이터 전송 및 관리에 필요한 비용이 줄어들어 성능을 크게 향상시킬 수 있다. 제안된 시스템에서는 최대 24.8의 스피드업을 기록하였다.

• 한국유체기계학회 논문집
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• 제9권3호
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• pp.7-13
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• 2006

Shape optimization of a rotor blade in a single-stage transonic axial compressor has been performed using a response surface method and three-dimensional Navier-Stokes analysis. Two shape variables of the rotor blade, which are used to define a blade skew, are introduced to increase an adiabatic efficiency. Throughout the shape optimization of a rotor blade, the adiabatic efficiency is increased to about 2.2 percent compared to that of the reference shape of the stator. The increase in efficiency for the optimal shape of the rotor is due to the pressure enhancement, which is mainly caused by moving the separation position on the suction surface of rotor blade to the downstream direction.

• 대한용접접합학회:학술대회논문집
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• 대한용접접합학회 2007년 추계학술발표대회 개요집
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• pp.229-231
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• 2007

Recently, 3D-electronic packaging by TSV is in interest. TSV(Through Silicon Via) is a interconnection hole on Si-wafer filled with conducting metal such as Copper. In this research, chips with TSV are connected by electroplated Sn bump without PR. Then chips with TSV are put together and stacked by the methode of Reflow soldering. The stacking was successfully done and had no noticeable defects. By eliminating PR process, entire process can be reduced and makes it easier to apply on commercial production.

• 한국생산제조학회지
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• 제22권1호
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• pp.168-172
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• 2013

In 3D wafer-stacking technology, one of the major issues is wafer warpage. Especially, The important reason of warpage has been known due to CTE(Coefficient of Thermal Expansion) mismatch between materials. It was too hard to choose how to make the FE model for blanket structured wafer level 3D packaging, because the thickness of each layer in wafer level 3D packaging was too small (micro meter or nano meter scale) comparing with diameter of wafer (6 or 8 inches). In this study, the FE model using the shell element was selected and simulated by the ANSYS WorkBench to investigate effects of the CTE on the warpage. To verify the FE model, it was compared by experimental results.

• JSTS:Journal of Semiconductor Technology and Science
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• 제14권5호
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• pp.557-565
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• 2014

We report the effect of basal-plane stacking faults (BSFs) on X-ray diffraction (XRD) of non-polar (11$\underline{2}$0) a-plane GaN films with different $SiN_x$ interlayers. Complete $SiN_x$ coverage and increased three-dimensional (3D) to two-dimensional (2D) transition stages substantially reduce BSF density. It was revealed that the Si-doping profile in the Si-doped GaN layer was unaffected by the introduction of a $SiN_x$ interlayer. The smallest in-plane anisotropy of the (11$\underline{2}$0) XRD ${\omega}$-scan widths was found in the sample with multiple $SiN_x$ layers, and this finding can be attributed to the relatively isotropic GaN mosaic resulting from the increase in the 3D-2D growth step. Williamson-Hall (WH) analysis of the (h0$\underline{h}$0) series of diffractions was employed to determine the c-axis lateral coherence length (LCL) and to estimate the mosaic tilt. The c-axis LCLs obtained from WH analyses of the present study's representative a-plane GaN samples were well correlated with the BSF-related results from both the off-axis XRD ${\omega}$-scan and transmission electron microscopy (TEM). Based on WH and TEM analyses, the trends in BSF densities were very similar, even though the BSF densities extracted from LCLs indicated that the values were reduced by a factor of about twenty.