• Korean Chemical Engineering Research
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• v.47 no.1
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• pp.1-10
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• 2009

As a demand for the portable device requiring smaller size and better performance is in hike, reducing the size of conventionally used planar 2 dimensional chip cannot be a solution for the enhancement of the semiconductor chip technology due to an increase in RC delay among interconnects. To address this problem, a new technology - "3 dimensional (3D) IC chip stack" - has been emerging. For the integration of the technology, several new key unit processes (e.g., silicon through via, wafer thinning and wafer alignment and bonding) should be developed and much effort is being made to achieve the goal. As a result of such efforts, 4 and 8 chip-stacked DRAM and NAND structures and a system stacking CPU and memory chips vertically were successfully developed. In this article, basic theory, configurations and key unit processes for the 3D IC chip integration, and a current tendency of the technology are explained. Future opportunities and directions are also discussed.

• Journal of the Microelectronics and Packaging Society
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• v.13 no.4
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• pp.45-50
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• 2006

Copper via filling is the important factor in 3-D stacking interconnection of SiP (system in package). As the packaging density is getting higher, the size of via is getting smaller. When DC electroplating is applied, a defect-free hole cannot be obtained in a small size via hole. To prevent the defects in holes, pulse and pulse reverse current was applied in copper via filling. The holes, $20\and\;50{\mu}m$ in diameter and $100{\sim}190\;{\mu}m$ in height. The holes were prepared by DRIE method. Ta was sputtered for copper diffusion barrier followed by copper seed layer IMP sputtering. Via specimen were filled by DC, pulse and pulse-reverse current electroplating methods. The effects of additives and current types on copper deposits were investigated. Vertical and horizontal cross section of via were observed by SEM to find the defects in via. When pulse-reverse electroplating method was used, defect free via were successfully obtained.

• Korean Journal of Materials Research
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• v.23 no.10
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• pp.550-554
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• 2013

As continued scaling becomes increasingly difficult, 3D integration has emerged as a viable solution to achieve higher bandwidths and good power efficiency. 3D integration can be defined as a technology involving the stacking of multiple processed wafers containing integrated circuits on top of each other with vertical interconnects between the wafers. This type of 3D structure can improve performance levels, enable the integration of devices with incompatible process flows, and reduce form factors. Through silicon vias (TSVs), which directly connect stacked structures die-to-die, are an enabling technology for future 3D integrated systems. TSVs filled with copper using an electro-plating method are investigated in this study. DC and pulses are used as a current source for the electro-plating process as a means of via filling. A TiN barrier and Ru seed layers are deposited by plasma-enhanced atomic layer deposition (PEALD) with thicknesses of 10 and 30 nm, respectively. All samples electroplated by the DC current showed defects, even with additives. However, the samples electroplated by the pulse current showed defect-free super-filled via structures. The optimized condition for defect-free bottom-up super-filling was established by adjusting the additive concentrations in the basic plating solution of copper sulfate. The optimized concentrations of JGB and SPS were found to be 10 and 20 ppm, respectively.

• Composites Research
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• v.34 no.6
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• pp.394-399
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• 2021

Piecewise Integrated Composite (PIC) is a new concept to design composite structures of multiple stacking angles both for in-plane direction and through the thickness direction in order to improve stiffness and strength. In the present study, PIC beam was suggested based on 3D training data instead of 2D data, which did offer a limited behavior of beam characteristics, with enhancing the stiffness accompanied by reduced tip deformation. Generally training data were observed from the designated reference finite elements, and preliminary FE analysis was conducted with respect to regularly distributed reference elements. Also triaxiality values for each element were obtained in order to categorize the loading state, i.e. tensile, compressive or shear. The main FE analysis was conducted to predict the mechanical characteristics of the PIC beam.

• Journal of the Korea Society of Computer and Information
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• v.26 no.11
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• pp.1-9
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• 2021

3D-NAND flash memory provides high capacity per unit area by stacking 2D-NAND cells having a planar structure. However, due to the nature of the lamination process, there is a problem that the frequency of error occurrence may vary depending on each layer or physical cell location. This phenomenon becomes more pronounced as the number of write/erase(P/E) operations of the flash memory increases. Most flash-based storage devices such as SSDs use ECC for error correction. Since this method provides a fixed strength of data protection for all flash memory pages, it has limitations in 3D NAND flash memory, where the error rate varies depending on the physical location. Therefore, in this paper, pages and layers with different error rates are classified into clusters through the K-means machine learning algorithm, and differentiated data protection strength is applied to each cluster. We classify pages and layers based on the number of errors measured after endurance test, where the error rate varies significantly for each page and layer, and add parity data to stripes for areas vulnerable to errors to provides differentiate data protection strength. We show the possibility that this differentiated data protection policy can contribute to the improvement of reliability and lifespan of 3D NAND flash memory compared to the protection techniques using RAID-like or ECC alone.

• Journal of Biosystems Engineering
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• v.19 no.4
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• pp.358-368
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• 1994

Major factors in reducing the stacking strength of corrugated fiberboard boxes in cold storage or transport conditions are high relative humidity, causing elevated moisture absorption by the boxes. The bottom boxes in a stack will deform to the critical deflection causing agricultural products damage there, and eventually additional deflection will cause box collapse and finally toppling of the stack. The study was conducted to determine the water absorption characteristics and the compressive strength of the corrugated fiberboard boxes being widely used in packaging agricultural products in Korea. The sample boxes for the study were selected from the regular slotted containers (RSC) types, and one was the box used in apple packaging (Box A), another one was the box used in pear packaging (Box B). The corrugated shipping containers were made from a large portion of recycled fibers in Korea, and comparing with Box B, Box A was fabricated from fiberboard which contained more percentage of old corrugated containers (OCC) imported from foreign countries than domestic waste paper. The results obtained from the study were summarized as follows ; 1. Equilibrium moisture content (EMC) of the sample boxes was established after about 20 hours, and the EMC by absorption was lower than that by desorption. The EMC increased with the increasing of relative humidity and with the decreasing of temperature, and the rate of increasing was much higher above the relative humidity of 50%. 2. The maximum compressive strength of Box A was about 100 kgf greater than that of Box B on the same enviromental conditions. The strength of the sample boxes decreased rapidly with the increasing of relative humidity. The effect of relative humidity on the strength was a little higher than that of temperature. 3. As the applied load was progressively increased and a level was reached, the vertical side panels ($L{\times}D$) deflected laterally inwards or outwards. The panels deflected laterally inwards at higher relative humidity. 4. The maximum compressive deflection ratio and the critical deflection ratio of the sample boxes were increased linearly with the increasing of relative hunidity, but trends for its ratios showed inconsistant response to temperature.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.22 no.2
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• pp.632-637
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• 2021

In order to develop future construction technology, research is actively being conducted on concrete construction technology using 3D printing, which is currently in the spotlight as a future industry in domestic and foreign construction industries and academia. However, 3D printing technology is currently being developed and does not meet the requirements for proper construction technology and the properties of concrete materials, and it is difficult to apply in the actual field. Research is also needed for the durability management and maintenance of constructed structures. This work compares the compressive and flexural strength to that produced in conventional molds by dividing the 3D printed concrete output by the laminated X, Y, and Z axes. The compressive strength of a test specimen in the II Z-axis test direction was 8-10% higher than that of the other test directions (I and III Y axes and X axis). The strength was 4% lower than that of a molded test specimen. As of 28th of the age, the bending strength of the test specimen in the Z-axis direction was 5 to 7% higher than that of the I and III Y, and X-axis test directions, and the strength was 2% lower than that of the molded test specimen.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.8
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• pp.106-111
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• 2004

Micro-stereolithography technology has made it possible to fabricate any form of three-dimensional microstructures. It makes a 3D structure by dividing the shape into many slices of relevant thickness along horizontal surface, hardening each layer of slice with a laser, and stacking them up to a desired shape. Until now, however, the micro-stereolithography device was not designed systematically because the key factors governing the device were not considered. In this paper, we designed micro-stereolithography device using axiomatic approach. This paper contains an overview and an analysis of a new proposed system for development of micro-stereolithegraphy device, and detailed descriptions of the activities in this system. The newly designed system offers reduced machine size by minimizing of optical components and decoupled design matrix.

• 한국지구물리탐사학회:학술대회논문집
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• 2005.09a
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• pp.11-18
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• 2005

Filament inversion routines are highly effective for target definition whenever total-field DHTEM vectors can be obtained using three-component logging tools. However most cross-hole components contain significant noise related to sensor design and errors in observation of probe rotation. Standard stacking methods can be used to improve data quality but additional statistical methods based on cross-correlation and spatial averaging of orthogonal components may be required to ensure a consistent vector migration path. Apart from assisting with spatial averaging, multiple filaments generated for successive time-windows can provide additional imaging information relating to target geometry and current migration. New digital receiver systems provide additional time-windows to provide better tracking options necessary for high-resolution imaging of this type.

• Proceedings of the KSME Conference
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• 2007.05a
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• pp.560-565
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• 2007

Motivated by needs such as those in the aerospace industry, this paper demonstrates ability to significantly increase buckling loads of perforated composite laminated plates by synergizing FEM and a genetic optimization algorithm (GA). Plate geometry is discretized into specially-developed 3D degenerated eight-node shell isoparametric layered composite elements. General shell theory, involving incremental nonlinear finite element equilibrium equation, is employed. Fiber orientation within individual plies of each element is controlled independently by the genetic algorithm. Eigen buckling analysis is performed using the subspace iteration method. Available results demonstrate the approach is superior to more conventional methodologies such as modifying ply thickness or the stacking sequence of individual rectilinear plies having common fiber orientation through the plate.