• 제목/요약/키워드: 3D printing technology

검색결과 675건 처리시간 0.035초

방사선 치료에서 3D 프린터로 제작된 금속 필라멘트의 투과율에 관한 유용성 평가 (Evaluation of the Usefulness of the Transmittance of Metal Filaments Fabricated by 3D Printers in Radiation Therapy)

  • 권경태;장희민;윤명성
    • 한국방사선학회논문지
    • /
    • 제15권7호
    • /
    • pp.965-973
    • /
    • 2021
  • 방사선 치료는 고에너지 X선을 최소 20 Gy에서 80 Gy까지 다양하게 조사되기 때문에 종양이 위치하는 국소부위에 고선량을 투여하며 일부 정상조직의 여러 부작용이 예상 된다. 현재 임상에서는 정상조직의 차폐를 위한 노력으로 대표적인 재료인 납을 사용하고 있지만 납은 인체에 유해한 중금속으로 분류되고 있으며 다량의 피부접촉은 중독을 유발할 수 있다. 따라서 본 연구는 FDM(Fused Deposition Modeling)방식의 3차원 프린터의 재료 Tungsten, Brass, Copper을 이용하여 납의 한계점을 보완 할 수 있는 측정시트를 제작하고 투과성능을 알아보고자 한다. 3D 프린터를 이용해 Tungsten 혼합 필라멘트 투과측정 시트 크기는 70 × 70 mm, 두께는 1, 2, 4 mm로 제작하였으며 제작한 측정시트의 투과성능을 확인하기 위해 선형가속기 (TrueBeam STx, S/N: 1187)에서 발생된 6, 15 MV을 Water Phantom과 Ion chamber (FC-65G), elcetrometer (PTW UNIDOSE)을 사용하여 SSD 100 cm, 물 속 5 cm에서 100 MU를 조사하여 측정하고 투과성능을 평가하였다. 각 소재의 측정시트를 1 mm씩 증가시킨 결과 6 MV에서는 Tungsten 시트의 경우 3.8~3.9 cm일때의 시트는 기존 납의 차폐체 두께 6.5 cm 보다 얇으며, 15 MV에서는 Tungsten 시트의 경우 4.5~4.6 cm일 때 시트는 기존 납의 차폐체 두께 7 cm 보다 얇으며 동등한 성능을 확인할 수 있었다. 본 연구를 통하여 Tungsten 합금 필라멘트을 이용하여 제작한 투과측정 시트는 고에너지 영역에서의 투과 차폐 가능성을 확인하였으며. 대체품으로써의 사용가능성 또한 우수함을 확인하였다, 향후 3D 프린팅 기술로 차폐제 제작을 위한 기초자료로 제공할 수 있을 것으로 사료 된다.

빅데이터 기반 실시간 불량품 발생 원인 분석 및 설비 교체주기 예측 (Analysis of Defective Causes in Real Time and Prediction of Facility Replacement Cycle based on Big Data)

  • 황승연;곽경민;신동진;곽광진;노영주;박경원;박정민;김정준
    • 한국인터넷방송통신학회논문지
    • /
    • 제19권6호
    • /
    • pp.203-212
    • /
    • 2019
  • 최근 4차 산업혁명과 함께 세계 제조 강국들은 침체된 제조업의 부흥을 위해 국가적 전략을 추진하고 있다. 이러한 추세에 따라 문재인 정부도 '과학기술 발전이 선도하는 4차 산업혁명'이라는 전략을 제시하였다. 4차 산업혁명을 이끄는 핵심기술인 IoT, Cloud, Big data, Mobile, AI 등의 지능정보기술은 로봇, 3D 프린팅 등과 같은 신산업의 등장과 기존 주요 제조업의 스마트화를 촉진하고 있다. 스마트공장과 같은 기술이 발전함에 따라 IoT 기반의 센싱 기술이 발전하면서 이전에는 수집할 수 없었던 다양한 데이터를 측정할 수 있게 되었고, 각 공정에서 생성되는 데이터도 폭발적으로 증가했다. 따라서 본 논문에서는 데이터 생성기를 활용하여 스마트공장에서 발생할 수 있는 가상 데이터를 생성하고, 이를 활용하여 실시간으로 불량품의 발생 원인을 분석하고 설비의 교체주기를 예측하는 방법을 설명한다.

SnBi 저온솔더의 플립칩 본딩을 이용한 스마트 의류용 칩 접속공정 (Chip Interconnection Process for Smart Fabrics Using Flip-chip Bonding of SnBi Solder)

  • 최정열;박동현;오태성
    • 마이크로전자및패키징학회지
    • /
    • 제19권3호
    • /
    • pp.71-76
    • /
    • 2012
  • SnBi 저온솔더의 플립칩 공정을 이용한 스마트 의류용 칩 접속공정에 대해 연구하였다. 캐리어 필름에 형성한 Cu 리드프레임을 $130^{\circ}C$에서 직물에 열압착 시킴으로써 Cu 리드프레임이 전사된 직물 기판을 형성하였다. 칩 시편에 SnBi 페이스트를 도포하여 솔더범프를 형성한 후 직물 기판의 Cu 리드프레임에 배열하고 $180^{\circ}C$에서 60초 동안 유지시켜 플립칩 본딩하였다. SnBi 저온솔더를 사용하여 형성된 스마트 의류용 플립칩 접속부의 평균 접속저항은 $9m{\Omega}$이었다.

HDD에서 상대습도, 디스크 가속도, 정지시간이 슬라이더-디스크 인터페이스의 마찰대전 발생에 미치는 영향 (Effect of Relative Humidity, Disk Acceleration, and Rest Time on Tribocharge Build-up at a Slider-Disk Interface of HDD)

  • 황정호;이대영;이재호;좌성훈
    • Tribology and Lubricants
    • /
    • 제22권2호
    • /
    • pp.59-65
    • /
    • 2006
  • In hard disk drives as the head to disk spacing continues to decrease to facilitate recording densities, slider disk interactions have become much more severe due to direct contact of head and disk surfaces in both start/stop and flying cases. The slider disk interaction in CSS (contact-start-stop) mode is an important source of particle generation and tribocharge build-up. The tribocharge build-up in the slider disk interface can cause ESD (electrostatic discharge) damage. In turn, ESD can cause severe melting damage to MR or GMR heads. The spindle speed of typical hard disk drives has increased in recent years from 5400 rpm to 15000 rpm and even higher speeds are anticipated in the near future. And the increasing disk velocity leads to increasing disk acceleration and this might affect the tribocharging phenomena of the slider/disk interface. We investigated the tribocurrent/voltage build-up generated in HDD, operating at increasing disk accelerations. In addition, we examined the effects with relative humidity conditions and rest time. We found that the tribocurrent/voltage was generated during pico-slider/disk interaction and its level was about $3\sim16pA$ and $0.1\sim0.3V$, respectively. Tribocurrent/voltage build-up was reduced with increasing disk acceleration. Higher humidity conditions $(75\sim80%)$ produced lower levels tribovoltage/current. Therefore, a higher tribocharge is expected at a lower disk acceleration and lower relative humidity condition. Rest time affected the charge build-up at the slider-disk interface. The degree of tribocharge build-up increased with increasing rest time.

3D 바이오프린팅 사례로 본 다학제간 융복합 연구에 대한 소고 (A study on multidisciplinary and convergent research using the case of 3D bioprinting)

  • 박주안;정성준;마은정
    • 한국과학예술포럼
    • /
    • 제30권
    • /
    • pp.151-161
    • /
    • 2017
  • 본 논문에서는 공학 분야에서 '공동연구' (collaboration) 과정을 연구 주제로 설정하고, 효과적인 협업의 형태 및 협업을 통해 생성되는 문화 또는 지식 창출의 가능성 및 함의에 대해 다룬다. '융합'에 대한 규범적 정의 및 행위 양식을 제안하는 방법을 취하지 않고, 융합의 한 형태로 공동연구를 선택하여 융합의 가능성을 탐색한다. 특히, 사회과학적 분석 방법을 빌어 3D 바이오프린팅 연구실에서 이뤄지고 있는 융합기술의 형성과정을 기술 및 분석하여, 공동연구를 통한 융합연구가 공학연구 문화 및 공학교육에 던지는 함의에 대해 논한다. 이를 위해 논문에서는 다음과 같은 질문을 던진다. 첫째, 학문하는 문화, 역사, 그리고 학문의 이론적 배경 및 방법이 전혀 다른 연구자들이 만나서 '공동연구'가 가능하며, 공동연구를 통해 유의미한 융합적 지식과 기술을 창출할 수 있을까? 둘째, 공동연구를 독려하고 촉진시키는 연구조직의 구성 조건 및 문화적 요소들은 무엇이 있을까? 셋째, 공동연구를 통해 소위 π자형 융합인재의 육성이 가능할까? 연구자들은 3D 바이오프린팅 사례를 통해 다음과 같은 결론을 내리고자 한다. 첫째, 정부 및 대학 차원에서의 재정적, 정책적 지원이 중요하며, 무엇보다 책임연구자의 융합연구에 대한 개방적, 능동적, 탄력적인 태도가 우선되어야 한다. 책임연구자는 학문적 배경이 다른 연구자들 사이에서 지적, 물적, 사회적, 인간적, 기술적 교류를 가능하게 하는 연구실 환경을 만드는 것이 중요하다. 둘째, 융합연구를 위해 해결해야 하는 도전적 난제들이 많음에도 생명과학과 프린팅 기술이 융합하여 3D 바이오프린팅이란 분야를 개척한 것처럼 이종적 학문 간의 의미있는 융합은 가능하다. 셋째, 융합연구의 장점 중의 하나는 4차 산업혁명 시대를 주도할 π형 인재 양성할 기회를 제공한다는 점이다.

PVOH와 polyDADMAC 첨가에 의한 산화전분의 표면사이징 효과 변화 (Effect of PVOH or polyDADMAC Addition on Surface Sizing with Oxidized Starch)

  • 서동일;정영빈;정광호;이학래;윤혜정
    • 펄프종이기술
    • /
    • 제45권4호
    • /
    • pp.1-8
    • /
    • 2013
  • High loading of printing and writing grades with fillers has many advantageous aspects in papermaking because it allows decreasing fiber use and reducing manufacturing cost. High loading technology, however, has some disadvantageous aspects as well. It decreases physical properties of papers, especially strength properties. The problem associated with high loading can be reduced by applying surface sizing starch solution onto paper surface. It is important to control the penetration of the surface sizing starch solution into paper web to obtain the desired property improvement. In this study, the effect of the addition of two polymers into starch solution on paper properties has been examined. PVOH and polyDADMAC were used as polymeric additives for surface sizing with oxidized starch. Viscosity of starch solutions and surface roughness of dried starch films on glass slides showed that some interactions between polymeric additives and oxidized starch have been occurred and the most extensive interaction with starch solution was obtained with high molecular weight polyDADMAC. Low molecular weight PVOH was most effective in improving folding endurance and internal bond strength. On the other hand, polymer addition showed no effect on surface strength of paper. This indicates that not the level of starch holdout but the bonding strength of starch itself has predominant influence on surface strength of paper.

프리필 밸브의 거동 예측용 유압 시스템의 압력/유량 맥동 분석 (Pressure/Flow Pulsation Characteristics of the Hydraulic System for Behaviour Prediction of the Prefill Valve)

  • 박정우;하룬 아흐마드 칸;정은아;권성자;윤소남;이후승
    • 드라이브 ㆍ 컨트롤
    • /
    • 제18권2호
    • /
    • pp.1-8
    • /
    • 2021
  • In this work, a circuit with a hydraulic power unit is formulated as a means of predicting the behavior of the prefill valve in the future. The behavior of the prefill valve can be examined by the measurements of the configured power unit, and the performance is determined by using hydraulic pumps, relief valves, and hydraulic hoses that make up the power unit. In particular, pressure/flow pulsation generated by hydraulic pumps can cause instability in the prefill valve and cause noise-induced degradation of the overall performance and reliability of the hydraulic system containing the prefill valve. Therefore, to study the behavior and performance of the prefill valve in a relatively accurate manner, the prediction of the characteristics of the hydraulic power unit driving the prefill valve is very important. In this study, the pulsation characteristics of the hydraulic pump were analyzed to theoretically demonstrate its relationship with different settings of the power unit, such as relief valve pressure settings and the presence/absence of the hose.

반응성 안료의 DTP공정 적용에 따른 HTPE원단의 태 시뮬레이션 및 염색성 연구 (Simulation of the Stiffness of HTPE Fabric according to the Application of Reactive Pigment DTP Process and Dyeability)

  • 심지현;이종혁;유성훈;권기환;배진석
    • 한국염색가공학회지
    • /
    • 제33권4호
    • /
    • pp.210-219
    • /
    • 2021
  • It was intended to conduct basic research to reduce development lead time and cost consumed in DTP process technology development. For the simulation of HTPE fabric, virtual engineering software was used to generate fiber model, yarn model, fabric model, and finite element model of HTPE fiber. The purpose of this study is to analyze the correlation and error rate between the stiffness numerical analysis results according to the direct DTP process parameters using reactive dyes in the generated finite element model and the stiffness measurements of the actual sample ac- cording to ASTM D1388. And, after dyeing the HTPE plain fabric according to the direct DTP process parameters, we want to analyze the dyeability of the HTPE fabric fabrics according to the direct DTP process parameters through the color fastness analysis. When looking at the results of the analysis of the finite element model, a higher value was shown when the distance between the nozzle and the fabric was 3mm than when the distance was 10mm. When the distance between the nozzle and the fabric was 10mm and 7mm, the reactive dye did not penetrate sufficiently, resulting in poor clarity when viewed with the naked eye.

반도체 및 전자패키지의 방열기술 동향 (Heat Dissipation Trends in Semiconductors and Electronic Packaging)

  • 문석환;최광성;엄용성;윤호경;주지호;최광문;신정호
    • 전자통신동향분석
    • /
    • 제38권6호
    • /
    • pp.41-51
    • /
    • 2023
  • Heat dissipation technology for semiconductors and electronic packaging has a substantial impact on performance and lifespan, but efficient heat dissipation is currently facing limited improvement. Owing to the high integration density in electronic packaging, heat dissipation components must become thinner and increase their performance. Therefore, heat dissipation materials are being devised considering conductive heat transfer, carbon-based directional thermal conductivity improvements, functional heat dissipation composite materials with added fillers, and liquid-metal thermal interface materials. Additionally, in heat dissipation structure design, 3D printing-based complex heat dissipation fins, packages that expand the heat dissipation area, chip embedded structures that minimize contact thermal resistance, differential scanning calorimetry structures, and through-silicon-via technologies and their replacement technologies are being actively developed. Regarding dry cooling using single-phase and phase-change heat transfer, technologies for improving the vapor chamber performance and structural diversification are being investigated along with the miniaturization of heat pipes and high-performance capillary wicks. Meanwhile, in wet cooling with high heat flux, technologies for designing and manufacturing miniaturized flow paths, heat dissipating materials within flow paths, increasing heat dissipation area, and reducing pressure drops are being developed. We also analyze the development of direct cooling and immersion cooling technologies, which are gradually expanding to achieve near-junction cooling.

ZnO nanostructures for e-paper and field emission display applications

  • Sun, X.W.
    • 한국정보디스플레이학회:학술대회논문집
    • /
    • 한국정보디스플레이학회 2008년도 International Meeting on Information Display
    • /
    • pp.993-994
    • /
    • 2008
  • Electrochromic (EC) devices are capable of reversibly changing their optical properties upon charge injection and extraction induced by the external voltage. The characteristics of the EC device, such as low power consumption, high coloration efficiency, and memory effects under open circuit status, make them suitable for use in a variety of applications including smart windows and electronic papers. Coloration due to reduction or oxidation of redox chromophores can be used for EC devices (e-paper), but the switching time is slow (second level). Recently, with increasing demand for the low cost, lightweight flat panel display with paper-like readability (electronic paper), an EC display technology based on dye-modified $TiO_2$ nanoparticle electrode was developed. A well known organic dye molecule, viologen, was adsorbed on the surface of a mesoporous $TiO_2$ nanoparticle film to form the EC electrode. On the other hand, ZnO is a wide bandgap II-VI semiconductor which has been applied in many fields such as UV lasers, field effect transistors and transparent conductors. The bandgap of the bulk ZnO is about 3.37 eV, which is close to that of the $TiO_2$ (3.4 eV). As a traditional transparent conductor, ZnO has excellent electron transport properties, even in ZnO nanoparticle films. In the past few years, one-dimension (1D) nanostructures of ZnO have attracted extensive research interest. In particular, 1D ZnO nanowires renders much better electron transportation capability by providing a direct conduction path for electron transport and greatly reducing the number of grain boundaries. These unique advantages make ZnO nanowires a promising matrix electrode for EC dye molecule loading. ZnO nanowires grow vertically from the substrate and form a dense array (Fig. 1). The ZnO nanowires show regular hexagonal cross section and the average diameter of the ZnO nanowires is about 100 nm. The cross-section image of the ZnO nanowires array (Fig. 1) indicates that the length of the ZnO nanowires is about $6\;{\mu}m$. From one on/off cycle of the ZnO EC cell (Fig. 2). We can see that, the switching time of a ZnO nanowire electrode EC cell with an active area of $1\;{\times}\;1\;cm^2$ is 170 ms and 142 ms for coloration and bleaching, respectively. The coloration and bleaching time is faster compared to the $TiO_2$ mesoporous EC devices with both coloration and bleaching time of about 250 ms for a device with an active area of $2.5\;cm^2$. With further optimization, it is possible that the response time can reach ten(s) of millisecond, i.e. capable of displaying video. Fig. 3 shows a prototype with two different transmittance states. It can be seen that good contrast was obtained. The retention was at least a few hours for these prototypes. Being an oxide, ZnO is oxidation resistant, i.e. it is more durable for field emission cathode. ZnO nanotetropods were also applied to realize the first prototype triode field emission device, making use of scattered surface-conduction electrons for field emission (Fig. 4). The device has a high efficiency (field emitted electron to total electron ratio) of about 60%. With this high efficiency, we were able to fabricate some prototype displays (Fig. 5 showing some alphanumerical symbols). ZnO tetrapods have four legs, which guarantees that there is one leg always pointing upward, even using screen printing method to fabricate the cathode.

  • PDF