• Conservation Science in Museum
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• v.31
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• pp.39-54
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• 2024

We wanted to check The feasibility of substituting the manual ceramic packaging technology with 3D digital technology using cotton pad packaging material was examined. To examine the shock absorption, vibration resistance and compression resistance of 3D packaging material printed out by using TPU material, composite vibration, and packaging compression and drop tests were conducted. As the results of the tests, the 3D packaging material displayed vibration resistance that has been improved by approximately 10~20% based on the damping ratio of the composite vibration test, compression resistance performances that are more than 5 times higher, and shock absorption performance was also improved as the packaged object was not broken in the six-sided drop test. Based on these results, it is determined that it would be possible to secure the reusability of the ceramic packaging materials and simplify packaging techniques, and to present diversity in the packaging materials and packaging technologies.

• Journal of the Microelectronics and Packaging Society
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• v.29 no.4
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• pp.1-8
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• 2022

High-density packaging technologies, including Through-Si-Via (TSV) technologies, are considered important in many fields such as IoT (internet of things), 6G/5G (generation) communication, and high-performance computing (HPC). Achieving high integration in two dimensional packaging has confronted with physical limitations, and hence various studies have been performed for the three-dimensional (3D) packaging technologies. In this review, we described about the causes and effects of scallop formation in TSV, the scallop-free etching technique for creating smooth sidewalls, Cu pillar and Cu-SiO₂ hybrid bonding in TSV. These technologies are expected to have effects on the formation of high-quality TSVs and the development of 3D packaging technologies.

• Journal of the Semiconductor & Display Technology
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• v.22 no.4
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• pp.38-47
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• 2023

Three dimensional (3D) packaging is a next-generation packaging technology that vertically stacks chips such as memory devices. The necessity of 3D packaging is driven by the increasing demand for smaller, high-performance electronic devices (HPC, AI, HBM). Also, it facilitates innovative applications across another fields. With growing demand for high-performance devices, companies of semiconductor fields are trying advanced packaging techniques, including 2.5D and 3D packaging, MR-MUF, and hybrid bonding. These techniques are essential for achieving higher chip integration, but challenges in mass production and fine-pitch bump connectivity persist. Advanced bonding technologies are important for advancing the semiconductor industry. In this review, it was described 3D packaging technologies for chip integration including mass reflow, thermal compression bonding, laser assisted bonding, hybrid bonding.

• Journal of the Microelectronics and Packaging Society
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• v.21 no.2
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• pp.23-29
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• 2014

Less power consumption, lower cost, smaller size and more functionality are the increasing demands for consumer electronic devices. The three dimensional(3-D) TSV packaging technology is the potential solution to meet this requirement because it can supply short vertical interconnects and high input/output(I/O) counts. Cu(Copper) has usually been chosen to fill the TSV because of its high conductivity, low cost and good compatibility with the multilayer interconnects process. However, the CTE mismatch and Cu ion drift under thermal stress can raise reliability issues. This study discribe the thermal stress reliability trend for successful implementation of 3-D packaging.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2001.07a
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• pp.134-141
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• 2001

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2005.07a
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• pp.357-358
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• 2005

Compact power amplifier modules (PAM) for WCDMA/KPCS and GSM/WCDMA dual-band applications based on multilayer low temperature co-fired ceramic (LTCC) substrates are presented in this paper. The proposed modules are composed of an InGaP/GaAs HBT PAs on top of the LTCC substrates and passive components such as RF chokes and capacitors which are embedded in the substrates. The overall size of the modules is less than 6mm $\times$ 6mm $\times$ 0.8mm. The measured result shows that the PAM delivers a power of 28 dBm with a power added efficiency (PAE) of more than 30 % at KPCS band. The adjacent-channel power ratio (ACPR) at 1.25-MHz and 2.25-MHz offset is -44dBc/30kHz and -60dBc/30kHz, respectively, at 28-dBm output power. Also, the PAM for WCDMA band exhibits an output power of 27 dBm and 32-dB gain at 1.95 GHz with a 3.4-V supply. The adjacent-channel leakage ratio (ACLR) at 5-MHz and 10-MHz offset is -37.5dBc/3.84MHz and -48dBc/3.84MHz, respectively. The measured result of the GSM PAM shows an output power of 33.4 dBm and a power gain of 30.4 dB at 900MHz with a 3.5V supply. The corresponding power added efficiency (PAE) is more than 52.6 %.

• Journal of the Microelectronics and Packaging Society
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• v.27 no.3
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• pp.21-27
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• 2020

The importance of floating photovoltaic systems has recently been emerging to address some issues arising from the installation of conventional ground-mounted photovoltaics. Floating photovoltaics have a few advantages such as cutting down land usage, reducing water evaporation or creating algae. Though there is still necessity to supplement with technical issues: mechanical stability, reliability and long-term durability of floaters and modules. In this paper, we focus the current level of packaging development and introduce research trends that could be applied to next-generation floating photovoltaics.

• Journal of Conservation Science
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• v.37 no.1
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• pp.55-62
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• 2021

This study investigated mechanical property changes by measuring compression factors, resilience, and compressive strength according to packaging pattern and filling rate to identify the applicability of cultural heritage packaging using thermoplastic polyurethane elastomers (TPU). Research results indicate that the cross-shaped 3D pattern showed the best resilience when the internal filling rate was 20%, while the octet pattern was the best when the filling rate was either 40 and 60%. The octet pattern had the best mechanical properties and stability with resistance capacities of 20.79 kgf/cm², 40.40 kgf/cm², and 82.23 kgf/cm² at 38%, 39%, and 40% recovery speeds, respectively, depending on the internal filling rate (20, 40, 60%). Based on these results, basic data on the applicability, stability, and reliability of 3D cultural heritage packaging materials using TPU materials were obtained.

• Proceedings of the IEEK Conference
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• 2006.06a
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• pp.169-170
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• 2006

A band pass filter for the V-band application with unique circuit and structure was designed and implemented using 2-metals, 3-BCB layers. In the mean while the effective electrical conductivity of metal layer was extracted and its value was $4{\times}10^7S/m$. The insertion loss of band pass filter at 60 GHz was 3.0 dB and group delay was below 0.1 ns.

• The Journal of the Korea institute of electronic communication sciences
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• v.8 no.6
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• pp.923-931
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• 2013

RFID (Radio Frequency Identification), which is a kind of the electronic tag, is a wireless access device using the radio frequency for recognizing the ID information. It has a variety of application such as the bus card, gate access card, distribution industry, and management of construction materials. The performance and size of RFID depend on the penetrability, recognition ratio, memory size, multi tag recognition, external pollution dust, and exterior impact, and RFID requires the packaging to protect itself considered above factors. Recently, RFID is diversely employed to effectively manage construction materials and the RFID packaging, which is robust to the external impact, is required to attach RFID on construction materials. In this paper, we propose the construction material RFID packaging designed to be robust for the external impact and to be practicable for change of the broken RFID. For the change of RFID, we separate the cast and body of the packaging. Also, we present the detail drawing for the proposed construction material RFID packaging and implement the performance evaluation of the packaging manufactured using 3D printer.