• 한국ITS학회 논문지
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• 제11권3호
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• pp.23-30
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• 2012

본 논문에서는 근접 영역에 적용할 수 있는 새로운 900 MHz RFID 리더기 안테나에 대한 연구 결과를 제안한다. 본 논문에서 제안된 안테나는 주기성을 갖는 마이크로 스트립 안테나 구조를 사용하였다. 안테나의 크기는 $313mm{\times}152mm{\times}14mm$ 이다. 안테나의 성능은 근접영역에서 균일한 전계 분포를 갖고, 안테나의 이득은 -2 dBi 이고 하트 모양의 빔 패턴을 가진다. 제안된 안테나는 리더기의 송신출력이 17 dBm에서 23 dBm까지의 범위를 보인다. 본 논문에서 제안된 안테나는 금속면 위에 태그가 선적이 될 때 태그의 금속성분으로 인한 반사전력을 최소화하고 외부로 방사되는 전력을 최소화하여 오인식을 최소화하였다.

• 대한기계학회논문집A
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• 제31권9호
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• pp.910-914
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• 2007

We present a simple and an inexpensive method for the fabrication of a nano-fluidic filter and a nano-pore micromixer using self-assembly of nano-spheres and surface tension. Colloid-plug was formed by surface tension of liquid in a microchannel to fabricate nanofluidic filter. When colloid is evaporated, nano-spheres in a colloid are orderly stacked by a capillary force. Orderly stacked nano-spheres form 3-D nano-mesh which can be used as a mesh structure of a fluidic filter. We used silica nano-sphere whose diameter is $567{\pm}85nm$, and silicon micro-channel of $50{\mu}m$-diameter. Fabricated nano-fluidic filter in a micro-channel has median pore diameter of 158nm which was in agreement with expected diameter of the nano-pore of $128{\pm}19nm$. A nano-pore micromixer consists of $200\;{\mu}m-wide,\;100\;{\mu}m-deep$ micro-channel and self-assembled nano-spheres. In the nano-pore micromixer, two different fluids had no sooner met together than two fluids begin to mix at wide region. From the experimental study, we completely apply self-assembly of nano-spheres to nano-fluidic devices.

• 한국전기전자재료학회:학술대회논문집
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• 한국전기전자재료학회 1999년도 추계학술대회 논문집
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• pp.159-162
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• 1999

All solid state thin film micro-batteries consisting of lithium metal anode, an amorphous LiPON electrolyte and cathode of vanadium oxide have been fabricated and characterized, which were fabricated with cell structure of Li/LiPON/V$_2$O$\sub$5/Pt. The vanadium oxide thin films were formed by d.c. reactive sputtering on Pt current collector. After deposition of vanadium oxide films, in-situ growths of lithium phosphorus oxynitride film were conducted by r.f. sputtering of Li$_3$PO$_4$ target in mixture gas of N$_2$ and O$_2$. The pure metal lithium film was deposited by thermal evaporation on thin film LiPON electrolyte. The cell capacity was about 45${\mu}$Ah/$\textrm{cm}^2$ $\mu\textrm{m}$ after 200 cycle. No appreciable degradation of the cell capacity could be observed after 50 cycles .

• 한국분말재료학회지
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• 제25권3호
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• pp.246-250
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• 2018

In this study, we investigate the deformation behavior of $Hf_{44.5}Cu_{27}Ni_{13.5}Nb_5Al_{10}$ metallic glass powder under repeated compressive strain during mechanical milling. High-density (11.0 g/cc) Hf-based metallic glass powders are prepared using a gas atomization process. The relationship between the mechanical alloying time and microstructural change under phase transformation is evaluated for crystallization of the amorphous phase. Planetary mechanical milling is performed for 0, 40, or 90 h at 100 rpm. The amorphous structure of the Hf-based metallic glass powders during mechanical milling is analyzed using differential scanning calorimetry (DSC) and X-ray diffraction (XRD). Microstructural analysis of the Hf-based metallic glass powder deformed using mechanical milling reveals a layered structure with vein patterns at the fracture surface, which is observed in the fracture of bulk metallic glasses. We also study the crystallization behavior and the phase and microstructure transformations under isothermal heat treatment of the Hf-based metallic glass.

• 제어로봇시스템학회:학술대회논문집
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• 제어로봇시스템학회 2005년도 ICCAS
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• pp.2290-2295
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• 2005

In this paper, it is developed simulator system of 3 D.O.F parallel robot for educate of expertness. This simulator system is composed of three parts ? 3 D.O.F parallel robot, controller (hardware) and software. First, basic structure of the robot is 3 active rotary actuator that small geared step motor with fixed base. An input-link is connected to this actuator, and this input-link can connect two ball joints. Thus, two couplers can be connected to the input-link as a pair. An end-plate, which is jointed by a ball joint, can be connected to the opposite side of the coupler. A sub-link is produced and installed to the internal spring, and then this sub-link is connected to the upper and bottom side of the coupler in order to prevent a certain bending or deformation of the two couplers. The robot has the maximum diameter of 230 mm, 10 kg of weight (include the table), and maximum height of 300 mm. Hardware for control of the robot is composed of computer, micro controller, pulse generator, and motor driver. The PC used in the controller sends commands to the controller, and transform signals input by the user to the coordinate value of the robot by substituting it into equations of kinematics and inverse kinematics. A controller transfer the coordinate value calculated in the PC to a pulse generator by transforming it into signals. A pulse generator analyzes commands, which include the information received from the micro controller. A motor driver transfer the pulse received from the pulse generator to a step motor, and protects against the over-load of the motor Finally, software is a learning purposed control program, which presents the principle of a robot operation and actual implementation. The benefit of this program is that easy for a novice to use. Developed robot simulator system can be practically applied to understand the principle of parallel mechanism, motors, sensor, and various other parts.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2006년도 춘계학술대회 논문집
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• pp.23-24
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• 2006

We present a dispersive scheme of white-light interferometry that enables not only to perform tomographical measurements of thin-film layers but also to measure a refractive index without mechanical depth scanning. The interferometry is found useful particularly for in-situ 3-D inspection of micro-engineered surfaces such as liquid crystal displays, semi-conductor and MEMS structure, which requires for high-speed implementation of 3-D surface metrology.

• 대한전자공학회:학술대회논문집
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• 대한전자공학회 2008년도 하계종합학술대회
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• pp.411-412
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• 2008

The high performance 94 GHz MMIC(Monolithic Micro-wave Integrated Circuit) single balanced mixer was designed and fabricated, using MHEMT structure based diodes and a CPW(Coplanar Waveguide) tandem coupler. A novel single-balanced structure of diode mixer is proposed in this work, where a 3-dB tandem coupler with two section of parallel-coupled line. Implemented air-bridge crossover structures achieve wide frequency operation and the fabricated mixer exhibits excellent LO-RF isolation, larger than 30 dB, in the 5 GHz bandwidth of 91-96 GHz. A good conversion loss of 7.4 dB is measured at 94 GHz. The proposed MHEMT-based diode mixer shows superior LO-RF isolation and conversion loss to those of the W-band mixers reported to date.

• Mycobiology
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• 제40권3호
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• pp.151-158
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• 2012

Very few studies have addressed the phylogenetic diversity of fungi from Northeast India under the Eastern Himalayan range. In the present study, an attempt has been made to study the phylogenetic diversity of culturable soil fungi along the altitudinal gradients of eastern Himalayas. Soil samples from 24 m above sea level to 2,000 m above sea level altitudes of North-East India were collected to investigate soil micro-fungal community structure and diversity. Molecular characterization of the isolates was done by PCR amplification of 18S rDNA using universal primers. Phylogenetic analysis using BLAST revealed variation in the distribution and richness of different fungal biodiversity over a wide range of altitudes. A total of 107 isolates were characterized belonging to the phyla Ascomycota and Zygomycota, corresponding to seven orders (Eurotiales, Hypocreales, Calosphaeriales, Capnodiales, Pleosporales, Mucorales, and Mortierellales) and Incertae sedis. The characterized isolates were analysed for richness, evenness and diversity indices. Fungal diversity had significant correlation with soil physico-chemical parameters and the altitude. Eurotiales and Hypocreales were most diverse and abundant group of fungi along the entire altitudinal stretch. Species of Penicillium (D=1.44) and Aspergillus (D=1.288) were found to have highest diversity index followed by Talaromyces (D=1.26) and Fusarium (D=1.26). Fungal distribution showed negative correlation with altitude and soil moisture content. Soil temperature, pH, humidity and ambient temperature showed positive correlation with fungal distribution.

• 한국결정학회지
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• 제7권1호
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• pp.20-29
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• 1996

(Sr1-xCax)CuO2 단결정을 융제법으로 제조하고 단결정 X-선 회절법을 이용하여 그 결정구조를 밝혔다. 이 화합물의 결정축계는 사방정계(orthorhombic system)이며, 공간군은 Cmcm(63), 그리고 격자상수 a, b, c는 각각 3.4645Å, 16.1417Å, 3.8727Å이었다. (Sr1-xCax)CuO2 화합물에서 Sr대신 치환되는 Ca이온의 한계를 구조적인 관점에서 연구하였다. 이를 위해 X-선 회절(CAD4), energy dispersive X-ray fluorescence (EDAX) and electron probe micro-analysis (EPMA) 등을 사용하였다. Ca가 치환됨에 따른 Cu-O 결합길이의 변화로부터 Ca의 치환한계를 결정하였는데 그 한계치는 Xca≒0.73이었다.

• 한국마이크로전자및패키징학회:학술대회논문집
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• 한국마이크로전자및패키징학회 2005년도 ISMP
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• pp.67-88
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• 2005

Mold-Flow 3 Die Stack CSP of Mold array packaging with different Gate types. As high density package option such as 3 or 4 die stacking technologies are developed, the major concerning points of mold related qualities such as incomplete mold, exposed wires and wire sweeping issues are increased because of its narrow space between die top and mold surface and higher wiring density. Full 3D rheokinetic simulation of Mold flow for 3 die stacking structure case was done with the rheological parameters acquired from Slit-Die rheometer and DSC of commercial EMC. The center gate showed severe void but corner gate showed relatively better void performance. But in case of wire sweeping related, the center gate type showed less wire sweeping than corner gate types. From the simulation results, corner gate types showed increased velocity, shear stress and mold pressure near the gate and final filling zone. The experimental Case study and the Mold flow simulation showed good agreement on the mold void and wire sweeping related prediction. Full 3D simulation methodologies with proper rheokinetic material characterization by thermal and rheological instruments enable the prediction of micro-scale mold filling behavior in the multi die stacking and other complicated packaging structures for the future application.