• Korean Journal of Computational Design and Engineering
• /
• v.12 no.4
• /
• pp.283-297
• /
• 2007

Seamless data integration in the CAx chain of the CAD/CAPP/CAM/CNC has been achieved to a high degree, but research concerning the transfer of data from conceptual sketches to a CAD system should be carried out further. This paper presents a method for reconstructing a 3D model from a freehand sketch. Sketch-based modeling research can be classified into gestural modeling methods and reconstructional modeling methods. This research involves the reconstructional modeling method. Here, Mitani's seminal work, designed for box-shaped 3D model using a predefined template, is improved by leveraging a relational template and specialized for automotive design. Matching between edge graphs of the relational template and the sketch is formulated and solved as the assignment problem using the feature vectors of the edges. Including the stroke preprocessing method required to generate an edge graph from a sketch, necessary procedures and relevant techniques for implementing the template-based modeling method are described. Examples from a working implementation are given.

• ETRI Journal
• /
• v.36 no.4
• /
• pp.635-642
• /
• 2014

Three-dimensional integrated circuits (3D ICs) implement heterogeneous systems in the same platform by stacking several planar chips vertically with through-silicon via (TSV) technology. 3D ICs have some advantages, including shorter interconnect lengths, higher integration density, and improved performance. Thermal-aware design would enhance the reliability and performance of the interconnects and devices. In this paper, we propose thermal-aware floorplanning with min-cut die partitioning for 3D ICs. The proposed min-cut die partition methodology minimizes the number of connections between partitions based on the min-cut theorem and minimizes the number of TSVs by considering a complementary set from the set of connections between two partitions when assigning the partitions to dies. Also, thermal-aware floorplanning methodology ensures a more even power distribution in the dies and reduces the peak temperature of the chip. The simulation results show that the proposed methodologies reduced the number of TSVs and the peak temperature effectively while also reducing the run-time.

• Korean Institute of Interior Design Journal
• /
• no.29
• /
• pp.257-264
• /
• 2001

To propose the construction of architectural interior design and communication using graphic, web3D, it was studied the kind and character of various representation methods that can be embodied in an architectural interior design on the web, and looks into whether these ways can be adapted to an architectural interior design process. Especially, the use of the current techniques on graphic and CAD data give the most suitable effect by using the integrated data such as vector animation, an interaction of object VR(Virtual Reality), a high quality of panorama VR, and data treatment and its interaction of drawing of cad data. As a result, the single data format shows not only one image representation but also a stream of continuous operation through a change into another format. But this desired study expects that another next studies will go on interaction and integration of digital format with increase of transmission speed expected in the future, and a digital model and its practical methods.

• Korean Journal of Construction Engineering and Management
• /
• v.5 no.4 s.20
• /
• pp.107-114
• /
• 2004

This paper represents the application of the 3D CAD Model data for 4D simulation and quantity estimation. These support the effective and practical use of 4D CAD model. By using and manipulating the 3D CAD model information, scheduling and quantity estimation could be developed more quickly and effectively. So the 3D CAD model information is made use of not only drawing a blueprint but also playing an important part of data integration platform. The scheduling module sets up the schedule generation logic that consists of period, priority of element arrangement, and time lag of floor placement. It sorts the working items as a priority of working process. And the quantity estimation module queries the material quantity of the structural elements according to the scheduling conditions. These two modules are developed using the 3D CAD model information and assist the function of 4D CAD model.

• International Journal of Naval Architecture and Ocean Engineering
• /
• v.3 no.1
• /
• pp.72-79
• /
• 2011

Typical results obtained by a newly developed, nonlinear time domain hybrid method for simulating large amplitude motions of ships advancing with constant forward speed in waves are presented. The method is hybrid in the way of combining a time-domain transient Green function method and a Rankine source method. The present approach employs a simple double integration algorithm with respect to time to simulate the free-surface boundary condition. During the simulation, the diffraction and radiation forces are computed by pressure integration over the mean wetted surface, whereas the incident wave and hydrostatic restoring forces/moments are calculated on the instantaneously wetted surface of the hull. Typical numerical results of application of the method to the seakeeping performance of a standard containership, namely the ITTC S175, are herein presented. Comparisons have been made between the results from the present method, the frequency domain 3D panel method (NEWDRIFT) of NTUA-SDL and available experimental data and good agreement has been observed for all studied cases between the results of the present method and comparable other data.

• Korean Journal of Geomatics
• /
• v.2 no.1
• /
• pp.65-73
• /
• 2002

GPS in the United States and GLONASS of the old Soviet Union are used currently as satellite navigation systems. Plans are being made to use the Galileo satellite system in Europe, and these plans focus on a combined application of the satellite navigation systems. In this study, we examined the possibility of effective application of a combination of GPS/GLONASS in urban areas, where 3-dimensional positioning is impossible with GPS alone. We analyzed the 3-D coordinate deviation of a GLONASS satellite by integration interval and compared it with GLONASS satellite coordinates in precise ephmerides by transforming it into WGS84. We also programmed GPS/GLONASS, analyzed 3-D positioning accuracy by static surveying and kinematic surveying with Ashtech Z18 receivers and Legacy receivers, and then compared the results to those of GPS surveying. As a result, we are able to decide the integration interval for producing GLONASS satellite coordinates in navigation and geographical information and construct a GPS/GLONASS data processing system by developing a DGPS/DGLONASS positioning program. If more than four GLONASS satellites are observed, the accuracy of GPS/GLONASS is better than that of GPS positioning. As a result of kinematic surveying in a congested urban area with skyscrapers, we discovered that the GPS/LONASS combination is very effective.

• Journal of Korea Multimedia Society
• /
• v.25 no.3
• /
• pp.546-557
• /
• 2022

Recently, the demand to interpret image data with artificial intelligence in various fields is rapidly increasing. Object recognition and detection techniques using deep learning are mainly used, and video integration analysis to determine unstructured object recognition is a particularly important problem. In the case of natural disasters or social disasters, there is a limit to the object recognition structure alone because it has an unstructured shape. In this paper, we propose intelligent video integration analysis system that can recognize unstructured objects based on video turning point and object detection. We also introduce a method to apply and evaluate object recognition using virtual augmented images from 2D to 3D through GAN.

• Proceedings of the Korean Society for Technology of Plasticity Conference
• /
• 2001.10a
• /
• pp.190-194
• /
• 2001

The integration of rapid prototyping and tooling has the potential for the rapid net shape manufacturing of three-dimensional parts with geometrical complexity. In this study, a new rapid prototyping process, transfer type of Variable Lamination Manufacturing (VLM-ST), was proposed to manufacture net shape of 3-D prototypes. In order to examine the efficiency and applicability of the proposed process, various 3-D parts, such as a world-cup logo, and extruded cross and a knob shape, were fabricated on the apparatus. In addition, the new rapid tooling process, which is a triple reverse process, was proposed to manufacture of 3-D functional part using VLM-ST prototypes and the plastic part of the knob shape was produced by the new rapid tooling process.

• Journal of Korea Multimedia Society
• /
• v.10 no.1
• /
• pp.49-57
• /
• 2007

Recently, CMOS RF integration has been widely explored in the wireless communication area to save cost, power, and chip area. The direct conversion architecture, rather than a more conventional super-het-erodyne, has been an attractive choice for single-chip integration because of its many advantages. However, the direct conversion architecture has several fundamental problems to solve in achieving performance comparable to a super-heterodyne counterpart. In this paper, we describe a programmable filter for mobile communication terminals using a direct conversion architecture. The proposed filter can be implemented with the active-RC filter and programmed to meet the requirements of different communication standards, including GSM, DECT and WCDMA. The filter can be tuned to select a detail frequency by changing the gate voltage of the MOS resistors. The gain of the proposed architecture can be programmed from 27dB to 72dB using the filter gain and VGA in 3dB steps.

• Korean Chemical Engineering Research
• /
• v.47 no.1
• /
• pp.1-10
• /
• 2009

As a demand for the portable device requiring smaller size and better performance is in hike, reducing the size of conventionally used planar 2 dimensional chip cannot be a solution for the enhancement of the semiconductor chip technology due to an increase in RC delay among interconnects. To address this problem, a new technology - "3 dimensional (3D) IC chip stack" - has been emerging. For the integration of the technology, several new key unit processes (e.g., silicon through via, wafer thinning and wafer alignment and bonding) should be developed and much effort is being made to achieve the goal. As a result of such efforts, 4 and 8 chip-stacked DRAM and NAND structures and a system stacking CPU and memory chips vertically were successfully developed. In this article, basic theory, configurations and key unit processes for the 3D IC chip integration, and a current tendency of the technology are explained. Future opportunities and directions are also discussed.