• 제목/요약/키워드: 3D integration

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건설업에 있어서의 컴퓨터 이용

  • 이병해
    • 한국지반공학회:학술대회논문집
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    • 한국지반공학회 1991년도 추계학술발표회 논문집 지반공학에서의 컴퓨터 활용 COMPUTER UTILIZATION IN GEOTECHNICAL ENGINEERING
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    • pp.3-20
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    • 1991
  • This paper wil1 describe the background and "dynamics" of system integration of construction industry. It wil1 address questions such as, why the construction industry needs to integrate work process through computer based system. Then it describes about 3D modeling, project, management, procurement, engineering data bases, construction CAE. Also the paper presents recent project experience at school environment.

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국가 연구 개발 프로젝트 실시간 자금 관리 시스템 개발에 관한 연구 (Developing a Real-time Cashflow Management System for National R&D Management)

  • 한승엽;이혜정;이정우
    • 한국IT서비스학회지
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    • 제13권3호
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    • pp.343-357
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    • 2014
  • As science and technology infiltrates every aspects of modern society in terms of economic and social growth and development, funding for research and development (R&D) is growing rapidly. Republic of Korea is not an exception in this trend and the R&D funding in Korea has been grown about 10% every year, recently. However, as the scope and size of funding grows exponentially, need for monitoring and managing these R&D projects becoming more and more imminent. Though different types of project management systems were developed by a variety of agencies and departments and used in monitoring and managing, these systems were developed as standalone silo type systems. These systems are not connected to each other while the same researchers may involved in different projects across agencies and department. Also, these management systems are not linked to the banking systems in which real transactions of funding occurs, such as cost reimbursement and financial audit of each R&D accounts. Historically, a few fraud and malappropriation cases were found and indicted. However, as the number of these incidents grows along with the growth of R&D funding, a large scale integration/linking of project management systems and banking systems. Realizing the importance of systems integration among agencies as well as with the banking systems, situational requirements analyses were conducted concerning the current state of R&D management system. As a results, a Real-time Case Management System (RCMS) was proposed as a solution to current problems. In this paper, the collected systems requirements were documents with analyses of the situation, the architecture of the integrated systems with more user-friendly technological alternatives. This large scale linkage requires interface standardization as well as modularization of interfaces. Proposed systems architecture is introduced here with technical details of Jex Framework used,, followed by resulting technical and economic performance of the Realtime Cashflow Management System (RCMS).

건축 MEP 역설계 지침을 위한 라이다 기반 포인트 클라우드 데이터 자료 구조 및 프로세스 기초 연구 (A Basic Study on Data Structure and Process of Point Cloud based on Terrestrial LiDAR for Guideline of Reverse Engineering of Architectural MEP)

  • 김지은;박상철;강태욱
    • 한국산학기술학회논문지
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    • 제16권8호
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    • pp.5695-5706
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    • 2015
  • 최근 국내외 건설 분야에서 건축물 리노베이션 및 유지보수를 위한 BIM 적용이 활발해지는 추세이나, 상당수 기존 건축물이 현 상태를 반영하지 않은 2D 도면을 보유함에 따라 이를 바탕으로 한 BIM 모델 작성이 어려운 상황이다. 따라서 본 연구는 역설계 기술을 활용하고자, 건축 MEP 역설계 지침을 위한 포인트 클라우드 데이터 관련 데이터 구조 및 프로세스를 분석하고, 역설계 지침을 위한 고려사항을 도출하였다. 국내 시장에서 3차원 스캐닝 기술의 활발한 적용을 위해, 프로젝트 수행 초기 단계인 지상 라이다를 이용한 현장에 대한 데이터 취득, 취득 단계에서 얻은 포인트 클라우드 데이터의 기초 처리 및 프로세스 분석에 대해 연구 목적을 두고 있다.

Standard Terminology System Referenced by 3D Human Body Model

  • Choi, Byung-Kwan;Lim, Ji-Hye
    • Journal of information and communication convergence engineering
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    • 제17권2호
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    • pp.91-96
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    • 2019
  • In this study, a system to increase the expressiveness of existing standard terminology using three-dimensional (3D) data is designed. We analyze the existing medical terminology system by searching the reference literature and perform an expert group focus survey. A human body image is generated using a 3D modeling tool. Then, the anatomical position of the human body is mapped to the 3D coordinates' identification (ID) and metadata. We define the term to represent the 3D human body position in a total of 12 categories, including semantic terminology entity and semantic disorder. The Blender and 3ds Max programs are used to create the 3D model from medical imaging data. The generated 3D human body model is expressed by the ID of the coordinate type (x, y, and z axes) based on the anatomical position and mapped to the semantic entity including the meaning. We propose a system of standard terminology enabling integration and utilization of the 3D human body model, coordinates (ID), and metadata. In the future, through cooperation with the Electronic Health Record system, we will contribute to clinical research to generate higher-quality big data.

포물면 반사판 안테나의 복사 특성 해석 (Analysis of the Radiation Characteristics of the Parabola Reflector Antenna)

  • 조태범;류황
    • 공학논문집
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    • 제3권1호
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    • pp.147-158
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    • 1998
  • 이 논문은 포물면 반사판 안테나의 원거리에서 복사특성을 해석하는 것이다. 전원(source)에서 포물면에 복사된 파의 복사특성을 해석하기 위해서 유일정리와 등가이론을 이용하여 포물면에 반사된 전파의 등가전류밀도 및 등가자류밀도를 구하고 이것을 이용해 벡터포텐셜을 유도하여 원형의 개구면적분법을 사용해 원거리 복사 특성식을 유도한다. 이 계산결과를 가지고 포물면 안테나의 복사특성을 주파수 변화에 따른 편파특성, F/D에 의한 복사특성, 급전부에서 초점의 위치와 복사각도 조정에 따른 복사특성을 해석하였다.

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High Performance On-Chip Integrable Inductor for RF Applications

  • Lee, J.Y.;Kim, J.H.;Kim, M.J.;Moon, S.S.;Kim, I.H.;Lee, Y.H.;Yook, Jong-Gwan;Kukjin Chun
    • 반도체디스플레이기술학회지
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    • 제2권1호
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    • pp.11-14
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    • 2003
  • The high Q(quality factor) suspended spiral inductors were fabricated on the silicon substrate by 3D surface micromachined process. The integration of 2.4GHz VCO has been performed by fabricating suspended spiral inductor of the top of CMOS VCO circuit. The phase noise of VCO integrated MEMS inductor is 93.5 dBc/Hz at 100kHz of offset frequency.

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광통신 III-V/Si 레이저 다이오드 기술 동향 (III-V/Si Optical Communication Laser Diode Technology)

  • 김호성;김덕준;김동철;고영호;김갑중;안신모;한원석
    • 전자통신동향분석
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    • 제36권3호
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    • pp.23-33
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    • 2021
  • Two main technologies of III-V/Si laser diode for optical communication, direct epitaxial growth, and wafer bonding were studied. Until now, the wafer bonding has been vigorously studied and seems promising for the ideal III-V/Si laser. However, the wafer bonding process is still complicated and has a limit of mass production. The development of a concise and innovative integration method for silicon photonics is urgent. In the future, the demand for high-speed data processing and energy saving, as well as ultra-high density integration, will increase. Therefore, the study for the hetero-junction, which is that the III-V compound semiconductor is directly grown on Si semiconductor can overcome the current limitations and may be the goal for the ideal III-V/Si laser diode.

BIM 저작도구를 활용한 도로공사 수량산출 자동화 활용성 분석 (Analysis for the Applicability of Automated Quantity Take-off Technique Using BIM Authoring Tools on Road Construction)

  • 문진석;원지선;최원식
    • 한국산학기술학회논문지
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    • 제14권10호
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    • pp.5184-5191
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    • 2013
  • 최근 BIM저작도구를 활용한 자동수량산출에 대한 관심이 많아지고 있으며, 단순한 부피, 개수, 면적 등의 단위계산 뿐만 아니라, BIM 기술을 이용한 물량산출의 정확성과 효율성에 대한 연구가 수행되고 있다. BIM 저작도구를 통한 자동수량산출은 매우 유용한 기능이나, 내역서 항목별 수량산출을 위해서는 모델링의 상세 수준을 높이는 등 많은 시간과 비용이 투입되어야 한다. 이에 본 연구에서는 2D 기반으로 설계된 도로건설공사 도면을 바탕으로 BIM 저작도구 이용하여 토공 및 도로공과 구조물을 3D 모델링 하고 BIM 저작도구에서 제공하는 자동물량산출기능을 통해 활용성을 살펴본다. 그 결과 토공 및 도로공이나 구조물공에 대하여 산출되는 자동수량산출의 항목들은 매우 제한적이나, 철근 모델은 수량산출서 항목의 대부분을 지원함을 알 수 있다.

A 2-D four-noded finite element containing a singularity of order λ

  • Abdel Wahab, M.M.;de Roeck, G.
    • Structural Engineering and Mechanics
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    • 제3권4호
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    • pp.383-390
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    • 1995
  • A 2-D four-noded finite element which contains a ${\lambda}$ singularity is developed. The new element is compatible with quadratic standard isoparametric elements. The element is tested on two different examples. In the first example, an edge crack problem is analyzed using two different meshes and different integration orders. The second example is a crack perpendicular to the interface problem which is solved for different material properties and in turn different singularity order ${\lambda}$. The results of those examples illustrate the efficiency of the proposed element.

TSV (Through Silicon Via)plasma etching technology for 3D IC

  • 정대진;김두영;이내응
    • 한국표면공학회:학술대회논문집
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    • 한국표면공학회 2007년도 추계학술대회 논문집
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    • pp.173-174
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    • 2007
  • Through Silicon Via ( TSV)는 향후3D integration devices (CMOS image sensors) 와 보다 더 직접화되고 진보된 memory stack에 기여 할 것이다. 이는 한층 더 진보된 microprocessors system 을 구축 하리라 본다. 해서 본문은 TSV plasma etching processing 소개와 특히 Bosch process에 대한 개선 방법을 제시하고자 한다.

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