• Journal of the Korean Society for Precision Engineering
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• v.31 no.10
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• pp.865-871
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• 2014

Paradigm shift to 3-D chip stacking in electronic packaging has induced a lot of integration challenges due to the reduction in wafer thickness and pitch size. This study presents a hybrid bonding technology by self-alignment effect in order to improve the flip chip bonding accuracy with ultra-thin wafer. Optimization of Cu pillar bump formation and evaluation of various factors on self-alignment effect was performed. As a result, highly-improved bonding accuracy of thin wafer with a $50{\mu}m$ of thickness was achieved without solder bridging or bump misalignment by applying reflow process after thermo-compression bonding process. Reflow process caused the inherently-misaligned micro-bump to be aligned due to the interface tension between Si die and solder bump. Control of solder bump volume with respect to the chip dimension was the critical factor for self-alignment effect. This study indicated that bump design for 3D packaging could be tuned for the improvement of micro-bonding quality.

• Proceedings of the Korean Institute of Electrical and Electronic Material Engineers Conference
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• 2006.06a
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• pp.154-154
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• 2006

Samsung Electro Mechanics ink jet has developed ultra high resolution alignment system. The alignment system has been developed for repeatable printing of conductive ink. The resolution of alignment system is 0.5um and the velocity of printing working plate is 1.5m/s. So far repeated printing results included sintering process have over 30um of drop mislocation data. In order to improve line thickness and conductivity of metal line, we need to develop the higher mechanical accurate align system. On the demand, this developed align system has under $1{\sim}2{\mu}m$ mispositioning performance and can measure of mechanical accuracy of inkjet printer, as well as the straightness of jetted drop from inkjet head. There is no kinds limit of substrate and ink to use SEM alignment system. By using this alignment system, we progress two experiment of reiterate printing drop and making conductive line on the glass and photo paper. Optical microscope and 3D profiler has been used for measurement of printed ink.

• Journal of the Korean Society for Precision Engineering
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• v.31 no.12
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• pp.1101-1106
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• 2014

Hybrid manufacturing technology has been advanced to overcome limitations due to traditional fabrication methods. To fabricate a micro/nano-scale structure, various manufacturing technologies such as lithography and etching were attempted. Since these manufacturing processes are limited by their materials, temperature and features, it is necessary to develop a new three-dimensional (3D) printing method. A novel nano-scale 3D printing system was developed consisting of the Nano-Particle Deposition System (NPDS) and the Focused Ion Beam (FIB) to overcome these limitations. By repeating deposition and machining processes, it was possible to fabricate micro/nano-scale 3D structures with various metals and ceramics. Since each process works in different chambers, a transfer process is required. In this research, nanoscale 3D printing system was briefly explained and an alignment algorithm for nano-scale 3D printing system was developed. Implementing the algorithm leads to an accepted error margin of 0.5% by compensating error in rotational, horizontal, and vertical axes.

• 한국정보디스플레이학회:학술대회논문집
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• 2008.10a
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• pp.873-878
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• 2008

Doosan Mecatec has developed alignment system for Organic Light-Emitting Diode (OLED) display production using large size substrate. In the present article, The alignment system between the substrate and the mask, which is a core technology for producing the OLED product using the fourth-generation substrate with $730{\times}920mm^2$ or more, will be described by dividing into a substrate loader, a magnet unit, a CCD camera, etc. The substrate loader is optimized through the simulation where the central portion of the substrate droops by about 1.5mm by clamping each of a long side (920mm direction) and a short side (730mm direction) thereof by 6 point and 4 point. A magnet unit using a sheet type of rubber magnet is constituted and a CCD camera model with the specifications capable of minimizing the errors between a clear image and the same image is selected. The system to which an upward evaporation technique of small molecular organic materials will be applied has been developed so that repeatability and position accuracy becomes ${\pm}1{\mu}m$ or less using an UVW type of stage. Also, the vision accuracy of the CCD camera becomes ${\pm}1{\mu}m$ or less and the align process TACT becomes 30sec. or less so that the final alignment accuracy between the substrate and the mask becomes ${\pm}3{\mu}m$ or less. In order to meet an extra-large glass substrate, an evaporation system using an extra-large AMOLED substrate has been developing through a vertical type of an alignment system.

• Korean Journal of Geomatics
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• v.1 no.1
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• pp.15-20
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• 2001

In this study, several basic data for road design and GIS data were used for selecting the optimized road alignment database system. The cut and fill volumes were compared with existing manual road design method through the analysis and data application in this database system. We solved and estimated objective, economic, environmental and technical problems caused in road construction comparing existing manual method with the road alignment which was selected in GIS automatically. Also, we performed three dimensional simulation with the existing road design program and simulation of virtual reality through Virtual GIS. This study showed the method in selecting the optimized road alignment through the analysis and comparison of the selected road alignment. The goal of this study is comparison and analysis of definite cut and fill volume and environmental problem after the road construction through analyzing and comparing the social, economic, technical and environmental aspect in the road alignments with various statistic data.

• Journal of The Korean Society of Integrative Medicine
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• v.7 no.3
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• pp.181-188
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• 2019

Purpose: This study was performed to determine the effects of a gluteus maximus strengthening exercise on both spinal alignment and dynamic balance in subjects with kyphosis. Methods: We measured the kyphosis angle of 150 subjects and selected those whose kyphosis angle was > $50^{\circ}$. The participants included 10 male and 12 female college students. After a gluteus maximus strengthening exercise was applied, the subjects were measured by the formetric 4D and Biorescue systems. The collected data were analyzed by a paired t-test with the SPSS (Ver. 21) program for spinal alignment and dynamic balance comparisons both before and after the gluteus maximus strengthening exercise was completed. Results: The results regarding spinal alignment showed statistically significant decreases in pelvic tilt, kyphotic angle, and lordotic angle after the intervention (p < .05). However, trunk imbalance, pelvic torsion, surface rotation, and lateral deviation were not significantly different after the exercise. The results of the dynamic balance showed statistically significant increases in limits of stability after the exercise (p < .05). Conclusion: The above results suggest that the implemented gluteus maximus strengthening exercise may be effective for spinal alignment and dynamic balance in subjects with kyphosis.

• The Journal of Korea Robotics Society
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• v.6 no.2
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• pp.118-129
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• 2011

In this paper, we suggest a new camera capturing and synthesizing algorithm with the multi-captured left and right images for the better comfortable feeling of 3D depth and also propose 3D image capturing hardware system based on the this new algorithm. We also suggest the simple control algorithm for the calibration of camera capture system with zooming function based on a performance index measure which is used as feedback information for the stabilization of focusing control problem. We also comment on the theoretical mapping theory concerning projection under the assumption that human is sitting 50cm in front of and watching the 3D LCD screen for the captured image based on the modeling of pinhole Camera. We choose 9 segmentations and propose the method to find optimal alignment and focusing based on the measure of alignment and sharpness and propose the synthesizing fusion with the optimized 9 segmentation images for the best 3D depth feeling.

• Research in Mathematical Education
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• v.23 no.3
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• pp.149-164
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• 2020

This study aimed to establish an observation protocol for mathematical modeling as an alternative way to examine instructional alignment to the Common Core State Standards for Mathematics. The instructional alignment observation protocol (IAOP) for mathematical modeling was established through careful reviews on the fidelity of implementation (FOI) framework and prior studies on mathematical modeling. I shared the initial version of the IAOP including 15 items across the structural and instructional critical components as the FOI framework suggested. Thus, the IAOP covers what teachers should do and know for practices of mathematical modeling in classrooms and what teachers and students are expected to do. Based on the findings in this study, validity and reliability of the IAOP should be evaluated in follow-up studies.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.23 no.2
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• pp.118-126
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• 2014

In this paper, a new method is proposed for the five-degree-of-freedom precision alignment and stitching of three-dimensional surface-profile data sets. The control parameters for correcting thealignment error are calculated from the surface profile data for overlapped areas among the adjacent measuring areas by using the "least squares method" and "maximum lag position of cross correlation function." To ensure the alignment and stitching reliability, the relationships betweenthe alignment uncertainty, overlapped area, and signal-to-noise level of the measured profile data are investigated. Based on the results of this uncertainty analysis, an appropriate size is proposed for the overlapped area according to the specimen's surface texture and noise level.

• KIPS Transactions on Software and Data Engineering
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• v.12 no.5
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• pp.229-236
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• 2023

Since 3D printed medical implant parts usually have surface defects, it is necessary to inspect the surface after manufacturing. In order to automate the surface inspection, it is effective to 3D scan the implant and reconstruct it as a scan model such as a point cloud. When constructing a scan model, the characteristics of the shape and material of the implant must be considered because it has characteristics different from those of general 3D printed parts. In this paper, we present a method to reconstruct the 3D scan model of a 3D printed metal bone-plate that is one kind of medical implant parts. Multiple partial scan data are produced by multi-view 3D scan, and then, we reconstruct a scan model by alignment and merging of partial data. We also present the process of the scan model reconstruction through experiments.