• 한국재료학회지
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• 제22권9호
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• pp.482-488
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• 2012

To fabricate a precise micro metal mold, the electrochemical etching process has been researched. We investigated the electrochemical etching process numerically and experimentally to determine the etching tendency of the process, focusing on the current density, which is a major parameter of the process. The finite element method, a kind of numerical analysis, was used to determine the current density distribution on the workpiece. Stainless steel(SS304) substrate with various sized square and circular array patterns as an anode and copper(Cu) plate as a cathode were used for the electrochemical experiments. A mixture of $H_2SO_4$, $H_3PO_4$, and DIW was used as an electrolyte. In this paper, comparison of the results from the experiment and the numerical simulation is presented, including the current density distribution and line profile from the simulation, and the etching profile and surface morphology from the experiment. Etching profile and surface morphology were characterized using a 3D-profiler and FE-SEM measurement. From a comparison of the data, it was confirmed that the current density distribution and the line profile of the simulation were similar to the surface morphology and the etching profile of the experiment, respectively. The current density is more concentrated at the vertex of the square pattern and circumference of the circular pattern. And, the depth of the etched area is proportional to the current density.

• 한국광학회지
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• 제21권2호
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• pp.61-68
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• 2010

최근 LED TV로 각광받고 있는 대형 LCD TV용 LED(Light Emitting Diode, 고체발광다이오드) 백라이트에 사용되는 도광판의 광구조를 최적화하여 LED에 의해 발생하는 휘점을 제거하고 조도균일도를 향상시키기 위한 시뮬레이션 연구를 진행하였다. 시뮬레이션 모델로 설정된 엣지형 백라이트는 LCD TV용으로 사용될 수 있는 두께 3 mm의 도광판, 측면에 배치된 세 개의 백색 LED와 램프 커버, 도광판의 하면에 배치된 반사 필름으로 구성되어 있다. 일반적인 엣지형 백라이트용 도광판과 같이 도광판의 입광면에 패턴이 형성되어 있지 않은 경우에는 도광판 상면의 조도균일도가 입광면과 LED 사이의 거리에 민감하게 의존하였다. 입광면과 LED 사이의 거리가 커질수록 조도균일도는 개선되다가 일정 거리 이상이 되면 개선이 둔화되는 경향성을 보였다. 반면에 도광판의 입광면에 렌티큘라(lenticular) 렌즈 배열이나 톱니모양(Serration)과 같은 미세 굴절 패턴을 형성하는 경우 LED가 입광면에 거의 붙어 있는 경우에도 패턴이 없는 경우에 비해 우수한 조도균일도를 보인다는 것을 알 수 있었고 조도균일도가 LED와 입광면 사이의 거리에 의존하는 정도가 줄어든다는 점도 확인하였다. 동일조건에서는 톱니모양 패턴이 렌티큘라 렌즈에 비해 우수한 조도균일도를 나타내었고 굴절률의 변화를 통해 추가적인 균일도 개선 효과를 얻을 수 있음도 확인하였다. 따라서 도광판의 입광면에 굴절 기능을 가지는 미세 패턴을 형성하고 그 광구조를 최적화하는 것은 LED에 의한 휘점 형성을 억제하고 LCD 측면의 비발광영역(베젤)을 줄이는데 있어서 매우 효과적인 방법이 될 수 있다는 것을 확인하였다.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2763-2768
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• 2007

Recently, as the semiconductor production technology develops, there has been growing interest in the cooling system using micro fluid pump. Among the various types of micro fluid pump, the valve-less diffuser/nozzle has been extensively studied in recent years. However, the flat-walled diffuser/nozzle flow has not been clearly looked into due to its non-linear characteristics. In this paper, the flow characteristics of the flat-walled diffuser/nozzle have been analyzed using similitude model and simulations. Similitude models are designed so that the flow pattern is same as that of 1/10 scale flow by using high viscous fluid as working fluid. The results are compared to the simulations. It is shown that the flow characteristics of 2D simulation are different from 3D simulations at high Re region, and the measured pump efficiency is highly dependent on the pressure difference as well as the channel geometry. From these results, the desirable conditions for the efficient pump is discussed.

• 한국정밀공학회:학술대회논문집
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• 한국정밀공학회 2003년도 춘계학술대회 논문집
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• pp.612-615
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• 2003

Maskless laser patterning process is developed using 3rd harmonic Diode Pumped Solid State Laser with near visible wavelength of 355 nm. Photo-sensitive curable polymer is irradiated by UV laser and developed using polymer solvent to obtain quasi-3D patterns. We performed basic experiments for the various process conditions such as laser power, writing speed, laser focus, and polymer optical property to gain the optimal conditions. Experimentally, the patterns of trapezoidal shape were manufactured into dimension of 8${\mu}{\textrm}{m}$ width and 5.4${\mu}{\textrm}{m}$ height. This process could be applied to fabricate a single mode waveguide without expensive mask projection method.

• 한국전산구조공학회논문집
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• 제33권5호
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• pp.331-338
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• 2020

본 논문에서는 열린 셀 구조의 3차원 마이크로 엮임 재료에 대해서 다양한 전산 시뮬레이션을 수행하고 재료의 특성을 수치적으로 분석하였다. 엮임 재료에 대한 수치 해석의 정확도를 높이기 위해서 각 축 방향별 와이어 사이의 간격을 6개의 변수로 매개화 하였으며, 기존의 정육면체 대신에 사면체의 요소로 바꾸어 엮임 재료의 기하학적 형상을 더 사실적으로 구현하였다. 개선된 수치모델에 대해서 상용 프로그램을 이용해 기계적, 열역학적, 유체역학적 해석을 수행하였으며, 그 정확도를 검증하기 위해서 기존의 실험 결과와 비교하였다. 또한 x 및 y 방향으로 와이어 간격을 변화시켜 가며, 3차원 엮임 재료의 여러 물성치에 대한 파라메트릭 테스트를 수행하였으며, 물성치의 변화 경향 및 민감도를 살펴보았다. 이를 통해서 3차원 엮임 재료의 물성치 사이의 상관관계를 애슈비 차트와 함께 살펴보았으며, 기존의 벌크 형태의 금속 재료와는 다른 재료 특성들로 인해 그 활용도가 높을 것으로 기대한다.

• 한국정밀공학회지
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• 제17권1호
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• pp.129-137
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• 2000

In this paper, a new method of noncontact measurement has been developed for a 3 dimensional topography in semiconductor wafer, implementing a new optical probe based on the precision defocus measurement. The developed technique consists of the new optical probe, precision stages, and the measurement/control system. The basic principle of the technique is to use the reflected slit beam from the specimen surface, and to measure the deviation of the specimen surface. The defocusing distance can be measured by the reflected slit beam, where the defocused image is measured by the proposed optical probe, giving very high resolution. The distance measuring formula has been proposed for the developed probe, using the laws of geometric optics. The precision calibration technique has been applied, giving about 10 nanometer resolution and 72 nanometer of four sigma uncertainty. In order to quantitize the micro pattern in the specimen surface, some efficient analysis algorithms have been developed to analyse the 3D topography pattern and some parameters of the surface. The developed system has been successfully applied to measure the wafer surface, demonstrating the line scanning feature and excellent 3 dimensional measurement capability.

• 한국공작기계학회논문집
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• 제15권6호
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• pp.58-63
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• 2006

FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\Phi}10nm$ and smaller is available. Since general FIB uses very short wavelength and extremely high energy, it can directly make a micro structure less than $1{\mu}m$. As a result, FIB has been probability in manufacturing high performance micro devices and high precision micro structures. Until now, FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, IC error correction, etc. In this paper FIB-Sputtering and FIB-CVD characteristic analysis were carried out according to $Ga^+$ ion beam current that is very important parameter for minimizing the pattern size and maximizing the yield. Also, for FIB-Sputtering burr caused by redeposition of the substrate characteristic analysis was carried out.

• 한국결정성장학회지
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• 제16권6호
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• pp.235-239
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• 2006

Micro-pulling down$({\mu}-PD)$법을 이용하여 직경 $0.8{\sim}1.0mm$, 길이 $30{\sim}35mm$의 ZnO가 첨가된 near-stoichiometric $LiNbO_3$, 단결정을 성장하였다. 성장된 결정의 결정구조를 powder x-tay diffraction(XRD) patterns으로 확인하였고, electron probe micro analysis(EPMA)를 이용하여 결정내 Zn 이온들이 균일하게 분포되었음을 확인하였다. 또한 2 mol% 이상의 ZnO 첨가시 $OH^-$ 흡수밴드의 특성이 크게 변화함을 관찰함으로써 ZnO 첨가량에 일치한 역치(threshold)가 존재함을 확인하였다.

• 마이크로전자및패키징학회지
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• 제23권4호
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• 대한기계학회:학술대회논문집
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• 대한기계학회 2007년도 춘계학술대회B
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• pp.2811-2816
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• 2007

We conducted a numerical study of AC-electroosmotic (alternating current) effect on the fluid flow and mixing in a 3-D microchannel. The microchannel used as an efficient micro-mixer is composed of a channel and a series of pairs of electrodes attached in zigzag pattern on the bottom wall. The AC electric field is applied to the electrodes so that a steady flow current takes place around the electrodes. This current is flowing across the channel and thus contributing to the mixing of the fluid within the channel. We performed numerical simulations by using a commercial code to obtain a steady flow field. This steady flow is then used in evaluation of the mixing performance via the concept of mixing index. It was found that good combination of two kinds of electrode, which gave us a good mixing, is not simple harmonic. And when the length ratio of these two kinds of electrode is 2:1, we can get the best mixing effect.