• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.62-65
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• 2003

VLM-ST process requires an additional human interaction due to the manual stacking and bonding. Hence, building time, building cost and the part quality are dependent on the skill of labor. In this present work, a novel rapid prototyping (RP) process, as an automatic VLM-ST (VLM-STA), has been proposed to improve building efficiency of VLM-ST process and reliability of products. The apparatus of VLM-STA is designed to embody the process. Several characteristics of the proposed process and the apparatus are discussed. In order to examine the efficiency and the applicability of the proposed process, various three-dimensional shapes, such as a piston and a human head shape, are fabricated on the apparatus.

• Proceedings of the KSME Conference
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• 2002.08a
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• pp.233-236
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• 2002

The high-pressurized spray nozzle is used f3r special washing and cutting with strong impact force. The performance of this nozzle, which focused on spray penetration and radial dispersion, was mainly investigated to maximize the momentum and minimize the flow loss. Hence, our experimental research was conducted by changing the aspect ratio ranging from 0 to 3 with nozzle outlet of 1.1. The spray trajectory far high-pressurized water was experimentally investigated using PDPA diagnostics, which was available at spray downstream region. As the spray at upstream near the nozzle exit did not show the improved disintegration. The results showed empirical correlation with regard to non-dimensional axial velocity distribution, spray penetration, and radial spreading rate with photographic visualization.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.674-677
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• 2003

This work presents a method of point-to-surface assignment for 3D inspection of solder pastes on PCB. A bounding box enclosing the solder paste tightly on all sides is introduced to avoid incorrect point-to-surface assignment. The shape of bounding box for solder paste brick is variable according to geometry of measured points. The surface geometry of the bounding box is obtained by using five peaks selected from the histogram of normalized gradient vectors for measured points. By using the bounding box enclosing the solder paste. the task of point-to-surface assignment is successfully executed. Subsequently, the geometrical features are obtained via surface fitting.

• Journal of the Korean Society for Railway
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• v.8 no.3
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• pp.253-259
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• 2005

This paper describes 3D Dimensional Measurement(EDM testing) and tensile testing results of carbody structure for crashed EMU(Electric Multiple Units). Tensile tests were performed on two different types of specimens in order to evaluate the strength changes before and after damages, obtained from plastic deformed area and nondeformed region of the crashed EMU. And Structural analysis of EMU was performed for the criteria of safety assessment. Structural analysis using commercial I-DEAS software provided important information on the stress distribution and load transfer mechanisms as well as the amount of damages during rolling stock crash. The testing results have been used to provide the critical information for the criteria of safety diagnosis.

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 1998.03a
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• pp.130-133
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• 1998

An integrated finite element computer simulator is presented for the prediction of three dimensional heat transfer and metal flow occurring in the strip, and heat transfer and thermo elastic phenomena occurring in the rolls in 4 high mill hot strip rolling. Basic finite element models are described, with emphasis on combining each model to deal rigorously with the coupled aspect of the thermo-mechanical behaviors of the rols and strip through an iterative solution procedure. A series of process simulation are carried out to investigate the effect of various parameters under the actual process conditions. The results are shown and discussed.

• JSTS:Journal of Semiconductor Technology and Science
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• v.4 no.1
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• pp.12-17
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• 2004

The body-tied FinFETs (bulk FinFETs) implemented on bulk Si substrate were characterized through 3-dimensional device simulation. By controlling the doping profile along the vertical fin body, the bulk FinFETs can be scaled down to sub-30 nm. Device characteristics with the body shape were also shown. At a contact resistivity of $1{\times}10^{-7}\;{\Omega}\;cm^2$, the device with side metal contact of fin source/drain showed higher drain current by about two. The C-V results were also shown for the first time.

• Proceedings of the KIEE Conference
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• 1996.07c
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• pp.1536-1540
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• 1996

The Design of are quenching parts of molded case circuit breakers depends on the utilization of strength and distribution of the magnetic field by which the arc is forced. The magnetic field causes the are to move into a set of V-slotted iron grids, where the are is extinguished rapidly. This paper present the effective method 10 design V-slotted iron plates of the are breaking chamber of molded case circuit breakers. This magnetic force was calculated by using the flux densities in the arc which are obtained by three dimensional finite element method, as a result of that this paper verified by testing that a grid model which has biggest magnetic force is excellent in the are quenching ability.

• Proceedings of the KIEE Conference
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• 2008.07a
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• pp.860-861
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• 2008

This paper deals with the magnet arrangement for vibration reduction and improvement in Starting Characteristic of Permanent Magnet Linear Synchronous Motor (PMLSM). Thrust, detent force, normal force and lateral force are generated in PMLSM. The detent force and lateral force cause the vibration of PMLSM. The detent force and the lateral force are analyzed by using 3-Dimensional Finite Element Method (3-D FEM). The efficiency and vibration of PMLSM are measured by experiment.

• The Journal of Korean Academic Society of Nursing Education
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• v.3
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• pp.7-25
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• 1997

Using the self-evaluation test proposed by D. Girdano, et al., the psycological, and biological causes and personality factors of the stress of the nursing students of K university in local county are measured and analyzed. As fundamental data to overcome these kinds of stress, the overall stress profiles are proposed. The results of this study are ; 1) The freshman group is very susceptible to the stress due to the behavior type and anxiety-reactive personality. 2) The sophomore group is very susceptible to the stress due to frustration, the behavior type and anxiety-reactive personality. 3) Two groups are not susceptible to the stress due to diet and noise. Since the stress is the multi-dimensional phenomena, it is necessary to reduce these stress that the life style of each Individual students be changed and the curriculm and the teaching methodology in nursing school be developed.

• The Transactions of The Korean Institute of Electrical Engineers
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• v.63 no.12
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• pp.1710-1715
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• 2014

In this paper, we propose a novel on-chip test logic for TSV fault detection in 3-dimensional integrated circuits. The proposed logic called OTT realizes the input signal delay-based TSV test method introduced earlier. OTT only includes one F/F, two MUXs, and some additional logic for signal delay. Thus, it requires small silicon area suitable for TSV testing. Both pre-bond and post-bond TSV tests are able to use OTT for short or open fault as well as small delay fault detection.