• 제목/요약/키워드: 3-Tier

검색결과 347건 처리시간 0.025초

'신고'배 재배지 내 수체 및 토양의 탄소 및 질소 저장량 (Carbon and Nitrogen Stocks of Trees and Soils in a 'Niitaka' Pear Orchard)

  • 이태규;최장전;김종성;이한찬;노희명
    • 원예과학기술지
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    • 제31권6호
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    • pp.828-832
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    • 2013
  • IPCC 2006 guideline에서 제시한 Tier 3 수준에 맞게 배나무 과수원의 온실가스 저장량을 산정하기 위하여, 전라남도 나주에 위치한 농촌진흥청 배시험장 재배포장($35^{\circ}01^{\prime}27.70N$, $126^{\circ}44^{\prime}53.50^{\prime\prime}E$, 표고 6m)에 $5.0{\times}3.0m$ 간격으로 재식된 Y자 수형의 15년생 배 '신고(Pyrus pyrifolia Nakai cv. Niitaka)' 재배지를 대상으로 과수와 재배지 토양의 총 탄소 및 질소 저장량을 측정하였다. 이를 위해 2012년 8월, 3반복으로 과수를 굴취하여 주간, 주지, 측지, 잎, 과일, 뿌리로 분류하였고, 과수 주간으로부터 약 0.5m 떨어진 지점에서 0.6m 깊이까지 0.1m 간격으로 토양을 채취하였다. 나무 한그루당 건물중은 주간이 4.7kg, 주지가 13.3kg, 측지가 13.9kg, 잎이 3.7kg, 과일이 6.7kg, 뿌리가 14.1kg이었다. 단위 질량당 총 탄소 및 질소의 함량은 주간에서 각 2.3kg과 0.02kg, 주지에서 6.4kg과 0.07kg, 측지에서 6.4kg과 0.09kg, 뿌리에서 6.5kg과 0.07kg, 잎에서 1.7kg과 0.07kg, 과일에서 3.2kg과 0.03kg 이었다. 재식밀도(667trees/ha)를 기준으로, 탄소와 질소는 재배지 토양에 각각 138.29 및 $13.31Mg{\cdot}ha^{-1}$가 저장되어 있었고, 과수에 각각 17.66 및 $0.23Mg{\cdot}ha^{-1}$씩 보유되어 있었다. 이를 종합한 결과 과수 재배지에서 탄소는 $155.95Mg{\cdot}ha^{-1}$, 질소는 $13.54Mg{\cdot}ha^{-1}$가 저장되어 있었다.

China's Consumer Market: Growth, Changes, and Korea's Opportunities

  • LEE, JINKOOK
    • KDI Journal of Economic Policy
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    • 제39권3호
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    • pp.19-41
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    • 2017
  • This paper examines the aspects of changes in China's consumer market since the mid-1980s. By comparing urban and rural residents' expenditures, I find that the rural consumer market has exhibited extraordinary growth. Over the past decade, the consumption growth rate and average propensity to consume by rural residents have surpassed those of their urban counterparts, with the former's consumption patterns becoming increasingly similar to the latter's. Such a phenomenon prevails in rural areas which neighbor second-and third-tier cities where urbanization is progressing rapidly. These findings imply that Korean companies need to diversify their export goods in line with China's expanding rural markets while further differentiating their product composition to satisfy the heterogeneous demands in urban areas. With regard to the government, efforts must be made to strengthen the export cooperative system so that it targets not only urban but also rural markets in China.

한국산 홍조 몽우리두층게발에 관한 분류학적 연구 (Taxonomic Study of Amphiroa rigida Lamouroux (Rhodophyta) in Korea)

  • 최도성
    • ALGAE
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    • 제22권3호
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    • pp.159-165
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    • 2007
  • Morphological and anatomical characters of Amphiroa rigida Lamouroux were investigated with field materials and taxonomic accounts are given to the species. The species grows in the subtidal zone of Cheju island, and is characterized by semiendophytic habit in Hydrolithon onkodes. The species is well defined by about 1 cm height, loosely tufted thallus with irregular branches, two-tiered geniculum with equal length, geniculum tier connecting by oblique end walls, and conceptacles buried in cortices of intergeniculum. Korean isolates have etrasporangial, male and female conceptacles. The structure and developmental patterns of conceptacles are very similar to those shown in previous studies.

웹기반의 3 계층 구조 분산 객체 모니터링 시스템 설계에 관한 연구 (A Study on the Design of the 3-tier Distributed Object Monitoring System on the Web)

  • 이인수;고상주;박윤용;정부금;임동선
    • 한국정보처리학회:학술대회논문집
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    • 한국정보처리학회 2000년도 추계학술발표논문집 (상)
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    • pp.613-616
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    • 2000
  • 본 논문에서, 웹브라우져상에서 병행 객체들의 상태 정보 및 정보흐름을 보여주는 분산 병행 객체 모니터링 시스템의 설계에 관하여 기술하였다. 병행 객체는 UNIX의 쓰레드와 같이 CPU에 의해서 스케줄링 되어진다. 또한 모니터링 시스템을 설계해서, 분산환경에서의 병행 객체의 정적 및 동적정보를 수집하여, 웹브라우져상에 이 정보를 표시하고자 한다. 그리고, 설치한 모니터링 시스템을 동적 라이브러리로 구현하고, 기존의 UNIX 또는 SROS상에서 실행되도록 구현할 것이다.

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농촌마을 수준에서의 어메니티 강화 및 저해요소 항목체계 구축 (A Classification System of Amenity / Disamenity Elements in Rural Villages)

  • 임창수;최수명;김영주
    • 농촌계획
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    • 제12권4호
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    • pp.89-97
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    • 2006
  • Usually, amenity elements coexist with disamenity elements in rural villages. Through the literature reviews and group discussion of participant research staffs in this study, a tentative classification system of amenity and disamenity elements was pro-posed with 4-tier hierachial order; for amenity, 3-7-29-76(numbers of the high, medium to low categories and elements) and 3-6-16-32 for disamenity. finally, through case studies of 4 sample villages representing the flat-plan, upland, seashore and periurban rural areas, the applicability of this classification system was verified.

Development of a Limit Order Book Analysis Tool for Automated Stock Trading Systems

  • Gyu-Sang Cho
    • International Journal of Internet, Broadcasting and Communication
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    • 제16권3호
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    • pp.363-369
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    • 2024
  • In this paper, we develope a LOB(Limit Order Book) analyzing tool for an automated trading system, which features real-time and offline analysis of LOB data in conjunction with execution data. The 10-tier LOB data analyzer developed in this paper, which contains ask/bid prices and the execution data, receivs transaction requests in real-time from the Kiwoom Open API+ server. In the OnReceiveTrData event, the transaction data from the server is received and processed. The real-time data, triggered by the transaction, is received and processed in the OnReceiveRealData event. These two types of data are stored in a database and replayed in the same way as if it were a real-time situation in simulation mode. The LOB data are selectively read and analyzed in a necessary time points. The tool provides various features such as bar chart analysis and pattern analysis of the total shares on the bid side and ask side, which are used to develop a tool to accurately determine the timing of stock trading.

Investigation into Electrical Characteristics of Logic Circuit Consisting of Modularized Monolithic 3D Inverter Unit Cell

  • Lee, Geun Jae;Ahn, Tae Jun;Lim, Sung Kyu;Yu, Yun Seop
    • Journal of information and communication convergence engineering
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    • 제20권2호
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    • pp.137-142
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    • 2022
  • Monolithic three-dimensional (M3D) logics such as M3D-NAND, M3D-NOR, M3D-buffer, M3D 2×1 multiplexer, and M3D D flip-flop, consisting of modularized M3D inverters (M3D-INVs), have been proposed. In the previous M3D logic, each M3D logic had to be designed separately for a standard cell library. The proposed M3D logic is designed by placing modularized M3D-INVs and connecting interconnects such as metal lines or monolithic inter-tier-vias between M3D-INVs. The electrical characteristics of the previous and proposed M3D logics were simulated using the technology computer-aided design and Simulation Program with Integrated Circuit Emphasis with the extracted parameters of the previously developed LETI-UTSOI MOSFET model for n- and p-type MOSFETs and the extracted external capacitances. The area, propagation delay, falling/rising times, and dynamic power consumption of the proposed M3D logic are lower than those of previous versions. Despite the larger space and lower performance of the proposed M3D logic in comparison to the previous versions, it can be easily designed with a single modularized M3D-INV and without having to design all layouts of the logic gates separately.

EJB 컴포넌트 기반 WAP 응용 생성기 (A EJB Component-based WAP Application Generator)

  • 음두헌;강이지
    • 인터넷정보학회논문지
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    • 제6권4호
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    • pp.125-139
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    • 2005
  • 무선 인터넷 사용자의 급증과 함께 모바일 전자상거래가 활성화 되고 있다. 이러한 모바일 전자상거래에 대한 수요를 만족시키기 위해 모바일 전자상거래를 지원하는 모바일 응용의 생산성 향상이 요구된다. 본 논문에서 소개하는 WAPSiteGen은 데이터베이스부터 구축해야 하거나 기존 데이터베이스를 사용하는 모바일 응용의 생산성 향상을 위해 3-계충 구조를 갖는 WAP 응용을 자동 생성한다. WAPSiteGen은 3-계층 중, 비즈니스 로직 층을 담당하는 EJB 컴포넌트들과 함께 질의 처리 및 푸쉬 서비스 기능을 제공하는 JSP 웹 컴포넌트들을 자동 생성하고 프리젠테이션 층으로는 처리된 결과를 보여주는 관리자용 HTML 폼과 고객용 WML 데크들과 이 데크를 구성하는 카드들을 자동 생성한다. 또한, WAPSiteGen은 EJB와 JSP 등의 컴포넌트 기술을 도입함으로써 3-계층 구조를 갖는 WAP응용의 확장성, 재사용성, 이식성 등도 향상시킬 뿐 아니라 고객이 원하는 시점과 장소에 정보를 제공할 수 있는 WAP 푸쉬 서비스를 갖는 응용을 생성한다. WAPSiteGen은 비슷한 기능을 지원하는 상용도구들과 달리 생성하는 응용이 질의의 대상인 개체와 함께 이 개체와 연관된 모든 개체들의 집합을 한 단위로 검색 할 수 있어 연관된 정보들을 신속하게 제공한다. 본 논문에서는 WAPSiteGen의 기능 및 구현 원리를 설명하고 상용화된 모바일 응용 생성기들과의 기능을 비교하여 WAPSiteGen의 장점을 설명한다.

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Device Coupling Effects of Monolithic 3D Inverters

  • Yu, Yun Seop;Lim, Sung Kyu
    • Journal of information and communication convergence engineering
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    • 제14권1호
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    • pp.40-44
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    • 2016
  • The device coupling between the stacked top/bottom field-effect transistors (FETs) in two types of monolithic 3D inverter (M3INV) with/without a metal layer in the bottom tier is investigated, and then the regime of the thickness TILD and dielectric constant εr of the inter-layer distance (ILD), the doping concentration Nd (Na), and length Lg of the channel, and the side-wall length LSW where the stacked FETs are coupled are studied. When Nd (Na) < 1016 cm-3 and LSW < 20 nm, the threshold voltage shift of the top FET varies almost constantly by the gate voltage of the bottom FET, but when Nd (Na) > 1016 cm-3 or LSW > 20 nm, the shift decreases and increases, respectively. M3INVs with TILD ≥ 50 nm and εr ≤ 3.9 can neglect the interaction between the stacked FETs, but when TILD or εr do not meet the above conditions, the interaction must be taken into consideration.

Design Challenges and Solutions for Ultra-High-Density Monolithic 3D ICs

  • Panth, Shreepad;Samal, Sandeep;Yu, Yun Seop;Lim, Sung Kyu
    • Journal of information and communication convergence engineering
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    • 제12권3호
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    • pp.186-192
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    • 2014
  • Monolithic three-dimensional integrated chips (3D ICs) are an emerging technology that offers an integration density that is some orders of magnitude higher than the conventional through-silicon-via (TSV)-based 3D ICs. This is due to a sequential integration process that enables extremely small monolithic inter-tier vias (MIVs). For a monolithic 3D memory, we first explore the static random-access memory (SRAM) design. Next, for digital logic, we explore several design styles. The first is transistor-level, which is a design style unique to monolithic 3D ICs that are enabled by the ultra-high-density of MIVs. We also explore gate-level and block-level design styles, which are available for TSV-based 3D ICs. For each of these design styles, we present techniques to obtain the graphic database system (GDS) layouts, and perform a signoff-quality performance and power analysis. We also discuss various challenges facing monolithic 3D ICs, such as achieving 50% footprint reduction over two-dimensional (2D) ICs, routing congestion, power delivery network design, and thermal issues. Finally, we present design techniques to overcome these challenges.