• Proceedings of the Korean Geotechical Society Conference
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• 1991.10a
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• pp.3-20
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• 1991

This paper wil1 describe the background and "dynamics" of system integration of construction industry. It wil1 address questions such as, why the construction industry needs to integrate work process through computer based system. Then it describes about 3D modeling, project, management, procurement, engineering data bases, construction CAE. Also the paper presents recent project experience at school environment.

• Journal of Information Technology Services
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• v.13 no.3
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• pp.343-357
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• 2014

As science and technology infiltrates every aspects of modern society in terms of economic and social growth and development, funding for research and development (R&D) is growing rapidly. Republic of Korea is not an exception in this trend and the R&D funding in Korea has been grown about 10% every year, recently. However, as the scope and size of funding grows exponentially, need for monitoring and managing these R&D projects becoming more and more imminent. Though different types of project management systems were developed by a variety of agencies and departments and used in monitoring and managing, these systems were developed as standalone silo type systems. These systems are not connected to each other while the same researchers may involved in different projects across agencies and department. Also, these management systems are not linked to the banking systems in which real transactions of funding occurs, such as cost reimbursement and financial audit of each R&D accounts. Historically, a few fraud and malappropriation cases were found and indicted. However, as the number of these incidents grows along with the growth of R&D funding, a large scale integration/linking of project management systems and banking systems. Realizing the importance of systems integration among agencies as well as with the banking systems, situational requirements analyses were conducted concerning the current state of R&D management system. As a results, a Real-time Case Management System (RCMS) was proposed as a solution to current problems. In this paper, the collected systems requirements were documents with analyses of the situation, the architecture of the integrated systems with more user-friendly technological alternatives. This large scale linkage requires interface standardization as well as modularization of interfaces. Proposed systems architecture is introduced here with technical details of Jex Framework used,, followed by resulting technical and economic performance of the Realtime Cashflow Management System (RCMS).

• Journal of the Korea Academia-Industrial cooperation Society
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• v.16 no.8
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• pp.5695-5706
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• 2015

Recently adoption of BIM technology for building renovation and remodeling has been increased in construction industry. However most buildings have trouble in 2D drawing-based BIM modeling, because 2D drawings have not been updated real situations continually. Applying reverse engineering, this study analysed the point cloud data structure and the process for guideline of reverse engineering of architectural MEP, and deducted the relating considerations. To active usage of 3D scanning technique in domestic, the objective of this study is to analyze the point cloud data processing from real site with terrestrial LiDAR and the process from data gathering to data acquisition.

• Journal of information and communication convergence engineering
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• v.17 no.2
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• pp.91-96
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• 2019

In this study, a system to increase the expressiveness of existing standard terminology using three-dimensional (3D) data is designed. We analyze the existing medical terminology system by searching the reference literature and perform an expert group focus survey. A human body image is generated using a 3D modeling tool. Then, the anatomical position of the human body is mapped to the 3D coordinates' identification (ID) and metadata. We define the term to represent the 3D human body position in a total of 12 categories, including semantic terminology entity and semantic disorder. The Blender and 3ds Max programs are used to create the 3D model from medical imaging data. The generated 3D human body model is expressed by the ID of the coordinate type (x, y, and z axes) based on the anatomical position and mapped to the semantic entity including the meaning. We propose a system of standard terminology enabling integration and utilization of the 3D human body model, coordinates (ID), and metadata. In the future, through cooperation with the Electronic Health Record system, we will contribute to clinical research to generate higher-quality big data.

• The Journal of Engineering Research
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• v.3 no.1
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• pp.147-158
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• 1998

The purpose of thesis is to analyze the radiation characteristics of the parabola reflector antenna. The equivalent sources are used to compute the radiation fields in the far-zone utilizing the aperture integration. Using these results, we obtain the efficiency parameters associated with reflector : aperture efficiency, spillover efficiency, as the function of F/D, diameter beam squint angle and misarrangement.

• Journal of the Semiconductor & Display Technology
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• v.2 no.1
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• pp.11-14
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• 2003

The high Q(quality factor) suspended spiral inductors were fabricated on the silicon substrate by 3D surface micromachined process. The integration of 2.4GHz VCO has been performed by fabricating suspended spiral inductor of the top of CMOS VCO circuit. The phase noise of VCO integrated MEMS inductor is 93.5 dBc/Hz at 100kHz of offset frequency.

• Electronics and Telecommunications Trends
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• v.36 no.3
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• pp.23-33
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• 2021

Two main technologies of III-V/Si laser diode for optical communication, direct epitaxial growth, and wafer bonding were studied. Until now, the wafer bonding has been vigorously studied and seems promising for the ideal III-V/Si laser. However, the wafer bonding process is still complicated and has a limit of mass production. The development of a concise and innovative integration method for silicon photonics is urgent. In the future, the demand for high-speed data processing and energy saving, as well as ultra-high density integration, will increase. Therefore, the study for the hetero-junction, which is that the III-V compound semiconductor is directly grown on Si semiconductor can overcome the current limitations and may be the goal for the ideal III-V/Si laser diode.

• Journal of the Korea Academia-Industrial cooperation Society
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• v.14 no.10
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• pp.5184-5191
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• 2013

The automated quantity take off technique using BIM authoring tools has been recently issued, and the studies of this method for the accuracy, efficiency, and the unit computing for the simple volume, area and number have been developed. Meanwhile the main concerns such as the details for the level of modelling, and the costs and time for the calculating BOQ item are still required to study. In this paper, the earth works, drainage works, pavement works, and facility works using BIM authoring tools are designed in 3D, and the applicability of automated quantity take off technique using BIM authoring tools is discussed, respectively. As a result, automated quantity take off are limited in the earth works, drainage works, pavement works, and facility works. But Most items of BOQ can be supported in Re-bar model.

• Structural Engineering and Mechanics
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• v.3 no.4
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• pp.383-390
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• 1995

A 2-D four-noded finite element which contains a ${\lambda}$ singularity is developed. The new element is compatible with quadratic standard isoparametric elements. The element is tested on two different examples. In the first example, an edge crack problem is analyzed using two different meshes and different integration orders. The second example is a crack perpendicular to the interface problem which is solved for different material properties and in turn different singularity order ${\lambda}$. The results of those examples illustrate the efficiency of the proposed element.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2007.11a
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• pp.173-174
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• 2007

Through Silicon Via ( TSV)는 향후3D integration devices (CMOS image sensors) 와 보다 더 직접화되고 진보된 memory stack에 기여 할 것이다. 이는 한층 더 진보된 microprocessors system 을 구축 하리라 본다. 해서 본문은 TSV plasma etching processing 소개와 특히 Bosch process에 대한 개선 방법을 제시하고자 한다.