• International Journal of Naval Architecture and Ocean Engineering
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• v.6 no.2
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• pp.245-256
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• 2014

I-core sandwich panel that has been used more widely is assembled using high power $CO_2$ laser welding. Kim et al. (2013) proposed a circular cone type heat source model for the T-joint laser welding between face plate and core. It can cover the negative defocus which is commonly adopted in T-joint laser welding to provide deeper penetration. In part I, a volumetric heat source model is proposed and it is verified thorough a comparison of melting zone on the cross section with experiment results. The proposed model can be used for heat transfer analysis and thermal elasto-plastic analysis to predict welding deformation that occurs during laser welding. In terms of computational time, since the thermal elasto-plastic analysis using 3D solid elements is quite time consuming, shell element model with multi-layers have been employed instead. However, the conventional layered approach is not appropriate for the application of heat load at T-Joint. This paper, Part II, suggests a new method to arrange different number of layers for face plate and core in order to impose heat load only to the face plate.

• Environmental Analysis Health and Toxicology
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• v.18 no.1
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• pp.45-55
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• 2003

The alkylphenols, chlorophenols and bisphenol A were determined by gas chromatography/mass spectrom-etry-selected ion monitoring (GC/MS-SIM) mode followed by two work-up methods for comparison; isoBOC derivatization method and TBDMS derivatization method. Eleven phenols in paper samples were extracted with acetonitrile. Also, solid -phase extraction (SPE) with XAD -4 and subsequent conversion to isobutoxycarbonyl derivatives or tert.-butyldimethylsilyl derivatives for sensitive analysis with the selected ion-monitoring (SIM) mode. The SIM responses were linear with the correlation coefficient varying 0.9717 ∼ 0.9995 (isoBOC derivatization), and 0.9842 ∼ 0.9980 (TBDMS derivatization). The recoveries were 82.4 ∼ 108.8％) by area ratio of phenanthrene -d$\_$10/ vs bisphenol A-d$\^$l6/. (isoBOC derivatization and TBDMS derivatization) The range of concentrations was respectively, 0.95 ∼ 1.44 ng/g in 2,4-dichlorophenol, 1.01 ∼ 1.17 ng/g in t-butylphenol,2.17 ∼ 5.84 ng/g in pentachlorophenol, 12.68 ∼ 14.88 ng/g in nonylphenol and 30.84 ∼ 153.72 ng/g in bisphenol A.

• Proceedings of the KIEE Conference
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• 2001.11c
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• pp.311-314
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• 2001

The objectives of this paper include the development of an agile prototype of SFFS, the $CAFL^{VM}$(Computer Aided fabrication of Lamination for Various Material), which is suitable for the multi-item and small-quantity production and various material fabrication. This paper includes remodeling of the layer slices for the 2D cutting, supplementing information of the layer slices and developing process conditions to fabricate products of various shape. And also includes developing control hardware as well as software by enhancing BOF of the manipulator to 3 degree for the precise 2D cutting. It will generate optimal layer trajectory considering the dynamic characteristics of the laser beam. The system can be used as a competitive agile protype system in terms of various materials, fabrication speed, and accuracy by CAD modeling precise layer slicing, material development, robot path control, and optimization of the support structure.

• Journal of the Korean Society of Manufacturing Technology Engineers
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• v.22 no.2
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• pp.310-317
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• 2013

In this paper, the contact pressure of the wafer and polishing pad for final polishing process for 300 mm-wafer were investigated through numerical analysis using FEM tool, ANSYS. The distribution of the contact pressure is one of main parameters which affects on the flatness and surface roughness of polished wafers. Two types of polishing head, a hard type head with ceramic disk and a soft type head with air bag were considered. The effects of the deformation and initial shape of table on the contact pressure were also examined. Both heads and tables were modeled as 3D finite element model from solid model, and the material properties of polishing pads and rubber plate for the air-bag head were obtained from tensile tests. The contact pressure deviation on wafer surface was smaller with air bag head than hard type head even when the table had form errors such as convex or concave. From this 3D analysis, it could be concluded that the air-bag head has better uniformity of the contact pressure on wafer. Also, the effects of inner diameter of air bag and radial clearance between wafer and retainer were investigated as view point of contact pressure concentration on the edge of wafer.

• Journal of the Korea Furniture Society
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• v.27 no.2
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• pp.104-110
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• 2016

The aim of this study is to develop and suggest the handle for lockers according to the design process which are used for keeping of student's personal stuffs such as books, writing implements and gym uniform in elementary, middle and high school and university as well. This includes the design development for ILGUMTUR which is specialized for office furniture, but does not own the intellectual property right yet. The design concept based on the domestic locker market survey is recessed handle at low- to intermediate price and it's material should be plastic what is solid and light. The lock system should be constructed by molding process and the name plate can be exchanged every time the owner of locker changes. Contrary to the right angle of it's external appearance, the handle of the locker is designed to be softly round and the simplicity is pursued for an easy production. On the basis of this design concept the sketch has been drawn and upgraded in full by 3D-rendering. Then the mock-up has been completed by 3D printer and ILGUMTUR has obtained a patent for the locking system based on the rotation of 2 circles.

• Journal of Welding and Joining
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• v.29 no.5
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• pp.99-105
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• 2011

In this study, effect of Si content on nugget diameter in electric resistance spot welded dual-phase(DP) steel was investigated. The cold rolled DP steels with different Si content (0.5, 1.0, 1.5, 2.0 wt.%) were used and thickness of those sheet was 1.2mm. With increasing Si content, nugget diameter was increased at the same welding current. This is attributed to increase of heat input result from high resistivity. Also, nugget diameter was increased with an increase in Si content for the same heat input. For this reason, the melting point of DP steel is lowered with an increase in the Si content. And solid DP steel can easily be transformed to a liquid phase because the low melting point. Finally, a prediction formula for the nugget diameter(N.D.) could be obtained in terms of heat input(Q) and melting point(M.P) as follows: N.D.(mm) = 0.11Q(J) - 0.0031 M.P.($^{\circ}C$) + 0.32.

• Journal of Surface Science and Engineering
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• v.39 no.6
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• pp.245-249
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• 2006

In this study, ternary Ti-Mo-N and new quaternary Ti-Mo-Si-N coatings were synthesized on steel substrates(AISI D2) and Si wafers by a hybrid coating system of arc ion plating (AIP) using Ti target and d.c. magnetron sputtering technique using Mo and Si targets in $N_2/Ar$ gaseous mixture. Ternary Ti-Mo-N coatings were substitutional solid-solution of (Ti, Mo)N and showed maximum hardness of approximately 30 GPa at the Mo content of ${\sim}10$. %. The Ti-Mo-Si-N coating with the Si content of 8.8 at. % was a composite consisting of fine (Ti, Mo)N crystallites and amorphous $Si_3N_4$ phase. The hardness of the Ti-Mo-Si(8.8 at. %)-N coatings exhibited largely increased hardness value of ${\sim}48$ GPa due to the microstructural evolution to the fine composite microstructure and the refinement of (Ti, Mo)N crystallites. The average friction coefficient of the Ti-Mo-Si-N coatings largely decreased with increase of Si content. The microstructures of Ti-Mo-Si-N coatings were investigated with instrumental analyses of XRD, XPS, and HRTEM in this work.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.29 no.12
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• pp.750-758
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• 2016

For the channel doping of shallow junction and retrograde well formation in CMOS, indium can be implanted in silicon. The retrograde doping profiles can serve the needs of channel engineering in deep MOS devices for punch-through suppression and threshold voltage control. Indium is heavier element than B, $BF_2$ and Ga ions. It also has low coefficient of diffusion at high temperatures. Indium ions can be cause the erode of wafer surface during the implantation process due to sputtering. For the ultra shallow junction, indium ions can be implanted for p-doping in silicon. UT-MARLOWE and SRIM as Monte carlo ion-implant models have been developed for indium implantation into single crystal and amorphous silicon, respectively. An analytical tool was used to carry out for the annealing process from the extracted simulation data. For the 1D (one-dimensional) and 2D (two-dimensional) diffused profiles, the analytical model is also developed a simulation program with $C^{{+}{+}}$ code. It is very useful to simulate the indium profiles in implanted and annealed silicon autonomously. The fundamental ion-solid interactions and sputtering effects of ion implantation are discussed and explained using SRIM and T-dyn programs. The exact control of indium doping profiles can be suggested as a future technology for the extreme shallow junction in the fabrication process of integrated circuits.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.30 no.4
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• pp.218-222
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• 2017

In this paper, in order to develop excellent composition ceramics for a piezoelectric energy- harvesting device, we synthesized $0.99(Na_{0.52}\;K_{0.443}\;Li_{0.037})(Nb_{0.883}\;Sb_{0.08}\;Ta_{0.037})O_3$ + $0.01(Sr_{0.95}Ca_{0.05})TiO_3$ + $0.3\;wt%\;Bi_2O_3\;+\;0.3\;wt%\;Fe_2O_3\;+\;0.3\;wt%\;CuO$ (abbreviated as NKN-SCT) ceramics with different sintering times, using the ordinary solid-state reaction method. The effect of sintering time on the microstructure and piezoelectric properties was investigated. The ceramics with the sintering time of 7 h have the optimum values of the piezoelectric constant ($d_{33}$), piezoelectric voltage constant ($g_{33}$), planar piezoelectric coupling coefficient (kp), mechanical quality factor (Qm), and dielectric constant (${\varepsilon}r$): $d_{33}=314[pC/N]$, $g_{33}=20.07[10^{-3}mV/N]$, kp = 0.442, Qm = 93, ${\varepsilon}r=1,768$, all being suitable for a piezoelectric energy-harvesting device.

• Journal of the Korean Institute of Electrical and Electronic Material Engineers
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• v.28 no.4
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• pp.229-233
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• 2015

In this paper, in order to develop outstanding Pb-free piezoelectric composition ceramics, the $(Na_{0.525}K_{0.443}Li_{0.037})(Nb_{0.883}Sb_{0.08}Ta_{0.037})O_3+0.3wt%Bi_2O_3+0.4wt%Fe_2O_3+xwt%CuO$ (x= 0~0.8 wt%)(abbreviated as NKL-NST) lead-free piezoelectric ceramics have been synthesized using the ordinary solid state reaction method. The effects of CuO-doping on the structure and electrical properties of the NKL-NST ceramics were systematically studied. The results show that the ceramics exhibit a pure perovskite structure with orthorhombic phase at room temperature, and secondary phase was found in the ceramics. The 0.4 wt%CuO added ceramics sintered at $950^{\circ}C$ showed the optimum properties of piezoelectric constant($d_{33}$), planar piezoelectric coupling coefficient(kp) and mechanical quality factor(Qm) : $d_{33}=213$[pC/N], kp= 0.43, Qm= 423,respectively.