• 열처리공학회지
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• 제28권2호
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• pp.68-74
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• 2015

The low cycle fatigue (LCF) and creep-fatigue (hold time tension fatigue, HTTF) tests were performed on the modified 25Cr-13Ni cast stainless steel, which was selected as a candidate material for exhaust manifold in automotive engine. The exhaust manifold is subjected to an environment in which heating and cooling cycle occur due to the running pattern of automotive engine. Several types of fatigue behaviour such as thermal fatigue, thermal mechanical fatigue and creep-fatigue are belong to the main failure mechanisms. High temperature tensile test was firstly carried out to compare the sample with the traditional cast steel for the component. The low cycle fatigue and HTTF tests were carried out under the strain controlled condition with the total strain amplitude from ${\pm}0.6%$ to ${\pm}0.7%$ at $800^{\circ}C$. The hysteresis loops of HTTF tests showed significant stress relaxation during tension hold time. With the increase of tension hold time, the fatigue life was remarkably deceased which caused from the formation of intercrystalline crack by the creep failure mechanism.

• 한국산업보건학회지
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• 제8권2호
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• pp.209-223
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• 1998

The aim of this study was to evaluate welders' exposure to hexavalent chromium (Cr(VI)) and nickel (Ni) during welding operations in a Korean shipyard. The airborne Cr(VI) and Ni concentrations were measured during metal inert gas (MIG) welding on mild and stainless steel, and manual metal arc (MMA) welding on mild steel. The geometric mean (GM) of Cr(VI) concentrations inside the welding helmet during MIG welding on mild steel were $0.0018mg/m^3$ inside a ship section, and $0.0015-0.0026mg/m^3$ at the welding shops. All of the personal breathing zone air samples were below the American Conference of Governmental Industrial Hygienists (ACGIH) Threshold Limit Value ($TLV^{(R)}$) of $0.01mg/m^3$. Conversely, eighty-eight percent(21 of 24) of the personal breathing zone air samples exceeded the National Institute for Occupational Safety and Health (NIOSH) recommended exposure limit of $0.001mg/m^3$. Ni was not detected on 20 of 23 air samples collected during MIG welding on mild steel. The three Ni samples above the limit of detection ranged from 0.015 to $0.044mg/m^3$. The GM of Cr(VI) concentrations during MMA welding on mild steel were $0.0013mg/m^3$, but Ni was not detected in the air samples during this operation. It is assumed that the airborne Cr(VI) and Ni during mild steel welding were derived from the base metals which contained about 0.03% Cr and 0.03% Ni. The GM of airborne total Cr, Cr(VI) and Ni concentrations during MIG welding on stainless steel were 4.02, 0.13 and $0.86mg/m^3$, respectively, and the levels of Cr(VI) and Ni were above the ACGIH-$TLV^{(R)}$. Cr(VI) comprised about 35.5% of the total chromium(Cr) from MIG welding on mild steel, and about 8.4% of total Cr from MIG welding on stainless steel. The ratios of Cr(VI) to total Cr were significantly different among welding shops. It was concluded that welders were exposed to high levels of Cr(VI) and Ni during welding on stainless steel, and were exposed to low levels of Cr(VI) even during welding on mild steel.

• 대한치과보철학회지
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• 제23권1호
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• pp.39-59
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• 1985

The purpose of this study was to investigate how gap distances of 0.13mm, 0.15mm, 0.20mm, and 0.30mm affects solder joint strength from gold alloys and nickel-chromium base alloys and to examine the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys. The tensile test specimens were prepared in the split stainless steel mold with a half dumbbell shape 2.5mm in diameter and l2mm in length. 6 pairs of specimens of each gap distance group of gold alloys and nickel-chromium base alloys were made and 48 pairs of all specimens were soldered with solder gold of 666 fineness. All soldered specimens were machined to a uniform diameter and then a tensile load was applied at a cross-head speed of 0.10mm/min using Instron Universal Testing Machine, Model 1115. The fractured specimens at solder gold of solder joint fracture with each gap distance of 0.13mm, 0.15mm, 0.20mm, and 0.30mm were examined under the Scanning Electron Microscope, JSM-35c and the composition of solder gold, the solder joint of gold alloys and nickel-chromium base alloys was analyzed by Electron Probe Micro Analyzer. The results of this study were obtained as follows: 1. In case of soldering of gold alloys, the tensile strength between gold alloys showed $37.33{\pm}2.52kg/mm^2$ at 0.13, $39.14{\pm}3.35kg/mm^2$ at 0.15mm, $43.76{\pm}2.97kg/mm^2$ at 0.20mm, and $49.18{\pm}4.60kg/mm^2$ at 0.30mm. There was statistically significant difference at each gap distance, and so the greater increase of gap distance showed the greater tensile strength. 2. In case of soldering of nickel-chromium base alloys, the tensile strength between nickel-chromium base alloys showed $34.84{\pm}4.26kg/mm^2$ at 0.13mm, $37.25{\pm}2.49kg/mm^2$ at 0.15mm, $42.91{\pm}4.32kg/mm^2$ at 0.20mm, and $46.93{\pm}4.21kg/mm^2$ at 0.30mm. There was not statistically significant difference only between 0.13mm and 0.15mm and bet ween 0.20 mm and 0.30mm, but generally the greater increase of gap distance showed the greater tensile strength. 3. The greater increase of gap distance shoed less porosities in solder gold at solder joint fracture. 4. In solder gold Au, Cu, Ag, Zn, and Sn were composed and Au and Cu were mostly distributed uniformly. 5. In solder joints of solder gold and gold alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Au, Cu, Ag, Pt, and Pd were composed in gold alloys. Au and Cu of solder gold and gold alloys were mostly distributed uniformly and the diffusion of other elements except Pt and Pd around the solder joint was not almost found. In solder joints of solder gold and nickel-chromium base alloys Au, Cu, Ag, Zn, and Sn were composed in solder gold and Ni, Cr, and Al were composed in nickel-chromium base alloys. Au and Cu of solder gold and Ni and Cr of nickel-chromium base alloys were mostly distributed uniformly and the diffusion of other elements except Cr around the solder joint was not almost found.