• Journal of the Microelectronics and Packaging Society
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• v.23 no.4
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• pp.69-77
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• 2016

We propose nano-scale Cu direct bonding technology using ultra-high density Cu nano-pillar (CNP) with for high stacking yield exascale 2.5D/3D integration. We clarified the joining mechanism of nano-scale Cu direct bonding using CNP. Nano-scale Cu pillar easily bond with Cu electrode by re-crystallization of CNP due to the solid phase diffusion and by morphology change of CNP to minimize interfacial energy at relatively lower temperature and pressure compared to conventional micro-scale Cu direct bonding. We confirmed for the first time that 4.3 million electrodes per die are successfully connected in series with the joining yield of 100%. The joining resistance of CNP bundle with $80{\mu}m$ height is around 30 m for each pair of $10{\mu}m$ dia. electrode. Capacitance value of CNP bundle with $3{\mu}m$ length and $80{\mu}m$ height is around 0.6fF. Eye-diagram pattern shows no degradation even at 10Gbps data rate after the lamination of anisotropic conductive film.

• Journal of the Microelectronics and Packaging Society
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• v.7 no.3
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• pp.19-25
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• 2000

In this paper, we describe RF receiver module for IMT-2000 handset with 5 MHz channel bandwidth. The fabricated RF receiver module consists of Low Noise Amplifier, RF SAW filter, Down-converter, If SAW filter, AGC and PLL Synthesizer. The NF and IIP3 of LNA is 0.8 dB, 3 dBm at 2.14 GHz, conversion gain of down-converter is 10 dB, dynamic range of AGC is 80 dB, and phase noise of PLL is -100 dBc at 100 kHz. The receiver sensitivity is -110 dBm, adjacent channel selectivity is 48 dBm.

• Journal of the Microelectronics and Packaging Society
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• v.5 no.2
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• pp.49-52
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• 1998

이동통신용 핵심 부품인 W-LAN용 RF-Switch를 설계 및 제작하였다. 본 연구에서 는 CAD를 이용한 전송선로 설계기술, 소형화, 다층화 설계기술, 이동통신용 MCM 부품의 패턴설계를 개발하였으며 RF-Switch 설계하는기법 소형화 및 다층화를 위한 MCM공법을 얻을수 있었다. Ant-Rx On시 삽입손실은 0.48dB로 나타났다.

• Asian-Australasian Journal of Animal Sciences
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• v.22 no.3
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• pp.428-432
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• 2009

40 goat kid ribcages were held for 7 days in storage conditions ($4^{\circ}C$) and used to determine the effects of three different packaging methods (atmospheric air, vacuum and modified atmosphere package (MAP) 10:70:20 mixture of $N_2:O_2:CO_2$) on meat quality of the chops. L* was affected by the packaging method being lighter than MAP chops. The coordinate a* significantly increased during storage time. For MAP-packed chops and those kept in atmospheric air, b* increased markedly during storage time whereas it remained unaffected throughout storage when in vacuum packages. Final pH values ranged from 5.6 to 5.8 and no effects were found for either storage time or packaging method. WHC means were lowest for the three packaging methods on day 7 of storage and highest on day 1. Storage time increased water loss in vacuum treatments. Trained panel colour acceptability was lower at 3, 5 and 7 days than on day 1 of storage for atmospheric air treatment and vacuum packaging, while for the MAP treatment average values on days 5 and 7 were lower than those observed on days 1 or 3. Trained panel odour was lower for atmospheric air and vacuum packages at 3, 5, and 7 days storage than at 1 day, while no differences were found in trained panel odour acceptability for MAP packages. With reference to consumers, the MAP proposed in the present study is the chosen method for storing goat meat, rather than vacuum or atmospheric air packaging.

• Proceedings of the KIEE Conference
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• 2007.07a
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• pp.1504-1505
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• 2007

In this paper, fully embedded high Dk BTO MIM capacitors have been developed into a multi-layered organic package substrate for low cost RF SOP (System on Package) applications. These embedded MIM capacitors were designed and simulated by using CST 3D EM simulators for finding out optimal geometries and verifying their applicability. The embedded MIM capacitor with a size of $550\;{\times}\;550\;um^2$ has a capacitance of 5.3pF and quality factor of 43 at 1.5 GHz, respectively. The measured performance characteristics were well matched with 3D EM simulated ones. Equivalent circuit parameters of the embedded capacitors were extracted for making a design library.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.4 no.1
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• pp.17-21
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• 1997

Zeolite powder used by molecular sieve, adsorbants and catalist. 1N HCl teated zeolite powders for freshness extension of fruits and vegetables showed that specific surface area was $300.29m^2/g$ largest then that of the others, and ethylene gas adsorbability was 29.07 cc/g. And then 0.5N NaCl Henting after 1N HCl treated zeolite powder showed that specific surface area and ethylene gas adsorbability was $329.43m^2/g$ and 35.64 cc/g largest then those of the others. Specific surface area of processed zeolite powder treated by high intensity magnetic seperator(HIMS) showed $369.67m^2.g$, ethylene gas adsorbability was 39.87cc/g. In this study, it could be employ 0.5N NaCl treat and HIMS methods as MA packaging materials for freshess extension of fruits and vegetables.

• Journal of the Microelectronics and Packaging Society
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• v.28 no.3
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• pp.25-32
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• 2021

In this paper, the Magneto-Electric(ME) dipole array antenna with dual-polarization in the X-Band is proposed and it is implemented and measured. The proposed array antenna is composed of 32 single ME dipole antenna and a Teflon PCB. 1 × 1 ME dipole antenna is implemented dual-polarization by radiating vertical polarization and horizontal polarization from two pairs of radiators. 2-port feeding structures are realized by lamination process using LTCC. And, each port independently feeds the radiator through a Γ-shaped feeding strip with isolation between ports. The Teflon PCB used in the antenna array has a 4-layer structure, and 2-port is fed through the top and bottom layers. The λ_g/4 transformer is applied to the transmission line of the Teflon PCB for impedance matching of the arrayed antenna and the Teflon PCB, and the optimal parameters are obtained through simulation. The measured maximum antenna gains of port 1 was 18.2 dBi, Cross-pol was 1.0 dBi. And the measured maximum antenna gains of port 1 was 18.1 dBi, Cross-pol was 3.2 dBi.

• Journal of the Microelectronics and Packaging Society
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• v.14 no.2 s.43
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• pp.41-47
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• 2007

Today lots of investigations on Embedded Passive Technology using materials and chip components have been carried out. We fabricated diplexers with 1005 sized-passives, which were made by burying chips in PCB substrate and surface mounting chip on PCB. 6 passive chips (inductors and capacitors) were used for the frequency divisions of $880\;MHz{\sim}960\;MHz(GSM)$ and $1.71\;GHz{\sim}1.88\;GHz(DCS)$. Two types of diplxer were characterized with Network analyzer. The chip buried diplexer showed extra 5db loss and a little deviation of 0.6GHz at aimed frequency areas, whereas the chip mounted diplexer showed man. 0.86dB loss within GSM field and max. 0.68dB within DCS field respectively. But few degradations were observed after $260^{\circ}C$ for 80min baking and $280^{\circ}C$ for 10sec solder floating.

• Proceedings of the International Microelectronics And Packaging Society Conference
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• 2002.11a
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• pp.131-135
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• 2002

In this project, we have developed various techniques for subminiaturization, surface implementation, high frequency design, small-sizes SMD, performance test and applications of ultra small chip antenna, which is a core component for the personal communication systems. We also obtained base techniques for the next-generation ultra small chip antenna design and fabrication techniques for an internationally competitive subminiature ultra small chip antenna. Center frequency is 2442.5MHz(Type), return loss is -10dB max, VSWR is 2max, xy max gain is -2dB min, size is 0.05ccmax.

• KOREAN JOURNAL OF PACKAGING SCIENCE & TECHNOLOGY
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• v.30 no.1
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• pp.73-83
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• 2024

In this study, environmental evaluation of high barrier coated paper (coating layer/paper) packaging is conducted in comparison with conventional aluminum laminated (PET/VMPET/LLDPE) plastic packaging. The target product for this packaging is a KF94 mask, which requires a high barrier of water and oxygen to maintain the filtration ability of the mask filter. The functional unit of this study is 10,000 mask packaging materials based on a material capable of blocking oxygen (<1 g/m²day) and moisture (<3 g/m²day) for the preservation of KF94 masks. In order to understand the results easily, paper-based mask packaging system divided into 6 stages (pulp, pulping & paper making, calendaring & coating, printing, packing and waste management), while plastic-based mask packaging consists of 5 stages (material production, processing, printing, packing, waste management) In case of paper-based mask packaging, most contributing stage is calendaring & coating, resulting from heat and electricity production. On the other hand, plastic-based mask packaging is contributed more than 30% by material production, specifically due to linear low density polyethylene and purified terephthalic acid production. The comparison results show that global warming potential of paper-based mask packaging has 32% lower than that of plastic-based mask packaging. Most of other impact indicators revealed in similar trend.