• Transactions of the Korean Society of Mechanical Engineers
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• v.19 no.5
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• pp.1259-1268
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• 1995

The stress distribution around micro holes and the behavior of stress interaction between micro holes are considerd in the study. Several conclusions are extracted as follows : (1) The stress interaction varies with the distance e between micro holes. When the two micro holes are spaced in such a manner that theri two closest points are separated by a distance of micro hole radius (e=1), stress distribution is affected by a opposite micro hole in all the closest region. In addition, if two closest points are seperated by twice the distance of a micro hole radius (e=2), stress distribution is affected by a opposite micro hole in the region of -0.8.leq.x/r.leq.0.8 and the interaction effect can be neglected for e=4. (2)If the depth becomes larger than the radius, or the radius varies, the shape and magnitude of stress distribution around micro holes varies. (3) Hoop stress around a micro hole for the two dimensional configuration is larger than that of the three dimensional micro hole located on the surface of material for .theta. < 60.deg., but it is reversed for .theta > 60.deg.

• Journal of the Korean Society for Nondestructive Testing
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• v.24 no.5
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• pp.532-537
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• 2004

FEF(Focused Electromagnetic Field) technique was newly developed that is based on the induction principle exciting electromagnetic field. The technique consists of an induction wire and a sensor for detecting electromagnetic field, and is applied in a non-contact mode. In this study, the technique was applied to the evaluation of EDM slits in some conductive materials - aluminum alloy, stainless steel and Inconel alloy. The voltage in the non-defect region is depended upon the measurement lift-off. The voltage signals on defects are measured with peak values, and the peak values changed with the depth of defects. The voltage distributions for all conductive materials are the same trend.

• Journal of the Korean Ceramic Society
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• v.44 no.3 s.298
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• pp.162-168
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• 2007

Silica wet gels were prepared ken water glass ($29\;wt%\;SiO_{2}$) by using Amberlite as a ion exchange resin. After washing in distilled water, the wet gels were further aged in a solution of TEOS/EtOH to strengthen of 3-dimensional network structure. As increase TEOS content in aging solution, BET surface area and porosity of the ambient dried silica aerogels were significantly decreased, and average pore diameter was also decreased 30 nm to -10 nm. Also, higher density and compressive strength were obtained in case of higher TEOS content. This is due to precipitation of $SiO_{2}$ nano particles by TEOS. Hence, TEOS addition plays an important role of both strengthening and stiffness of silica wet gel network. By adding over 30 vol% TEOS, a crack-free monolithic silica aerogel tiles were obtained and its density, compressive strength, and thermal conductivity were shown $0.232g/cm^{3}$, 7.3 MPa, and 0.029 W/mk, respectivly.

• Journal of the Korean Society for Precision Engineering
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• v.14 no.6
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• pp.64-73
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• 1997

솔리드 모델러, 자동요소분할 기법, 4면체 특이요소, 응력확대계수의 해석 기능을 통합하여, 3차원 균열의 응력확대계수를 효율적으로 해석할 수 있는 시스템을 개발하였다. 균열을 포함하는 기하모델을 CAD 시스템을 이용하여 정의하고, 경계조건과 재료 물성치 및 절점밀도 분포를 기하모델에 직접 지정함으로써, 퍼지이론 에 의한 절점발생과 데로우니 삼각화법에 의한 요소가 자동으로 생성된다. 특히, 균열 근방에는 4면체 2차 특이요소를 생성시켰으며, 유한요소 해석을 위한 입력 데이터가 자동으로 작성되어 해석코드에 의한 응력 해석이 수행된다. 해석 후, 출력되는 변위를 이용하여 변위외삽법에 의한 응력확대계수가 자동적으로 계산되어 진다. 본 시스템의 효용성을 확인하기 위해, 인장력을 받는 평판내의 표면균열에 대해 해석하여 보았다.

• Journal of the Korean Society for Nondestructive Testing
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• v.29 no.2
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• pp.104-107
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• 2009

It was verified that the effect of the distance between current input point and output point on direct current potential drop(DCPD) in the material with two-dimensional surface notch. If the distance between potential drop measuring points was fixed at a certain distance, the potential drop was decreased with increasing the distance between current input and output points. Hence it is the effect way to increase sensitivity in DCPD that the current input and output points should be located near the potential measuring points. DCPD was a useful method for surface crack sizing because the potential drop was proportional to the length of notch. When the current input and output points are located near the potential measuring points, even small length crack can be measured by DCPD technique.

• Journal of the Korean Society for Nondestructive Testing
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• v.21 no.2
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• pp.169-176
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• 2001

In modern industry, the accuracy and the sulfate-finish requirements for machined parts have been becoming ever more stringent. In addition, the measurement and understanding of surface topography is rapidly attracting the attention of the physicist and chemist as well as the engineer. Optical measuring method is used in vibration measurement, crack and defect detection with the advent of opto-mechatronics, and it is expected to play an important role in surface topography. In this study, the principle of confocal microscope is described, and the advanced 3-D surface measuring system that has better performance than the traditional confocal microscope is developed. Suitable fixtures arc developed and integrated with the computer system for generating 3-D surface and form data. Software for data acquisition and analysis of various parameters in surface geometrical features has been developed.

• Journal of the Korean Society of Safety
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• v.24 no.2
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• pp.7-12
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• 2009

The machining process of ceramics can be characterized by cracking and brittle fracture. In the machining of ceramics, edge chipping and crack propagation are the principal reasons to cause surface integrity deterioration. Such phenomenon can cause not only poor dimensional and geometric accuracy, but also possible failure of the ceramic parts. Thus, traditional ceramics are very difficult-to-cut materials. Generally, ceramics are machined using conventional method such as grinding and polishing. However these processes are generally costly and have low MRR(material removal rate). To overcome such problems, in this paper, h-BN powder, which gives good cutting property, is added for the fabrication of machinable ceramics by volume of 10 and 15%. The purpose of this study is an analysis of endmill's rake angle for appropriate tools design and manufacturing for the machinable ceramics. In this study, Experimental works are executed to measure cutting force, surface roughness, tool fracture, on different axial rake angle of endmills. Cutting parameters, namely, feed, cutting speed and depth of cut are used to accomplish purpose of this paper. Required experiments are performed, and the results are investigated.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.30 no.5 s.248
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• pp.528-532
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• 2006

In the aerospace industry, Cold expansion has been used the most important method that is retarded of crack initiation from fastener hole surface. Cold expansion method(CEM) is that a oversized tapered mandrel goes through the hole in order to develop a compressive residual stress as the passing of the mandrel around the hole. Therefore, because of characteristic of mandrel inserting, Residual Stress Distributions (RSD) are differently generated form Entry, Mid and Exit position of the plate. Also, it is respected that RSD are changed as distances between holes. In this paper, It is performed a FE analysis of RSD by CEM and it is respectively shown RSD in the Entry, Mid and Exit position. It is compared residual stress results form the cold expansion in these two cases: the concurrent CEM and the sequential CEM. From this research, it has been found that compressive residual stress of Entry position is lower than other positions. Also, the concurrent CE of adjacent holes leads to much higher compressive residual stress than the sequential CE. In addition, in the sequential CE case, a compressive RSD of 1 step's hole around is lower than compressive RSD of 2 step's hole around.

• Smart Structures and Systems
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• v.19 no.2
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• pp.163-179
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• 2017

The axisymmetric buckling delamination of the Piezoelectric/Metal/Piezoelectric (PZT/Metal/PZT) sandwich circular plate with interface penny-shaped cracks is investigated. The case is considered where open-circuit conditions with respect to the electrical displacement on the upper and lower surfaces, and short-circuit conditions with respect to the electrical potential on the lateral surface of the face layers are satisfied. It is assumed that the edge surfaces of the cracks have an infinitesimal rotationally symmetric initial imperfection and the development of this imperfection with rotationally symmetric compressive forces acting on the lateral surface of the plate is studied by employing the exact geometrically non-linear field equations and relations of electro-elasticity for piezoelectric materials. The sought values are presented in the power series form with respect to the small parameter which characterizes the degree of the initial imperfection. The zeroth and first approximations are used for investigation of stability loss and buckling delamination problems. It is established that the equations and relations related to the first approximation coincide with the corresponding ones of the three-dimensional linearized theory of stability of electro-elasticity for piezoelectric materials. The quantities related to the zeroth approximation are determined analytically, however the quantities related to the first approximation are determined numerically by employing Finite Element Method (FEM). Numerical results on the critical radial stresses acting in the layers of the plate are presented and discussed. In particular, it is established that the piezoelectricity of the face layer material causes an increase (a decrease) in the values of the critical compressive stress acting in the face (core) layer.

• Transactions of the Korean Society of Mechanical Engineers A
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• v.34 no.7
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• pp.929-933
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• 2010

Four-point bending tests were performed to investigate the interfacial adhesion of Cu-Cu bonding fabricated by thermo-compression process for three dimensional packaging. A pair of Cu-coated Si wafers was bonded under a pressure of 15 kN at $350^{\circ}C$ for 1 h, followed by post annealing at $350^{\circ}C$ for 1 h. The bonded wafers were diced into $30\;mm\;{\times}\;3\;mm$ pieces for the test. Each specimen had a $400-{\mu}m$-deep notch along the center. An optical inspection module was installed in the testing apparatus to observe crack initiation at the notch and crack propagation over the weak interface. The tests were performed under a fixed loading speed, and the corresponding load was measured. The measured interfacial adhesion energy of the Cu-to-Cu bonding was $9.75\;J/m^2$, and the delaminated interfaces were analyzed after the test. The surface analysis shows that the delamination occurred in the interface between $SiO_2$ and Ti.