• Proceedings of the Korean Society Of Semiconductor Equipment Technology
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• 2003.12a
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• pp.207-211
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• 2003

In this study, the geometric modeling has been conducted for a new model of 12 inch hot-cold chuck using three-dimensional solid modeler, SolidWorks. Then, the heat transfer analysis and the thermal deformation analysis using FEM have been performed. The results of the analysis show the temperature distribution and the deformed shape of a new model of 12 inch hot-cold chuck. The evaluation for the surface flatness of a new model has been performed based on the deformed shape obtained from ANSYS.