• Proceedings of the KSME Conference
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• 2005.11a
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• pp.40.2-40.2
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• 2005

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.41.1-41.1
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• 2005

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.41.2-41.2
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• 2005

• Proceedings of the KSME Conference
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• 2005.11a
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• pp.16.1-16.1
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• 2005

• Proceedings of the KSME Conference
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• 2000.04b
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• pp.77-82
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• 2000

Parametric study fur the cooling characteristic investigation of a notebook PC mounted with heat spreader has been numerically performed. Two oases of air-blowing and air-exhaust at inlet were tested. The cooling effect on Parameters such an, velocities of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.

• Proceedings of the Korean Institute of Surface Engineering Conference
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• 2016.11a
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• pp.165.1-165.1
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• 2016

표면활성화 접합은 이종 소재의 표면을 제어하여 직접 접합하는 기술이다. 본 연구에서는 표면활성화 접합을 이용하여 고 방열특성의 LED용 히트스프레더(heat spreader)를 제작하기 위하여 $Al-Al_2O_3$ 복합소재를 제조하였다. LED 제품의 히트스프레더는 LED에서 발생하는 열을 한 곳으로 집중하는 것을 막아 열을 분산하는 금속판을 의미한다. 최근의 LED 제품은 고출력화에 의한 발열량의 급증으로 MCL(Metal Clad Laminate)를 이용하여 LED 칩에서 발생된 열을 외부로 배출하는 모듈구조를 나타내는 경우가 대다수이다. LED에서 열이 증가하게 되면 LED의 효율이 감소하고, 수명이 줄어드는 현상을 보이기 때문에 방열특성은 매우 중요하다. 따라서 고출력화되어 LED 칩에서 발생되는 열을 제어하는 기술이 이슈화 되고 있다. 기존의 히트스프레더 구조는 통상적으로 Al/절연층(폴리머)/Al으로 폴리머의 열전도율이 1W/mk로 고출력화에 의해 급증하는 LED의 발열량을 충분히 해소시키기 어렵다. 본 연구에서는 급증하는 LED의 방열량을 해소시키기 위해서 기존의 Al/폴리머/Al의 구조를 $Al/Al_2O_3/Al$의 구조로 개발하기 위해서 HV-SCDB 기술을 이용한 $Al-Al_2O_3$ 복합소재 제조 및 접합특성에 관하여 연구하였다.

• Proceedings of the KSME Conference
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• 2004.11a
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• pp.1258-1263
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• 2004

The present study proposes a new structure for a heat spreader which could embody a thin thickness, any shapes and high heat flux per unit area. It is on the structure for the formation of vapor passages and the support of the case of the heat spreader. A screen mesh is used as the one. To verify the validity of the one, the heat spreader of 1.4mm and 1.6mm thickness was made with 14 mesh and 100 mesh number. In this paper, The performance test of heat spreader conducted in order to compare with the heat transfer performance of conventional heat pipe. As the results, The heat spreader has excellent cooling and heat transfer performance.

• Transactions of the Korean Society of Mechanical Engineers B
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• v.25 no.6
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• pp.766-775
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• 2001

Parametric study to investigate the cooling performance of a notebook PC mounted with heat spreader has been numerically performed. Two cases of air-blowing and air-exhaust at inlet were tested. The cooling effect on parameters such as, inlet velocities in the cases of air-blowing and air-exhaust, materials of heat spreader, and CPU powers were simulated for two cases. Cooling performance in the case of air-blowing was better than the case of air-exhaust.

• Proceedings of the SAREK Conference
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• 2003.07a
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• pp.206-206
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• 2003

• Proceedings of the Korean Society for Technology of Plasticity Conference
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• 2007.05a
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• pp.60-65
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• 2007

According to the customers' demands, cellular phones are getting thinner and thinner in spite that their functions are getting more complex and flexible. Based on this trend, we are willing to propose new design of ultra slim cellular phone with multi-hinges which can provide thinner feature and wider active area than the current merchandised one. To make it come true, smaller and stronger mechanical parts would be necessary and more researches would be carried out in the near future. Moreover, the new frame of ultra slim cellular phone has the problem in heat propagation due to its thin feature and multi function. In this paper, slim heat-spreader would be proposed as a candidate to resolve the problem of heat transfer in the new cellular phone. To investigate the applicability of heat-spreader to cellular phones, prototypes were fabricated and verified.