• Title/Summary/Keyword: 후판

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Establishment of Initial Work Roll Crown in Finishing Plate Mill (후판 압연에서 작업롤 초기 크라운 설정)

  • 김종택;서재형;정병완
    • Proceedings of the Korean Society of Precision Engineering Conference
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    • 1993.10a
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    • pp.499-504
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    • 1993
  • To find a way for establishing work roll initial crown according to roll conditions, computer simulation for predicting plate crown in plate mill is done and effects of roll conditions on plate crown is analysed. Roll gap profile and plate crown are measured to be compared to the calculated values. As a result,a regression equation to establish work roll initial crown according to roll cooditions such as backup roll diameter, backup roll crown and work roll crown is obtained.

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Simulation of Thick Plate Preheating Process Using Induction Heating (유도가열을 이용한 후판 예열공정 시뮬레이션)

  • Oh, Yong Hee;Cho, Young Tae;Jung, Yoon Gyo
    • Journal of the Korean Society for Precision Engineering
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    • v.32 no.12
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    • pp.1017-1021
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    • 2015
  • Induction heating has been applied to the preheating process in various industrial fields. It has been used as a simple device structure, limiting the heating zone through controlled variables, and free-welding positions. It would be helpful to weld thick plates with arc welding such as GMAW. The induction heating process is well suited to this process. In this study, in order to find suitable induction heating parameters, a simulation was conducted with multi physics S/W. Three kinds of material were heated by induction coils designed specially for thick plate. Consequently, steel and nimonic alloy were the most efficient materials for preheating by induction. It can be concluded that the induction heating process is a good method for preheating the thick plate.

Two-Dimensional Simulation of Hg Flat Fluorescent Lamps for an LCD Backlight unit (액정디스플레이 후판광원용 평판형 수은 형광램프의 2차원 시뮬레이션 연구)

  • Yoon, Hyun-Jin;Lee, Hae-June
    • The Transactions of The Korean Institute of Electrical Engineers
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    • v.56 no.7
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    • pp.1275-1281
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    • 2007
  • The discharge phenomena in a flat fluorescent lamp for the backlight unit of liquid crystal displays are simulated by sung a two-dimensional fluid model. The numerical methods for the calculation of plasma dynamics and the radiation transport are introduced for the discharge simulation and for the transmission of the vacuum ultraviolet lights. The simulation results are presented to compare the luminance and the luminance efficacy with the variation of gas pressure, gas mixture ratio, driving voltage, and frequency.

Analytical method of flexural ductility of press-braked steel plate members (강재 절곡 후판부재의 휨연성 해석 방안)

  • Choi, Byung-Ho;Choi, Su-Young
    • Proceedings of the KAIS Fall Conference
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    • 2012.05b
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    • pp.631-633
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    • 2012
  • 본 논문은 구조용 후판 강재로 절곡되었을 때, 절곡부재의 구조연성 변화에 대한 해석 방안과 이에 따른 해석적 평가 사례를 제시하고 있다. 절곡 방법에 의한 제작과정에서 재료는 변형경화 현상이 발생한다. 이로 인해 구조연성 저하가 불가피하기 때문에 절곡부재의 휨연성 검토가 필요하다. 해석 방안은 유한요소해석 프로그램인 ABAQUS를 이용하였다. Lanczos 알고리즘을 적용한 고유치해석과 재료 비탄성-기하비선형을 고려한 비선형 해석을 하였다. 비선형해석 절곡에 의한 재료특성을 고려하였다. 극한 하중과 파괴모드를 평가하기 위해 Newton-Raphson method, modified Riks method를 적용한 단계별 하중재하 해석을 실시하였다. 본 연구를 통해 휨연성을 평가하는데 활용 될 것으로 판단된다.

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Cure simulation and Consolidation for a Thick Glass/Epoxy Laminate (유리섬유/에폭시 후판 복합재료의 경화공정 및 압밀해석)

  • O, Je-Hun;Lee, Dae-Gil
    • Transactions of the Korean Society of Mechanical Engineers A
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    • v.24 no.11
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    • pp.2853-2865
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    • 2000
  • During the curing process of thick glass/epoxy laminates, a substantial amount of temperature lag and overshoot at the center of the laminates is usually experienced due to the large thickness and low thermal conductivity of the glass/epoxy composites. Also, it takes a longer time for full and uniform consolidation. In this work, temperature, degree of cure and consolidation of a 20 mm thick unidirectional glass/epoxy laminate were investigated using an experiment and a 3-dimentional numerical analysis. From the experimental and numerical results, it was found that the experimentally obtained temperature profile agreed well with the numerical one, and the cure cycle recommended by the prepreg manufacturer should be modified to prevent a temperature overshoot and to obtain full consolidation.