• 한국신재생에너지학회:학술대회논문집
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• 2010.11a
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• pp.38.1-38.1
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• 2010

The trend to thinner crystalline silicon solar wafers in production of solar cells investigates re-evolution of back surface field (BSF) formation. We have studied mechanisms of back contact formation in Al evaporation and screen printed Al paste for Si solar cells by TEM analysis. We observed that Si diffuse into Al during heat up. The Si diffusion process made vacancies in Si wafer. The Al began to seep into the Si wafer (Al spike). During heat down, the Al spike were shrink which causes the doped region (BSF).

• 한국신재생에너지학회:학술대회논문집
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• 2010.06a
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• pp.91.1-91.1
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• 2010

There are some methods for increasing efficiency of crystalline silicon solar cells. Among them, It is important to reduce the recombination loss of surface for high efficiency. In order to reduce recombination loss is a way to use the BSF(Back Surface Field). The BSF on the back of the p-type wafer forms a p+layer. so, it is prevented to act electrons of the p-area for the rear recombination. As a result, the leakage current is reduced and the rear-contact has a good Ohmic contact. therefore, open-circuit-voltage and Fill factor(FF) of solar cells are increased. This paper investigates the formation of rear contact process comparing Aluminum-paste(Al-paste) with Aluminum-Metal(99.9%). It is shown that the Aluminum-Metal provides high conductivity and low contact resistance of $21.35m{\Omega}cm$ using the Vacuum evaporation process but, it is difficult to apply the standard industrial process because high Vacuum is needed and it costs a tremendous amount more than Al-paste. On the other hand, using the Al-paste process by screen printing is simple for formation of metal contact and it is possible to produce the standard industrial process. however, it is lower than Aluminum-Metal(99.9) of conductivity because of including mass glass frit. In this study, contact resistances were measured by 4-point prove. each of contact resistances is $21.35m{\Omega}cm$ of Aluminum-Metal and $0.69m{\Omega}cm$ of Al-paste. and then rear contact have been analyzed by Scanning Electron Microscopy(SEM).

• 전자공학회논문지 IE
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• v.44 no.2
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• pp.26-31
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• 2007

A surface treatment was performed after the screen printing of a carbon nanotube paste for obtaining the carbon nanotube field emission array(CNT FEA) on the soda-lime glass substrate. In this experiment, Ar ion bombardment was applied as an effective surface treatment method. After making a cathode electrode on the glass substrate, photo sensitive CNT paste was screen-printed, and then back-side was exposure by uv light. Then, the exposed CNT paste was selectively remained by development. After post-baking, the remained CNT paste was bombarded by accelerated Ar ions for removing some binders and exposing only CNTs. As results, the field emission characteristics were strongly depended on the accelerating energy. At 100 eV, the emission was highest and as the acceleration energy increases more then 100 eV, the emission decreased. This was due to the removal of CNT itself as well as binders.

• Journal of the Korean Vacuum Society
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• v.18 no.2
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• pp.79-84
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• 2009

The electron emission source of triode type has been fabricated using CNT paste. The nano Ag particle and photosensitive polymers were added to the CNT paste. The surface roughness of the CNT emitter was uniform by the back exposure method. The added nano Ag particle improves the adhesion and the electric conductance with small variation in the CNTs and between electrode. After the aging with heat-exhausting, the reliability of the triode CNT electron source was secured in the high voltage and current operation for 12 hours. At this time, the gate leakage current was about 10 % less than.

• Proceedings of the Korean Vacuum Society Conference
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• 2012.02a
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• pp.193-194
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• 2012

그래핀(graphene)은 탄소원자가 육각형 벌집 모양 배열의 격자구조를 가지는 원자 한층 두께의 이차원 물질이다. 그래핀은 전도띠(conduction band)와 가전자띠(valence band)가 한 점에서 만나고 에너지와 역격자의 k 벡터가 선형적으로 비례하는 에너지 구조를 가진다. 이로 인해 그래핀은 매우 빠른 전하 이동도를 가지며 원자 한 층의 두께임에도 불구하고 약 2.3%의 빛을 흡수할 수 있으며 자외선 영역부터 적외선 영역까지의 넓은 파장대의 빛을 흡수 할 수 있다. 이와 같은 그래핀의 우월한 성질을 이용하면 광 응답에 고속으로 반응하고 높은 주파수의 광통신에서도 작동 할 수 있는 그래핀 광소자를 제작할 수 있게 된다. 하지만 미래의 고속 그래핀 광소자를 실현하기에 앞서 그래핀의 광응답에 대한 정확한 이해가 필요하다. 그리하여 본 연구에서는 그래핀 광소자를 제작하고 광소자의 광응답 전기적 성질을 분석하여 그래핀의 광응답 특성을 얻어내고자 실험을 진행하였다. 그래핀을 채널 물질로 하고 소스, 드레인, 후면 게이트를 가지는 일반적인 그래핀 전계효과 트랜지스터(field-effect transistor)를 제작하고 채널에 빛을 비추고 비추지 않은 상태에서의 전기적 성질을 측정하고 그 때 얻어진 그래프의 광응답의 원인을 조사하였다. 이 때 얻어지는 $I_D-V_G$ 그래프가 광 조사 시 왼쪽으로 이동하게 되는데 이의 원인을 각 게이트 전압 구간별로 $I_D$-t 그래프를 획득하여 분석하였다. 또한 광원에 펄스를 인가하여 펄스 형태의 광원을 그래핀 전계효과 트랜지스터에 조사시키고 이에 따른 전기적 성질 변화를 관찰하였다 이 때 다양한 게이트 전압이 인가된 상태에서 레이저 펄스 광원에 의한 광전류를 검출하였으며 이를 분석하였다.

• Solar Energy
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• v.17 no.4
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• pp.3-11
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• 1997

Because grain boundaries in polycrystalline silicon act as potential barriers and recombination centers for the photo-generated charge carriers, these defects degrade conversion effiency of solar cell. To reduce these effects of grain boundaries, we investigated various influencing factors such as thermal treatment, various grid pattern, selective wet etching for grain boundaries, buried contact metallization along grain boundaries, grid on metallic thin film. Pretreatment above $900^{\circ}C$ in $N_2$ atmosphere, gettering by $POCl_3$ and Al treatment for back surface field contributed to obtain a high quality poly-Si. To prevent carrier losses at the grain boundaries, we carried out surface treatment using Schimmel etchant. This etchant delineated grain boundaries of $10{\mu}m$ depth as well as surface texturing effect. A metal AI diffusion into grain boundaries on rear side reduced back surface recombination effects at grain boundaries. A combination of fine grid with finger spacing of 0.4mm and buried electrode along grain boundaries improved short circuit current density of solar cell. A ultra-thin Chromium layer of 20nm with transmittance of 80% reduced series resistance. This paper focused on the grain boundary effect for terrestrial applications of solar cells with low cost, large area, and high efficiency.

• Korean Journal of Materials Research
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• v.25 no.7
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• pp.336-340
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• 2015

For rear metallization with Al paste, Al back contacts require good passivation, high reflectance, and a processing temperature window compatible with the front metal. In this paper, the effect of the firing ambient during the metallization process on the formation of Al rear metal was investigated. We chose three different gases as ambient gases during the firing process. Using SEM, we observed the formation of a back surface field in $N_2$, $O_2$, and Air ambients. To determine the effect of the ambient on Voc, the suns-Voc tool was used. In this study, we described the mechanism of burn-out of organic materials in Al paste during the firing process. The oxygen ambient plays an important role in the burn-out process. We calculated the efficiency with obtained the back surface recombination velocities using PC1D simulation. It was found that the presence of oxygen during the firing process influenced the uniform back surface field because the organic materials in the Al paste were efficiently burned out during heating. The optimized temperature with oxygen flow shows an absolute efficiency of 19.1% at PC1D simulation.

• 한국태양에너지학회:학술대회논문집
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• 2011.11a
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• pp.34-39
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• 2011

Screen printing method is a common way to fabricate the crystalline silicon solar cell with low-cost and high-efficiency. The screen printing metallization use silver paste and aluminum paste for front and rear contact, respectively. Especially the rear contact between aluminum and silicon is important to form the back surface filed (Al-BSF) after firing process. BSF plays an important role to reduces the surface recombination due to $p^+$ doping of back surface. However, Al electrode on back surface leads to bow occurring by differences in coefficient of thermal expansion of the aluminum and silicon. In this paper, we studied the properties of mono crystalline silicon solar cell for rear electrode with aluminum and aluminum-boron in order to characterize bow and BSF of each paste. The 156*156 $m^2$ p-type silicon wafers with $200{\mu}m$ thickness and 0.5-3 ${\Omega}\;cm$ resistivity were used after texturing, diffusion, and antireflection coating. The characteristics of solar cells was obtained by measuring vernier callipers, scanning electron microscope and light current-voltage. Solar cells with aluminum paste on the back surface were achieved with $V_{OC}$ = 0.618V, JSC = 35.49$mA/cm^2$, FF(Fill factor) = 78%, Efficiency = 17.13%.

• Korean Journal of Materials Research
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• v.21 no.5
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• pp.243-249
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• 2011

To reduce manufacturing costs of crystalline silicon solar cells, silicon wafers have become thinner. In relation to this, the properties of the aluminium-back surface field (Al-BSF) are considered an important factor in solar cell performance. Generally, screen-printing and a rapid thermal process (RTP) are utilized together to form the Al-BSF. This study evaluates Al-BSF formation on a (111) textured back surface compared with a (100) flat back surface with variation of ramp up rates from 18 to $89^{\circ}C$/s for the RTP annealing conditions. To make different back surface morphologies, one side texturing using a silicon nitride film and double side texturing were carried out. After aluminium screen-printing, Al-BSF formed according to the RTP annealing conditions. A metal etching process in hydrochloric acid solution was carried out to assess the quality of Al-BSF. Saturation currents were calculated by using quasi-steady-state photoconductance. The surface morphologies observed by scanning electron microscopy and a non-contacting optical profiler. Also, sheet resistances and bulk carrier concentration were measured by a 4-point probe and hall measurement system. From the results, a faster ramp up during Al-BSF formation yielded better quality than a slower ramp up process due to temperature uniformity of silicon and the aluminium surface. Also, in the Al-BSF formation process, the (111) textured back surface is significantly affected by the ramp up rates compared with the (100) flat back surface.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.689-689
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• 2013

Atomic layer deposition (ALD)에 의한 알루미늄 산화 막(Al2O3)은 고효율 결정질 실리콘 태양전지를 위한 우수한 표면 패시베이션 특성을 제공한다. 알루미늄 산화막는 고정적인 음전하를 가지고 있기 때문에 p-형 실리콘 태양 전지 후면은 전계에 의한 우수한 패시베이션 효과를 형성한다. 그러나, ALD 방식으로 증착된 알루미늄 산화막은 매우 긴 공정 시간을 필요로 하기 때문에 기존의 실리콘 태양 전지 공정에 적용하기가 어렵다. 본 논문에서는 알루미늄 산화막 형성에서 공정 시간을 줄이기 위해 Plasma assisted atomic layer deposition (PA-ALD) 방식을 적용했다. PA-ALD 기술은 trimethylaluminum (TMA)과 O2를 사용하여 기판 표면에 알루미늄 산화막을 증착하는 것으로 ALD 방식과 유사하지만, O2 플라즈마를 사용함으로써 증착 속도를 향상시킬 수 있다. 이는 좋은 패시베이션 특성을 가지는 알루미늄 산화막을 실리콘 태양전지양산 공정에 적용할 수 있는 가능성을 제시한다. PA-ALD 방식에 의한 알루미늄 산화막의 패시베이션 특성을 최적화하기 위해서 증착 후 열처리 조건에 대한 연구도 수행하였다. 막증착률이 1.1${\AA}$/cycle인 Al2O3층의 두께 변화에 따른 특성을 최적화하기 위해 공정 온도를 $250^{\circ}C$ 고정하고, 열처리 온도와 시간을 가변하였으며 유효 반송자수명을 측정하여 알루미늄 산화막의 패시베이션 특성을 확인했다.