• 제목/요약/키워드: 횡방향 열초음파 본딩

검색결과 6건 처리시간 0.03초

횡방향 열초음파 본딩 기법을 이용한 COG 접합 (Chip on Glass Interconnection using Lateral Thermosonic Bonding Technology)

  • 하창완;윤원수;박금생;김경수
    • 한국정밀공학회지
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    • 제27권7호
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    • pp.7-12
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    • 2010

  • In this paper, chip-on-glass(COG) interconnection with anisotropic conductive film(ACF) using lateral thermosonic bonding technology is considered. In general, thermo-compression bonding which is used in practice for flip-chip bonding suffers from the low productivity due to the long bonding time. It will be shown that the bonding time can be improved by using lateral thermosonic bonding in which lateral ultrasonic vibration together with thermo-compression is utilized. By measuring the internal temperature of ACF, the fast curing of ACF thanks to lateral ultrasonic vibration will be verified. Moreover, to prove the reliability of the lateral thermosonic bonding, observation of pressured mark by conductive particles, shear test, and water absorption test will be conducted.

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