• Proceedings of the Korean Society of Broadcast Engineers Conference
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• 2012.07a
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• pp.127-130
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• 2012

본 논문에서는 자유시점 또는 오토스테레오스코픽 비디오나 홀로그래픽 비디오 서비스 들을 목표로 가상시점 영상을 빠르게 생성하는 방법을 제안한다. 이 방법에서 좌/우 깊이영상이 주어졌다고 가정하고, 두 깊이 영상을 이용하여 깊이 값과 변위를 계산 한 후 깊이 당 변위증분을 계산하여 사용한다. 계산된 깊이 값 당 변위증분과 해당 픽셀의 깊이정보를 이용하여 텍스쳐 이미지를 원하는 가상 시점으로 이동시킨다. 좌영상과 우영상을 원하는 가상시점으로 각각 생성한 후, 잡음과 disocclusion을 효과적으로 제거하기 위하여 두 영상을 결합한다. 그 다음 남은 홀을 효과적인 hole-filling으로 제거하여 가상 시점 영상을 생성한다.

• Journal of the Korean Society of Manufacturing Process Engineers
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• v.20 no.5
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• pp.1-7
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• 2021

In recent years, automated process technology has allowed for the rapid manufacturing of metal parts. Maintaining high product quality is of vital importance during the production of these parts. Surface defects occurring after processing can compromise their assembly precision and performance. In this study, a deburring tool was developed that can remove burrs generated from drilling. Through the evaluation of processing, burrs were completely removed at entrance and exit surfaces. Therefore, this newly developed deburring tool shows better performance than deburring tools currently in use.

• Journal of the Korea Institute of Information and Communication Engineering
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• v.16 no.8
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• pp.1642-1652
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• 2012

Generally, a camera isn't located at the center of display in a tele-presence system and it causes an incorrect eye contact between speakers which reduce the realistic feeling during the conversation. To solve this incorrect eye contact problem, we newly propose an intermediate view reconstruction algorithm using both a color camera and a depth camera and applying for the depth image based rendering (DIBR) algorithm. In the proposed algorithm, an efficient hole filling method using the arithmetic mean value of neighbor pixels and an efficient boundary noise removal method by expanding the edge region of depth image are included. We show that the generated eye-contacted image has good quality through experiments.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• v.9 no.1
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• pp.304-308
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• 2005

본 연구는 발포수지 공정에 사용되는 가스벤트를 신발중창 금형에 자동으로 교환하는 장치에 관한 것이다. 가스벤트는 폴리우레탄과 같은 소재를 이용한 신발 미드솔 발포시 발생되는 가스를 제거하기 위한 다공질 소자로서 신발금형 상부에 삽입된다. 가스벤트는 소모성 부품으로 일정주기마다 교환이 필요하나 작업공정상 수작업에 어려움이 많아 자동화된 교환시스템이 요구된다. 하지만 삽입되는 신발중창 금형과 가스벤트간은 유격이 거의 없으므로 본 연구에서는 신발 중창 금형의 손상을 방지하고 보다 신속한 교환을 위해 가스벤트 삽입 및 추출 홈의 위치정보를 영상을 통해서 구하고, 얻어진 영상에 대한 위치 데이터를 기계적 위치 추적 시스템의 데이터로 피드백 하여 홀의 중심 위치에서 가스벤트를 삽입 및 추출하여 자동으로 교환하는 장치를 구현하였다. 영상 처리는 패턴 매칭 기법을 이용하여 홀의 중심점을 구하였고, 이를 PLC로 전송하여 기계 작동 제어 및 XY플로터를 정밀 제어하여 공정이 진행되게 하였다.

• Proceedings of the Korean Institute of Information and Commucation Sciences Conference
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• 2003.05a
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• pp.161-164
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• 2003

A study on the gray images morphing using morphology and spline interpolation is realized. The adapted method is that join the 2 broken line together with the dilation of morphology to the morphing image, remove the holes to be a soft edge at the image boundaries and extract the featuring points with the cubic spline interpolation. As a result of experiment the method elicits more smoothing image morphing in detail and speed up the interframe processing.

• Geotechnical Engineering
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• v.13 no.2
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• pp.55-64
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• 1997

Laboratory tests were performed to desorb organic contaminants spiked onto soil particles by using surfactants. Nonionic and anionic surfactants were tested as potential desorbing solvents for extracting quinoline and 2-napthol adsorbed on soil particles. Ahionisc stirfactant remediated approximately 80% and 90% of quinoline and 2-napthol respectively and appeared to be more effective than nonionic surfactant in remediating those compounds, Comparison between simple deionized water washing of the organic contaminated soil and a given surfactant technique evaluated the improvement by the application of a Burfactant to the promotion of desorption.

• Proceedings of the Korean Vacuum Society Conference
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• 2013.02a
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• pp.395-395
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• 2013

GaN는 LED, 태양전지, 그리고 전자소자 등에 쓰이는 물질로, 관련 연구가 활발히 진행되고 있으며, 이와 더불어 top-down방식을 활용한 소자제작 방법 또한 발달되고 있다. 하지만, 일반적으로 LED 제작에 사용되는 c-plane GaN의 경우, c축 방향으로 발생하는 분극의 영향을 받게되며, 분극은 LED내 양자우물의 밴드를 기울게 하여 전자와 홀의 재결합률을 감소시켜 낮은 내부양자효율을 야기한다. 이러한 문제를 해결하기 위해 여러 가지 방법들이 제시되었으며, 그 중에서도 a면, 혹은 m면과 같은 nonpolar면을 사용하는 GaN LED가 주목받고 있다. 본 연구에서는, top-down방식을 통해 약 $2{\mu}m$ 크기의 diameter를 갖는 micro-sized column LED를 구현하였으며, 식각 후 드러나는 semipolar면을 wet treatment를 통해 제거하여 nonpolar면을 드러나게 하였으며, 이 면에 Ni/Au를 contact하여, 전기적, 광학적 특성을 논하였다. Fig. 1은 I-V 특성 그래프이며, Fig. 2는 EL측정 결과(광학적 특성)이다.

• Journal of the Korean Institute of Gas
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• v.12 no.3
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• pp.64-67
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• 2008

The valve applied air pressure type of high pressure packing is developed to prolong the lifetime and to enhance the airtight. The effective valve developed enables to get remove the remaining pressure through the part of valve in handle so that a separate valve to drain is no need. The character of valve developed in this experiment is high packing of valve through special form and having drain hole in stem that enables a drainage regardless the status of vale is closed or opened.

• Journal of the Korean Institute of Telematics and Electronics D
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• v.36D no.2
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• pp.41-47
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• 1999

In this paper, we report 3D-simulations of a plasma etching process by employing cell-removal algorithm takes into account the mask shadow effect os well as spillover errors. The developed simulator haas an input interface to take not only an analytic form but a Monte Carlo distribution of the ions. The graphic user interface(GUI) was also built into the simulator for UNIX environment. To demonstrate the capability of 3D-SURFILER(SURface proFILER), we have simulated for a typical contact hole structure with 36,000($30{\times}40{\times}30$) cells, which takes about 20 minutes with 10 Mbytes memory on sun ultra sparc 1. as an exemplary case, we calculated the etch profile during the reactive ion etching(RIE) of a contact hole wherein the aspect ratio is 1.57. Furthermore, we also simulated the dependence of a damage parameter and the evolution of topography as a function of the chamber pressure and the incident ion flux.

• Journal of the Institute of Electronics Engineers of Korea SD
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• v.47 no.12
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• pp.55-67
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• 2010

The electrical properties of a back drilled via-hole (BDH) without the open-stub and the plated through via-hole (PTH) with the open-stub, which is called the conventional structure, in a high-count multi~layered (HCML) printed circuit board (PCB) were investigated for a high-speed digital system, and a selected inner layer to transmit a high-speed signal was farthest away from the side to mount the component. Within 10 GHz of the broadband frequency, a design of experiment (DOE) methodology was carried out with three cause factors of each via-hole structure, which were the distance between the via-holes, the dimensions of drilling pad and the anti-pad in the ground plane, and then the relation between cause and result factors which were the maximum return loss, the half-power frequency, and the minimum insertion loss was analyzed. Subsequently, the empirical formulae resulting in a macro model were extracted and compared with the experiment results. Even, out of the cause range, the calculated results obtained from the macro model can be also matched with the measured results within 5 % of the error.