• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1848-1852
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• 2003

Generally, burrs refer to projected parts remained on the edge after material had been processed. These burrs decrease the precision of part and cause many problems in part assembly. Burrs are undesirable projections of the material beyond the edge of the workpiece. A number of deburring processes have been developed such as barreling, brushing, chemical methods etc. But, there are a few publications in the area of applying ultrasonics to deburring. When ultrasonic vibration propagates in the liquid medium, a large number of bubbles are formed. These bubbles generate an extremely strong force, which removes burrs. Cavitations were used as a term to describe erosion of parts caused by the action of cavities in liquid. The object of this study is to analyze the effects of ultrasonic cavitation in deburring process. For this purpose, we introduce a new ultrasonic cavitation method with abrasive, which efficiently removes the burrs. Experimental parameters to verify the deburring effects of ultrasonic cavitations are ultrasonic power, amplitude, distant of the transducer from the workpiece, deburring time and abrasive. It has been shown that deburring with ultrasonic cavitation in water is effective to burrs.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 1997.10a
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• pp.969-972
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• 1997

Ultrasonic machining technology has been developed over recent years for he manufacture of cost-effective and quality-assured precision parts for several industrial application such as optics, semiconductors, aerospace, and automobile application. The past decade has seen a tremendous in the use of ceramic in structural application. The excellent thermal, chemical and wear resistance of these material can be realized because of recent improvement in the overall strength and uniformity of advanced ceramics. Ultrasonic machining, in which abrasive particles in slurry with water are presented to the work surface in the presence of an ultrasonic-vibrating tool, is process which should be of considerable interest, as its potential is not limited by he electrical or chemical characteristics of the work material, making it suitable for application to ceramics. In order to improve the currently used ultrasonic machining using ultrasonic energy, technical accumulation is needed steadily through development of exciting device of ultrasonic machine composed of piezoelectric vibrator and horn. This paper intends to further the understanding of the basic mechanism of ultrasonic machining for brittle material and ultrasonic machining of ceramics based in the fracture-mechanic concept has been analyzed.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1853-1856
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• 2003

Multi-layer printed circuit board(PCB) is being used widely for the product with relatively complex circuits such as TV, VTR and FAX. With the rapid enlargement of electronic and IT industry, the hole machining technology on multi-layer PCB is increasingly required to improve. Thus, the micro drilling with ultrasonic vibration can be a good method for hole machining. Unlike conventional drilling, ultrasonic vibration applied drilling introduces less wear and fracture of not only tool but also internal surface of workpiece due to little cutting resistance, thus, machinability can be improved. The experiment is conducted through the comparison between the results of conventional drilling and ultrasonic micro drilling as well as among each results by the variation according to not only feed rate of drill but also amplitude and frequency of ultrasonic vibration. The multi-layer PCB consists of 6 layers and ${\Phi}$0.3 diameter drill was used. As a result, it was found that the state of internal surfaces of holes on multiple layer PCBs is improved by the application of ultrasonic vibration.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.1911-1915
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• 2003

Today optical communication industry is developed; demand of optical communication part is increased. ZrO$_2$ ceramic ferrule is very significant part which determines transmission efficiency and quality of information in the optical communication part by connector of optical fibers. Being different from metal grinding, material removal through brittle fracture plays an important role in ZrO$_2$ ceramic grinding. Most of ZrO$_2$ ceramic ferrule processes are grinding which request high processing precision. Particularly, concentricity and cylindricity of inner and outer diameter are very important. The co-axle grinding process of ZrO$_2$ ceramic ferrule is to make its concentricity all of uniform before centerless grinding. Surface integrity of ZrO$_2$ ceramic ferrule is affected by grinding conditions, and equipment. In this study, surface integrity of workpiece according to such as a change of grinding wheel speed, feed rate, regulating wheel speed and grinding force is investigate to improve the concentricity and roundness of ZrO$_2$ ceramic ferrule from many experiments. Thus, if possible be finding highly efficient and quality grinding conditions.

• Journal of the Korean Society for Precision Engineering
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• v.21 no.10
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• pp.26-33
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• 2004

Ultra precision grinding technology has been developed from the refinement of the abrasive, the development of high stiffness equipment and grinding skill. The conventional wafering process which consists of lapping, etching, 1 st, 2nd and 3rd polishing has been changed to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Furthermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focuses on the flatness of the ground wafer. Generally, the ground wafer has concave pronto because of the difference of wheel path density, grinding temperature and elastic deformation of the equipment. Wafer tilting is applied to avoid non-uniform material removal. Through the geometric analysis of wafer grinding process, the profile of the ground wafer is predicted by the development of profile simulator.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2003.06a
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• pp.98-101
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• 2003

As the ultra precision grinding can be applied to wafering process by the refinement of the abrasive. the development of high stiffness equipment and grinding skill, the conventional wafering process which consists of lapping, etching, 1st, 2nd and 3rd polishing could be exchanged to the new process which consists of precision surface grinding, final polishing and post cleaning. Especially, the ultra precision grinding of wafer improves the flatness of wafer and the efficiency of production. Futhermore, it has been not only used in bare wafer grinding, but also applied to wafer back grinding and SOI wafer grinding. This paper focused on the flatness of the ground wafer. Generally, the ground wafer has concave profile because of the difference of wheel path density, grinding temperature and elastic deformation of the equiptment. Tilting mathod is applied to avoid such non-uniform material removes. So, in this paper, the geometric analysis on grinding process is carried out, and then, we can predict the profile of th ground wafer by using profile simulation.

• Journal of the Korean Society for Precision Engineering
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• v.19 no.10
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• pp.221-226
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• 2002

As environmental restriction has continuously become more strict, machining technology has emphasized on development of environment-friendly technologies. In cutting technology, it has been well recognized that cutting fluids might have undesirable effects on workers health and working environment and, hence, recently there have been numerous attempts to minimize harmful effects of cutting fluids on environments. To minimize the use of cutting fluids in machining, conventional cutting fluids have been replaced with the technologies of pressurized cold air and minimum quantity lubrication (MQL). Compared with milling, turning is continuous cutting process, where tools are continuously heated up and lack of lubricity could lead to tool wear and deteriorated surface roughness. In this work, it has been investigated how tool wear and surface roughness could be affected by cutting conditions, supply and cooling methods. The experimental results show that MQL technology is able to minimize conventional cutting fluids.

• IE interfaces
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• v.18 no.3
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• pp.221-233
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• 2005

e-Manufacturing can be referred to as a system methodology enabling the integration of manufacturing operations and IT technologies to achieve objectives of an enterprise. It is recently regarded as a powerful solution to survive in a chaotic marketplace. While conducting an e-Manufacturing project, we first needed to capture collaborative processes conducted by multiple participants in order to define functions of a system supporting them. However, pervasive process modeling techniques including IDEF3, Petri nets, and UML are not sufficient for modeling collaborative processes. Therefore, we first briefly investigate several process modeling methods including aforementioned modeling methods and ARIS focusing on the collaboration point of view. Then, we propose a new modeling method referred to as Collaborative Process Modeling (CPM) to clearly describe collaborative processes. Also, we develop and illustrate a rule for transforming collaborative process models into Marked Graph models to use the analysis power of the Petri nets. Using CPM empowers us to develop collaborative process models with simple notations, understand and facilitate the realization of the collaboration, and verify models before rushing into the development.

• Proceedings of the Korean Society of Machine Tool Engineers Conference
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• 2004.10a
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• pp.375-381
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• 2004

Recently, the evolution in production techniques (e.g. high-speed milling) and the complex shapes involved in modem production design has been increasingly popular. The key to the achievement is a drastic improvement of the dynamic behavior of the machine tool axes used in production machinery. The more complex these tool paths the higher the speed and acceleration requirements. But it is very difficult to reach the target for high speed machine tool because of the limitations of servo system and motion control system. However the direct drive design of machine tool axes, which is based on linear motors and which recently appeared on the market, is a viable candidate to meet the ever increasing demands, because of these advantages such as no backlash, less friction, more mechanical simplicity and very higher acceleration and velocity comparing to the traditional system. This paper focused on the performance tests of the high speed horizontal machine tool based on linear motor. Especially, dynamic characteristics were investigated through circular test and circular form machining test is carried out considering many important parameter. Therefore these several experiments is used to be evaluated the model for prediction of circular motion error and circular machined error.

• Transactions of the Korean Society of Machine Tool Engineers
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• v.15 no.6
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• pp.58-63
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• 2006

FIB equipment can perform sputtering and chemical vapor deposition simultaneously. It is very advantageously used to fabricate a micro structure part having 3D shape because the minimum beam size of ${\Phi}10nm$ and smaller is available. Since general FIB uses very short wavelength and extremely high energy, it can directly make a micro structure less than $1{\mu}m$. As a result, FIB has been probability in manufacturing high performance micro devices and high precision micro structures. Until now, FIB has been commonly used as a very powerful tool in the semiconductor industry. It is mainly used for mask repair, device correction, failure analysis, IC error correction, etc. In this paper FIB-Sputtering and FIB-CVD characteristic analysis were carried out according to $Ga^+$ ion beam current that is very important parameter for minimizing the pattern size and maximizing the yield. Also, for FIB-Sputtering burr caused by redeposition of the substrate characteristic analysis was carried out.