• Applied Chemistry for Engineering
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• v.24 no.2
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• pp.148-154
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• 2013

UV curable acryl resin, pressure-sensitive adhesives (PSAs), are used in many different parts in the world. In particular, PSAs has been used in the wafer manufacturing process of semiconductor industry. As wafers become much thinner, UV curable PSAs require more proper adhesion performance. In this study, acrylic PSAs containing hydroxyl groups were synthesized using monomers of 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, styrene monomer and 2-hydroxyethyl acrylate. Isocyanate modified UV curable PSAs were then prepared by the adduct reaction that facilitates the UV curing property via controlling the amount of methacryloyloxyehtyl isocyanate. The proper adhesion performance and UV curing behavior of UV curable PSAs with various hydroxyl values were studied, and experimental conditions were then optimized to raise the efficiency of wafer manufacturing process. It was found that in case of using the equivalent ratio of 1 : 1 isocyanate hardener used in the UV curable PSAs, the peel strength before the UV curing process decreased as the amount of hydroxyl groups increased in the PSAs. The peeling adhesive strength was also decreased with increasing UV dose due to high curing characteristics.