• Journal of Korea Foundry Society
• /
• v.40 no.2
• /
• pp.7-15
• /
• 2020

The high-temperature stability of Mg-8.0Zn-1.6Y (wt.%) alloys upon the addition of Ca has been investigated by characterizing the ignition temperature, microstructure, tensile and creep properties. The ignition temperature increases with an increase in the Ca content, indicating that an addition of Ca enhances the ignition resistance of the Mg-Zn-Y alloy. The as-cast microstructures of all tested alloys mainly consisted of the dendritic α-Mg matrix and I-phase (Mg₃Zn₆Y) at the grain boundaries. In the Ca-added Mg-8.0Zn-1.6Y alloys, the Ca₂Mg₆Zn₃ phase forms, with this phase fraction increasing with an increase in the Ca contents. However, a high volume fraction of the Ca₂Mg₆Zn₃ phase rather deteriorates the mechanical properties. Therefore, a moderate amount of Ca element in Mg-8.0Zn-1.6Y alloys is effective for improving the tensile and creep properties of the Mg-Zn-Y alloy. The Mg-8.0Zn-1.6Y-0.3Ca alloy exhibits the highest tensile strength and the lowest creep strain among the alloys investigated in the present study. The creep resistance of Mg-Zn-Y-Ca alloys depends on the selection of the secondary solidification phase; i.e., when Ca₂Mg₆Zn₃ forms in an alloy containing a high level of Ca, the creep resistance deteriorates because Ca₂Mg₆Zn₃ is less stable than the I-phase at a high temperature.

• Asia-Pacific Journal of Business Venturing and Entrepreneurship
• /
• v.7 no.3
• /
• pp.17-25
• /
• 2012

Wire bonding process in making semiconductor needs the most precise control and Critical To Quality(CTQ). Thus, it is regarded to be the most essential step in packaging process. In this process, pure gold wire is used to connect the chip and PCB(substrate or lead frame). However, the price of gold has been skyrocketing continuously for a long period of time and is expected to further increase in the near future. This phenomenon situates us in an unfavorable condition amidst the competitive environment. To avoid this situation, many semiconductor material making companies developed new types of wires: Au.Ag wire is one material followed by many others. This study is aimed to optimize the parameter in wire bonding with the use of 6sigma and QFD(Quality Function Deployment). 6sigma process is a good means to not only solve the problem, but to increase productivity. In order to find the key factor, we focused on VOB(Voice of Business) and VOC(Voice of Customer). The main factors from VOB, VOC are called CTQ. However, there were times when these main factors were far from offering us the correct answer, thus making the situation more difficult to handle. This study shows that QFD aids in deciding which of the accurate factors to undertake. Normally QFD is used in designing and developing products. 6sigma process is held more effective when it used with QFD.

• Transactions of the Korean Society of Mechanical Engineers
• /
• v.16 no.11
• /
• pp.1999-2010
• /
• 1992

The fixed slab analogy device which can measure stress intensity factors(S.I.F) experimentally by slab analogy theory is developed in this paper. The margin of errors resulted from the new testing apparatus are between 0.02% and 8.25%. Therefore, it is assured that this one can be effectively used for the more accurate measurement of S.I.F.( $k_{I}$, $k_{I I}$) than conventional apparatus. The pitch of master grating used in this experiment is 0.1mm It is known that the ratio of the distance from crack tip to the crack length on obtaining the accurate stress intensity factor is between 0.4 and 0.7. The optimum curvature radius of slab is about 125mm. The thickness of slab(plate) used in the fixed slab analogy device is 0.05mm(P.V.C. ; E = 64 MN/ $m^{2}$, .nu.=0.38), which is proved to be suitable for the test. The optimum material for the frame(slab`s external boundary) is a alloy tool steel(SKS 5) plate and its thickness is 1mm. In this research, the rigid cracks are directly bonded to the slab surface by cyanoacrylate adhesive for the easiness of slab making and conformity to the practical crack figure. The material of rigid crack is thin steel plate. It is expected that the developed method can be used effectively for the analysis of $k_{I}$ and $k_{I I}$ of arbitrary shaped or distributed cracks.cks.

• Journal of the Korean Society for Precision Engineering
• /
• v.30 no.3
• /
• pp.271-277
• /
• 2013

Inconel 718 super alloy was aging heat treated at the temperature range from $675^{\circ}C$ to $785^{\circ}C$ for 5~40 hours after solution annealing at $1025^{\circ}C$ for 1 hour. The aging treated specimens were investigated microstructure, mechanical properties and thermal expansion/contraction. Precipitates appeared for a long time aging treatment were niobium carbide and also ${\gamma}^{\prime}$ phase. For the aging treatment time of 10 hours, the changes in strength and hardness with increasing aging treatment temperature showed the maximum value at the temperature of $725^{\circ}C$. This maximum value is to be related with the precipitation of ${\gamma}^{\prime}$ and ${\gamma}^{{\prime}{\prime}}$ phases. The decrease in strength, elongation and hardness during long time aging at $725^{\circ}C$ were thought to be induced from the coarsening of the grain size and the transformation of ${\gamma}^{{\prime}{\prime}}$ phase to ${\gamma}^{\prime}$ phase. For the specimens treated for 10 hours, impact energy showed constant value of ~105 J with increasing the aging temperature, however this value continuously decreased with elapsing time at the aging temperature of $725^{\circ}C$. It was found that the decrease in impact value was induced from the coarsening of grain size and the carbide coarsening. The coefficient of thermal expansion of aging treated Inconel 718 alloy increased with raising test temperature, and the coefficient was appeared $11.57{\sim}12.09{\mu}m/m{\cdot}^{\circ}C$ and $14.28{\sim}14.39{\mu}m/m{\cdot}^{\circ}C$, respectively, after heating to $150^{\circ}C$ and $450^{\circ}C$.

• Transactions of the Korean Society of Mechanical Engineers A
• /
• v.41 no.9
• /
• pp.809-815
• /
• 2017

STS 304 steel is used as pressure vessel material, and although it exhibits excellent mechanical characteristics at a low temperature, it is heavier than other materials. To address this issue, a method using cold-stretching techniques for STS 304 can be applied. In this study, a cold-stretching part and welded joint specimen were directly obtained from a cold-stretching pressure vessel manufactured according to ASME code. Fatigue crack propagation tests were carried out at room temperature and $-170^{\circ}C$ using the compliance method for stress ratios of 0.1 and 0.5. The results indicate that crack growth rate of the welded joint is higher than that of the cold-stretching part within the same stress intensity factor range. The outcome of this work is expected to serve as a basis for the development of a cold-stretched STS 304 pressure vessel.

• Journal of the Microelectronics and Packaging Society
• /
• v.10 no.3
• /
• pp.29-35
• /
• 2003

The Sn-based lead-free solders with varying microstructure were prepared by changing the cooling rate from the melt. Bulky as-cast SnAg, SnAgCu, and SnCu, alloys were cold rolled and thermally stabilized before the creep tests so that there would be very small amount of microstructural change during creep (TS), and thin specimens were water quenched from the melt (WQ) to simulate microstructures of the as-reflowed solders in flip chips. Cooling rates of the WQ specimens were 140∼150 K/sec, and the resultant $\beta-Sn$ globule size was 5∼10 times smaller than that of the TS specimens. Subsequent creep tests showed that the minimum strain rate of TS specimens was about $10_2$ times higher than that of the WQ specimens. Fractographic analyses showed that creep rupture of the TS-SnAgCu specimens occurred by the nucleation of voids on the $Ag_3Sn$ Sn or $Cu_6Sn_5$ particles in the matrix, their subsequent growth by the power-law creep, and inter-linkage of microcracks to form macrocracks which led to the fast failure. On the other hand, no creep voids were found in the WQ specimens due to the mode III shear rupture coming from the thin specimens geometry.

• Journal of the Microelectronics and Packaging Society
• /
• v.24 no.1
• /
• pp.83-90
• /
• 2017

In this paper, we evaluated the solderability of thin electroless nickel-electroless palladium-immersion gold (ENEPIG) plating layer for fine-pitch package applications. Firstly, the wetting behavior, interfacial reactions, and mechanical reliability of a Sn-3.0Ag-0.5Cu (SAC305) solder alloy on a thin ENEPIG coated substrate were evaluated. In the wetting test, maximum wetting force increased with increasing immersion time, and the wetting force remained a constant value after 5 s immersion time. In the initial soldering reaction, $(Cu,Ni)_6Sn_5$ intermetallic compound (IMC) and P-rich Ni layer formed at the SAC305/ENEPIG interface. After a prolonged reaction, the P-rich Ni layer was destroyed, and $(Cu,Ni)_3Sn$ IMC formed underneath the destroyed P-rich Ni layer. In the high-speed shear test, the percentage of brittle fracture increased with increasing shear speed.

• Journal of the Institute of Electronics Engineers of Korea SD
• /
• v.44 no.2
• /
• pp.1-6
• /
• 2007

This study investigated the magnetic properties of $Ni_{80}Fe_{20}/SiO_2$ laminates with shape-induced magnetic anisotropy. The multilayer films were deposited on Si or upilex substrates, from separate $Ni_{80}Fe_{20}$ and $SiO_2$ (at %) alloy targets using a rf diode sputtering system. $Ni_{80}Fe_{20}/SiO_2$ laminates with a various number of bilayers (N) were prepared. The laminates with ellipse array patterns were prepared using photolithographic technique. The magnetic properties were measured at room temperature using a B-H hysteresisgraph and a high frequency permeameter. The several steps during domain wall reversal were observed in multilayer films, attributing to inter-magnetic layer coupling. Intrinsic uniaxial anisotropy field increases with N. The experimental values of the total anisotropy field are found to be in good agreement with the calculated values. This study utilized the shape anisotropy of the laminated film objects with small ellipse array patterns to induce a larger uniaxial anisotropy so as to maximize their operating frequency.

• Proceedings of the Korean Magnestics Society Conference
• /
• 2003.06a
• /
• pp.130-131
• /
• 2003

The magnetic and thermal properties of NiFe/IrMn/CoFe with Mn additions have been studied. As grown CoFe pinned-layers with IrMn-Mn have dominantly larger exchange biasing field( $H_{ex}$) and blocking temperature( $T_{b}$) than when pure I $r_{22}$M $n_{78}$ is used. The magnetic properties improve, $H_{ex}$ and $T_{b}$ improve with 77-78 vol% Mn, but drop considerably with more Mn additions, losing magnetic properties of theb NiFe/IrMn/CoFe with addition 0.6 vol % Mn. The average x-ray diffraction peak ratios fcc (111)CoFe of (111)IrM $n_3$ textures for the Mn inserted total vol of 75, 77, and 79 vol% were about 1.4, 0.8, and 0.6, respectively. For the sample without Mn inserted layer, the $H_{ex}$ between I $r_{22}$M $n_{78}$ and CoFe layers is almost nothing. For two multilayer as-grown samples with ultra-thin Mn layers of 77 vol % and 79 vol %, the $H_{ex}$s are 250 Oe and 150 Oe, respectively. In case of IrMn with 77.5 vol% Mn, the $H_{ex}$ was 444 Oe up to 30$0^{\circ}C$ endured of 363 Oe at 40$0^{\circ}C$, respectively. Mn additions improve the magnetic properties and thermal stabilities of NiFe/IrMn/CoFe. Those increase the $H_{ex}$ and $T_{b}$. In applications where higher $H_{ex}$ and $T_{b}$ are accept, proper concentrations of Mn can be used.n can be used.be used.

• Journal of Environmental Impact Assessment
• /
• v.24 no.6
• /
• pp.549-560
• /
• 2015

The priorities of siting restriction was derived from quantification of environmental hazard according to industrial classification based on 'Chemical Ranking and Scoring System(CRS)' which is handling the discharge characteristics of 31 industrial classifications regulated from locating at 'Industrial Complex in Rural Area(ICRA)'. CRS that is utilizing the data of 'Pollutant Release and Transfer Registers(PRTR)' is applied to determine human health risk and ecological risk which are calculated by discharged amount and materials $LC_{50}$ according to water, soil and air media based on industrial classification. From this process, exposure assessment and toxicity assessment for integrating the adverse environmental impact and the mitigation effect of environmental risk according to the development of environmental technologies into establishing the rational landuse management method for the 31 industrial classifications regulated from locating at ICRA was analyzed. From the assessment result of the siting restriction removal at ICRA for 31 industrial classifications, based on 2012 year reference 6 industries that includes Manufacture of Guilt Coloration Surface Processing Steel Materials, Manufacture of Biological Product, Manufacture of Smelting Refining and Alloys of Copper, Dyeing and Finishing of Fibers and Yarns, Manufacture of Other Basic Iron and Steel n.e.c., Rolling Drawing and Extruding of Non-ferrous Metals n.e.c. are calculated as having relatively lower environmental hazards, thus it is judged that the siting restriction mitigation at ICRA is possible for the 6 industrial classifications that are not discharging the specific hazardous water contaminants during manufacturing process.