• The Optical Journal
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• s.120
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• pp.69-73
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• 2009

본 논문에서는 레이저 가공의 문제점인 FPCB에서의 낮은 생산성과 열영향을 보완하기 위한 실험내용을 다루고 있으며 극초단펄스 레이저와 나노초 UV레이저를 이용하여 FPCB의 기반재료인 FCCL(Flexible Copper Clad Laminate)를 절단하며 생산성 및 열영향을 비교하고 있다. 나노초 레이저는 피코초 레이저 경우에 비해 가공속도가 빨라 양산공정에 적합하며 피코초 레이저는 나노초 레이저에 비해 용융물이 적게 발생하여 다층/고집적화에 적합하나 출력이 낮은 단점이 있어 현단계에서의 양산가공으로의 적용이 어렵다는 결론이다. 그러나 여러 선도 업체에서 극초단 펄스레이저의 고출력화에 대한 시도가 이뤄지고 있으므로 생산성의 문제는 빠른 시일 내에 해결될 것으로 판단된다.

• Korean Journal of Optics and Photonics
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• v.5 no.1
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• pp.90-99
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• 1994

Picosecond time-correlated single photon counting system and time-resolved luminescence spectrometer were constructed, employing a mode-locked picosecond laser, fast electronics, and microchannel plate tube. It has been shown that the instrument response function critically depends on laser pulse shape, timing jitter and walk of the electronics, and characteristics of detector and amplifier. Correcting time dispersion in the optical system, the best instrument response function obtained appears to be 25 ps, which made it possible to measure the luminescence lifetime with less than 10 ps resolution in the picosecond to microsecond range. range.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2004.05a
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• pp.8-8
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• 2004

펨토기술은 펨토초영역에서 일어나는 물리화학적 현상을 이용하여 공학적으로 이용하는 학문이다. 펨토초(femtosecond)는 시간의 단위로서 1펨토초는 1000조분의 1초($10^{-15}$)에 해당된다. 일반적으로 사람의 머리카락 두께는 약 100fm 인데 100 펨토초라고 하더라도 빛이 머리카락 두께의 1/2도 진행하지 못하는 극도의 짧은 시간에 불과하다. 이러한 펨토기술은 극초단 레이저의 발달로 가능해졌다. 1960년대 초 레이저 펄스폭을 줄일 수 있는 기술이 개발돼 나노초 시대가 열린 이후 60년대 중반에 펄스폭을 더욱 줄일 수 있는 모든 잠금기술이 개발돼 피코초 시대가 도래했다.(중략)

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.15-20
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• 2005

• Proceedings of the Korean Society of Laser Processing Conference
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• 2005.06a
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• pp.77-80
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• 2005

• Laser Solutions
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• v.8 no.2
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• pp.7-12
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• 2005

The material processing of UV nanosecond pulse laser cannot be avoided the material shape change and contamination caused by interaction of base material and laser beam. Nowadays, ultra short pulse laser shorter than nanosecond pulse duration is used to overcome this problem. The advantages of this laser are no heat transfer, no splashing material, no left material to the adjacent material. Because of these characteristics, it is so suitable for micro material processing. The processing of sapphire wafer was done by UV 355nm, green 532nm, IR 1064nm. X-Y motorized stage is installed to investigate the proper laser beam irradiation speed and cycles. Also, laser beam fluence and peak power are calculated.

• Korean Journal of Optics and Photonics
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• v.4 no.3
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• pp.347-353
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• 1993

A picosecond transient absorption kinetic spectrometer using a pump-probe method is presented and compared with other methods of picosecond transient absorption measurements. This constructed kinetic spectrometer detects the transient transmittance of sample using a lock-in amplifier as a function of delay time between pump and probe pulses generated from a picosecond mode-locked cw dye laser. Typical transient absorption and ground state bleach recovery kinetic profiles measured with this spectrometer are shown. Excellent kinetic curves of transient absorption or ground state bleach recovery may be obtained at single wavelengths with this spectrometer.

• Proceedings of the Korean Society of Precision Engineering Conference
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• 2006.05a
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• pp.653-654
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• 2006

In case of ultrashort laser ablation of metals, the transfer of energy from the electronic system causing strong absorption of laser light to the lattice needs relaxation times of the order of some picoseconds. Under the above theoretical background, nickel was ablated using femtosecond, picosecond and nanosecond laser. As a result, nickel ablation by picosecond laser and femtosecond laser, which are called ultrashort laser, has similar machinability because of relaxation time of metals, whereas nanosecond Nd:YAG laser has lower absorption, higher thermalization effect in comparison with ultrashort laser.

• Journal of the Korean Society for Precision Engineering
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• v.23 no.1 s.178
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• pp.13-22
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• 2006

• Proceedings of the Korean Society of Laser Processing Conference
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• 2006.06a
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• pp.101-107
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• 2006